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Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Weight | CAS Latency | Chip Configuration | Chip Density (bit) | Chip Package Type | Connecting Mode | Conntact Coatings | Contact Materials | Data Bus Width (bit) | ECC Support | ECCN (US) | Height from mounting surface (mm) | HTS | Lead Shape | Max. Access Time (ns) | Maximum Clock Rate (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Self Height | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Module | Module Density | Module Sides | Mounting | Name | Number of Chip Banks | Number of Chip per Module | Number of Ranks | Operating Current (mA) | Overall Dimension | Package Height | Package Length | Package Specifications | Package Width | PC Type | PCB changed | Soldering Temp (Max) | SPD EEPROM Support | Standard Package Name | Supplier Package | Supplier Temperature Grade | Typical Operating Supply Voltage (V) | Packaging | Part Status | Pin Count | Card Type | Organization | PLL | Refresh Cycles | Self Refresh | Module Type | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 TS2GKR72W6Z Transcend Information | In Stock | - | Datasheet | - | 11 | 1Gx4 | 4G | - | - | - | - | 72 | Yes | EAR99 | - | - | No Lead | - | 1600 | - | - | - | - | - | DRAM Module | 16Gbyte | - | Socket | - | - | 36 | Dual | - | - | - | - | - | - | - | 240 | - | - | DIM | RDIMM | - | - | - | Obsolete | 240 | - | 2Gx72 | - | - | - | 240RDIMM | RoHS Compliant | ||
 XKSIM-047 XKB CONNECTIVITY | In Stock | - | - | 2.247 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.8 | - | - | - | - | - | - | 1.85mm | - | - | - | - | - | - | #REF! | - | - | - | - | W26.5XD19.35XH1.8 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 8 | MiniSIM卡 | - | - | - | - | - | - | ||
 XKSMO-072-P9 XKB CONNECTIVITY | In Stock | - | - | 0 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.56 | - | - | - | - | - | - | 1.56mm | - | - | - | - | - | - | #REF! | - | - | - | - | W16.7XD15.58XH1.56 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 9 | MicroSIM卡 | - | - | - | - | - | - | ||
 XKSIM-2651-P6 XKB CONNECTIVITY | In Stock | - | - | 0 | - | - | - | - | Plug and Play | Gold plated | Phosphor Bronze | - | - | - | - | - | - | - | - | - | - | 2.65mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | - | MicroSIM卡 | - | - | - | - | - | - | ||
 XKSIM-005 XKB CONNECTIVITY | In Stock | - | - | 0 | - | - | - | - | Plug and Play | Gold plated | Copper alloys | - | - | - | 0.74 | - | - | - | - | - | - | 0.74mm | - | - | - | - | - | - | #REF! | - | - | - | - | W10.4XD8.04XH0.74 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 6 | NanoSIM卡 | - | - | - | - | - | - | ||
 XKSIM-2652-P6 XKB CONNECTIVITY | In Stock | - | - | 0 | - | - | - | - | Plug and Play | Gold plated | Phosphor Bronze | - | - | - | - | - | - | - | - | - | - | 2.65mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | - | MicroSIM卡 | - | - | - | - | - | - | ||
 XKSIM-003-P7 XKB CONNECTIVITY | In Stock | - | - | 1.023 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.5 | - | - | - | - | - | - | 1.5mm | - | - | - | - | - | - | #REF! | - | - | - | - | W17.17XD15.75XH1.5 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 7 | MicroSIM卡 | - | - | - | - | - | - | ||
 XKSD-020 XKB CONNECTIVITY | In Stock | - | - | 0 | - | - | - | - | Self-ejecting | Gold plated | Phosphor Bronze | - | - | - | - | - | - | - | - | - | - | 2.85mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | - | 标准SD卡 | - | - | - | - | - | - | ||
 XKSIM-220 XKB CONNECTIVITY | In Stock | - | - | 1.984 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.9 | - | - | - | - | - | - | 1.9mm | - | - | - | - | - | - | #REF! | - | - | - | - | W26.85XD19.20XH1.9 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 9 | MicroSIM卡 | - | - | - | - | - | - | ||
 XKSD-006 XKB CONNECTIVITY | In Stock | - | - | 2.767 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 2.82 | - | - | - | - | - | - | 2.82mm | - | - | - | - | - | - | #REF! | - | - | - | - | W29.0XD28.48XH2.82 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 11 | 标准SD卡 | - | - | - | - | - | - | ||
 M474B1G73QH0-YK000 Samsung Electronics | In Stock | - | Datasheet | - | 11 | 512Mx8 | 4G | 78FBGA | - | - | - | 72 | Yes | EAR99 | - | 8473.30.51.00 | No Lead | - | 1600 | 1.45/1.575 | 95 | - | 1.283/1.425 | 0 | DRAM Module | 8Gbyte | - | Socket | - | - | 18 | Dual | 1125 | - | 30 | 67.6 | - | 3.8(Max) | - | 204 | - | - | DIM | USODIMM | - | 1.35/1.5 | - | Obsolete | 204 | - | 1Gx72 | - | - | - | 204USODIMM | - | ||
WEDPZ512K72V-150BM Microsemi | In Stock | - | Datasheet | - | - | 512Kx36 | 18M | PBGA | - | - | - | 72 | Yes | 4A994.a | - | - | - | 3.8 | 150 | 3.465 | 125 | - | 3.135 | -55 | SRAM Module | 36Mbit | - | Surface Mount | - | - | 2 | - | 700 | - | 2.03(Max) | 23.1(Max) | - | 17.1(Max) | - | 152 | - | - | - | BGA | Military | 3.3 | - | Obsolete | 152 | - | 512Kx72 | - | - | No | - | Supplier Unconfirmed | ||
 KSM24ED8/16ME Kingston Technology | In Stock | - | Datasheet | - | 17 | 1Gx8 | 8G | FBGA | - | - | - | 72 | Yes | EAR99 | - | 8473.30.11.40 | - | - | 2400 | - | 85 | - | - | 0 | DRAM Module | 16Gbyte | - | Socket | - | - | 18 | Dual | 1530 | - | 31.25 | 133.35 | - | - | - | 288 | - | - | - | DIMM | - | 1.2 | - | Obsolete | 288 | - | 2Gx72 | - | - | - | 288DIMM | RoHS Compliant | ||
MT8HTF12864HZ-800G1 Micron Technology | In Stock | - | Datasheet | - | 6 | 128Mx8 | 1G | - | - | - | - | 64 | No | EAR99 | - | - | No Lead | - | 800 | 1.9 | 70 | - | 1.7 | 0 | DRAM Module | 1Gbyte | Double | Socket | - | 8 | 8 | Single | 1280 | - | 30.15(Max) | 67.75(Max) | - | 3.8(Max) | PC2-6400 | 200 | - | Yes | DIM | SODIMM | Commercial | 1.8 | Tray | Obsolete | 200 | - | 128Mx64 | No | 8K | Yes | 200SODIMM | Yes with exemptions | ||
M471B1G73DB0-YK0 Samsung Electronics | In Stock | - | Datasheet | - | 11 | 512Mx8 | 4G | - | - | - | - | 64 | No | EAR99 | - | - | - | - | 1600 | - | - | - | - | - | DRAM Module | 8Gbyte | - | Socket | - | - | 16 | Dual | - | - | - | - | - | - | - | 204 | - | No | - | USODIMM | - | 1.35 | - | Obsolete | 204 | - | 1Gx64 | No | - | No | 204USODIMM | RoHS Compliant | ||
 TS8D42AR00SNSI Transcend Information | In Stock | - | Datasheet | - | - | 1Gx8 | 8G | FBGA | - | - | - | 72 | Yes | 4A994.a | - | - | - | - | 2400 | 1.26 | 85 | - | 1.14 | -40 | DRAM Module | 8Gbyte | - | Socket | - | - | - | Single | 1224 | - | 30 | 69.6 | - | - | - | 260 | - | - | - | SODIMM | Industrial | 1.2 | Bulk | Obsolete | 260 | - | 1Gx72 | - | - | - | 260SODIMM | RoHS Compliant | ||
 M393A4K40CB2-CVF Samsung Electronics | 200 | - | Datasheet | - | 21 | 2Gx4 | 8G | 78FBGA | - | - | - | 72 | Yes | EAR99 | - | 8473.30.11.40 | - | 0.165 | 2933 | 1.26 | - | - | 1.14 | - | DRAM Module | 32Gbyte | Double | Socket | - | 16 | 36 | Dual | 2597 | - | 31.25 | 133.35 | - | 4.3(Max) | - | 288 | - | No | DIM | RDIMM | Extended | 1.2 | - | Active | 288 | - | 4Gx72 | No | - | Yes | 288RDIMM | - | ||
 XKSIM-114 XKB CONNECTIVITY | In Stock | - | - | 1.333 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.8 | - | - | - | - | - | - | 1.35mm | - | - | - | - | - | - | #REF! | - | - | - | - | W24.70XD22.03XH1.8 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 6 | MicroSIM卡 | - | - | - | - | - | - | ||
 XKSIM-036-B XKB CONNECTIVITY | In Stock | - | - | 0.71 | - | - | - | - | Plug and Play | Gold plated | Copper alloys | - | - | - | 2.7 | - | - | - | - | - | - | 2.7mm | - | - | - | - | - | - | #REF! | - | - | - | - | W15.6XD10.3XH2.7 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 6 | MiniSIM卡 | - | - | - | - | - | - | ||
 XKSIM-002-P6 XKB CONNECTIVITY | In Stock | - | - | 0.889 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.35 | - | - | - | - | - | - | 1.35mm | - | - | - | - | - | - | #REF! | - | - | - | - | W17.2XD15.3XH1.35 | - | - | SMD | - | - | - | 260°C | - | - | - | - | - | - | Active | 6 | MicroSIM卡 | - | - | - | - | - | - |