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  • Memory Size
  • Series
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4503 Results

Product

Inventory

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Datasheet

RoHS

Weight

Card

CAS Latency

Chip Configuration

Chip Density (bit)

Chip Density (byte)

Chip Package Type

Connecting Mode

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Data Bus Width (bit)

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ECCN (US)

Height from mounting surface (mm)

HTS

Ihs Manufacturer

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Main Category

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Manufacturer Part Number

Max. Access Time (ns)

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Minimum Operating Temperature (°C)

Module

Module Density

Module Sides

Mounting

Name

Number of Chip Banks

Number of Chip per Module

Number of Ranks

Operating Current (mA)

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Operating Supply Voltage (Min)

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Operating Temperature (Min.)

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Package Description

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Standard Package Name

Supplier Package

Supplier Temperature Grade

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Typical Operating Supply Voltage (V)

Packaging

Part Status

Reach Compliance Code

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Organization

PLL

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Capacity

Refresh Cycles

Self Refresh

Module Type

RoHS Status

XKSIM-816-P6
XKSIM-816-P6

XKB CONNECTIVITY

In Stock

-

-

5.22

-

-

-

-

-

-

Drawer type

Gold plated

Copper alloys

-

-

-

-

3.1

-

-

-

-

-

-

-

-

-

-

-

-

3.1mm

-

-

-

-

-

-

#REF!

-

-

-

-

-

-

-

-

-

-

-

W31XD25.1XH3.1

-

-

-

SMD

-

-

-

-

-

-

-

-

-

260°C

-

-

-

-

-

-

-

Active

-

6

MiniSIM卡

-

-

-

-

-

-

-

-

-

-

M393A2G40DB0-CPB20
M393A2G40DB0-CPB20

Samsung Electronics

In Stock

-

Datasheet

-

-

15

1Gx4

4G

-

FBGA

-

-

-

72

-

Yes

EAR99

-

8473.30.11.40

-

-

No Lead

-

-

-

-

-

1066

-

85

-

-

0

DRAM Module

16Gbyte

Double

Socket

-

-

36

Dual

-

-

-

-

-

-

-

-

-

-

31.25

133.35

-

-

3.9(Max)

-

PC4-2133

288

-

-

-

-

-

-

DIM

RDIMM

Commercial

-

1.2

-

Obsolete

-

288

-

-

-

2Gx72

-

-

-

-

-

288RDIMM

RoHS Compliant

TS8D30AR00SNS
TS8D30AR00SNS

Transcend Information

In Stock

-

Datasheet

-

-

-

512Mx8

4G

-

FBGA

-

-

-

64

64(b)

No

4A994.a

-

8473.30.11.40

-

-

-

DRAM Module

-

-

-

1600(MHz)

1600

1.575

85

-

1.425

0

DRAM Module

8Gbyte

-

Socket

-

-

-

Dual

880

1.575(V)

1.425(V)

1.5(V)

0C to 85C

85C

0C

Commercial

-

-

30

63.6

-

SODIMM

-

-

-

204

-

-

No

-

-

-

-

SODIMM

-

8GByte(b)

1.5

Bulk

Active

-

204

-

-

-

1Gx64

-

-

-

-

-

204SODIMM

RoHS Compliant

M393A1G40EB2-CTD
M393A1G40EB2-CTD

Samsung Electronics

25
Datasheet

-

-

19

1Gx4

4G

-

-

-

-

-

72

-

Yes

EAR99

-

-

-

-

-

-

-

-

-

-

1333

1.26

-

-

1.14

-

DRAM Module

8Gbyte

Double

Socket

-

16

18

Single

-

-

-

-

-

-

-

-

-

-

31.25

133.35

-

-

1.4 + 2.8(Max)

-

-

288

-

-

-

-

-

No

-

RDIMM

-

-

1.2

-

Active

-

288

-

-

-

1Gx72

No

-

-

-

Yes

288RDIMM

RoHS Compliant

TS512MLK64W6H
TS512MLK64W6H

Transcend Information

In Stock

-

Datasheet

-

-

11

512Mx8

4G

-

-

-

-

-

64

-

No

EAR99

-

-

-

-

No Lead

-

-

-

-

-

1600

-

-

-

-

-

DRAM Module

4Gbyte

-

Socket

-

-

8

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

240

-

-

-

-

-

-

DIM

UDIMM

-

-

-

-

Active

-

240

-

-

-

512Mx64

No

-

-

-

-

240UDIMM

RoHS Compliant

XKTF-015-N
XKTF-015-N

XKB CONNECTIVITY

In Stock

-

-

0.942

-

-

-

-

-

-

Self-ejecting

Nickel Plating

Copper alloys

-

-

-

-

2.8

-

-

-

-

-

-

-

-

-

-

-

-

2mm

-

-

-

-

-

-

#REF!

-

-

-

-

-

-

-

-

-

-

-

W14.5XD14.75XH1.81

-

-

-

SMD

-

-

-

-

-

-

-

-

-

260°C

-

-

-

-

-

-

-

Active

-

10

MicroSD卡(TF卡)

-

-

-

-

-

-

-

-

-

-

XKNANO-113
XKNANO-113

XKB CONNECTIVITY

In Stock

-

-

0.63

-

-

-

-

-

-

Self-ejecting

Gold plated

Copper alloys

-

-

-

-

1.37

-

-

-

-

-

-

-

-

-

-

-

-

1.25mm

-

-

-

-

-

-

#REF!

-

-

-

-

-

-

-

-

-

-

-

W13.72XD13.09XH1.37

-

-

-

SMD

-

-

-

-

-

-

-

-

-

260°C

-

-

-

-

-

-

-

Active

-

7

NanoSIM卡

-

-

-

-

-

-

-

-

-

-

XKSIM-011B-P8-B
XKSIM-011B-P8-B

XKB CONNECTIVITY

In Stock

-

-

1.6

-

-

-

-

-

-

Flip-lid type

Gold plated

Copper alloys

-

-

-

-

3.5

-

-

-

-

-

-

-

-

-

-

-

-

2.5mm

-

-

-

-

-

-

#REF!

-

-

-

-

-

-

-

-

-

-

-

W29.6XD17.2XH2.6

-

-

-

SMD

-

-

-

-

-

-

-

-

-

260°C

-

-

-

-

-

-

-

Active

-

9

MiniSIM卡

-

-

-

-

-

-

-

-

-

-

XKSIM-010
XKSIM-010

XKB CONNECTIVITY

In Stock

-

-

2.581

-

-

-

-

-

-

Self-ejecting

Gold plated

Copper alloys

-

-

-

-

2.25

-

-

-

-

-

-

-

-

-

-

-

-

2mm

-

-

-

-

-

-

#REF!

-

-

-

-

-

-

-

-

-

-

-

W28.05XD18.85XH2.25

-

-

-

SMD

-

-

-

-

-

-

-

-

-

260°C

-

-

-

-

-

-

-

Active

-

8

MiniSIM卡

-

-

-

-

-

-

-

-

-

-

KSM26RD4/64MER
KSM26RD4/64MER

Kingston Technology

In Stock

-

Datasheet

-

-

19

4Gx4

16G

-

FBGA

-

-

-

72

-

Yes

4A994.a

-

8473.30.11.40

-

-

-

-

-

-

-

-

2666

-

85

-

-

0

DRAM Module

64Gbyte

Double

Socket

-

-

36

Dual

2700

-

-

-

-

-

-

-

-

-

31.25

133.35

-

-

-

-

-

288

-

-

-

-

-

No

-

RDIMM

-

-

1.2

-

Active

-

288

-

-

-

8Gx72

No

-

-

-

Yes

288RDIMM

RoHS Compliant

KVR400D2S8R3/1GI
KVR400D2S8R3/1GI

Kingston Technology

In Stock

-

Datasheet

-

-

3

128Mx8

1G

-

-

-

-

-

72

-

Yes

EAR99

-

-

-

-

No Lead

-

-

-

-

-

400

1.9

-

-

1.7

-

DRAM Module

1Gbyte

Single

Socket

-

8

9

Single

-

-

-

-

-

-

-

-

-

-

30

133.35

-

-

-

-

-

240

-

-

-

-

-

No

DIM

RDIMM

-

-

1.8

-

Obsolete

-

240

-

-

-

128Mx72

No

-

-

-

-

240RDIMM

Supplier Unconfirmed

KSM26RD8L/16MEI
KSM26RD8L/16MEI

Kingston Technology

In Stock

-

Datasheet

-

-

19

1Gx8

8G

-

FBGA

-

-

-

72

-

Yes

EAR99

-

8473.30.11.40

-

-

-

-

-

-

-

-

2666

-

85

-

-

0

DRAM Module

16Gbyte

-

Socket

-

-

18

Dual

1629

-

-

-

-

-

-

-

-

-

18.75

133.35

-

-

-

-

-

288

-

-

-

-

-

-

-

RDIMM

-

-

1.2

-

Obsolete

-

288

-

-

-

2Gx72

-

-

-

-

-

288DIMM

RoHS Compliant

KSM26RD8/32MEI
KSM26RD8/32MEI

Kingston Technology

In Stock

-

Datasheet

-

-

19

2Gx8

16G

-

FBGA

-

-

-

72

-

Yes

4A994.a

-

8473.30.11.40

-

-

-

-

-

-

-

-

2666

-

85

-

-

0

DRAM Module

32Gbyte

Double

Socket

-

-

18

Dual

1656

-

-

-

-

-

-

-

-

-

31.25

133.35

-

-

-

-

-

288

-

-

-

-

-

No

-

RDIMM

-

-

1.2

-

Active

-

288

-

-

-

4Gx72

No

-

-

-

Yes

288RDIMM

RoHS Compliant

KVR16R11S8/2
KVR16R11S8/2

Kingston Technology

In Stock

-

Datasheet

-

-

11

256Mx8

2G

-

FBGA

-

-

-

72

-

Yes

EAR99

-

-

-

-

No Lead

-

-

-

-

-

1600

1.575

85

-

1.425

0

DRAM Module

2Gbyte

Double

Socket

-

8

9

Single

-

-

-

-

-

-

-

-

-

-

30

133.35

-

-

-

-

PC3-12800

240

-

-

-

-

-

No

DIM

RDIMM

-

-

1.5

-

Obsolete

-

240

-

-

-

256Mx72

Yes

-

-

-

No

240RDIMM

Supplier Unconfirmed

KVR26S19D8/16
KVR26S19D8/16

Kingston Technology

55
Datasheet

-

-

19

1Gx8

8G

-

FBGA

-

-

-

64

-

No

EAR99

-

8473.30.11.40

KINGSTON TECHNOLOGY COMPANY INC

-

-

-

Kingston Technology Company

KVR26S19D8/16

-

-

2666

-

85

-

-

0

DRAM Module

16Gbyte

Double

Socket

-

-

16

Dual

-

-

-

-

-

-

-

-

-

,

30

69.6

-

-

3.7(Max)

Contact Manufacturer

PC4-2666

260

260

-

-

5.69

-

Yes

-

SODIMM

-

-

1.2

-

Obsolete

unknown

260

-

1.2V

2666MHz

2Gx64

No

DDR DRAM MODULE

16 GB

-

Yes

260SODIMM

RoHS Compliant

SDSDM-512-K
SDSDM-512-K

Western Digital

In Stock

-

Datasheet

-

MiniSD Card

-

-

-

512M

-

-

-

-

-

-

-

EAR99

-

-

-

SD/SPI

-

-

-

-

-

-

-

3.6

85

-

2.7

-25

-

-

-

Socket

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.4

21.5

-

-

20

-

-

11

-

Yes

-

-

-

-

MiniSD

MiniSD

-

-

3.3

-

Obsolete

-

11

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

M471A1G43DB0-CPB000
M471A1G43DB0-CPB000

Samsung Electronics

In Stock

-

Datasheet

-

-

15

512Mx8

4G

-

78FBGA

-

-

-

64

-

No

EAR99

-

8473.30.11.40

-

-

-

-

-

-

-

-

2133

1.26

-

-

1.14

-

DRAM Module

8Gbyte

-

Socket

-

-

16

Dual

890

-

-

-

-

-

-

-

-

-

30

69.6

-

-

3.7(Max)

-

-

260

-

-

-

-

-

-

-

USODIMM

-

-

1.2

-

Obsolete

-

260

-

-

-

1Gx64

-

-

-

-

-

260USODIMM

RoHS Compliant

KVR13N9S6/2BK
KVR13N9S6/2BK

Kingston Technology

In Stock

-

Datasheet

-

-

9

256Mx16

4G

-

FBGA

-

-

-

64

-

No

EAR99

-

-

-

-

-

-

-

-

-

-

1333

1.575

85

-

1.425

0

DRAM Module

2Gbyte

Single

-

-

-

4

Single

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

PC3-10600

-

-

-

-

-

-

Yes

-

-

-

-

1.5

-

LTB

-

-

-

-

-

256Mx64

No

-

-

-

Yes

240DIMM

Supplier Unconfirmed

MT18VDDT25672DG-265A2
MT18VDDT25672DG-265A2

Micron Technology

In Stock

-

Datasheet

-

-

2.5

128Mx8

1G

-

-

-

-

-

72

-

Yes

EAR99

-

-

-

-

No Lead

-

-

-

0.75

-

266

2.7

70

-

2.3

0

DRAM Module

2Gbyte

Double

Socket

-

4

18

Dual

1980

-

-

-

-

-

-

-

-

-

43.31(Max)

133.5(Max)

-

-

3.18(Max)

-

PC-2100

184

-

-

-

-

-

Yes

DIM

RDIMM

Commercial

-

2.5

Tray

Obsolete

-

184

-

-

-

256Mx72

Yes

-

-

8K

Yes

184RDIMM

RoHS non-compliant

MT16KTF1G64HZ-1G6D1
MT16KTF1G64HZ-1G6D1

Micron Technology

In Stock

-

Datasheet

-

-

11

512Mx8

4G

-

-

-

-

-

64

-

No

EAR99

-

-

-

-

No Lead

-

-

-

-

-

1600

1.45

70

-

1.283

0

DRAM Module

8Gbyte

Double

Socket

-

8

16

Dual

1656

-

-

-

-

-

-

-

-

-

30.15(Max)

67.75(Max)

-

-

3.8(Max)

-

PC3-12800

204

-

-

-

-

-

Yes

DIM

SODIMM

Commercial

-

1.35

-

Obsolete

-

204

-

-

-

1Gx64

No

-

-

8K

Yes

204SODIMM

Yes with exemptions

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