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Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mount | Number of Pins | Weight | CAS Latency | Chip Configuration | Chip Density (bit) | Chip Package Type | Connecting Mode | Conntact Coatings | Contact Materials | Data Bus Width (bit) | ECC Support | ECCN (US) | Height from mounting surface (mm) | HTS | Lead Shape | Max. Access Time (ns) | Maximum Clock Rate (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Self Height | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Module | Module Density | Module Sides | Mounting | Name | Number of Elements | Number of Chip Banks | Number of Chip per Module | Number of Ranks | Operating Current (mA) | Overall Dimension | Package Height | Package Length | Package Specifications | Package Width | PC Type | PCB changed | RoHS | Soldering Temp (Max) | SPD EEPROM Support | Standard Package Name | Supplier Package | Supplier Temperature Grade | Typical Operating Supply Voltage (V) | Packaging | Part Status | Max Operating Temperature | Min Operating Temperature | Pin Count | Operating Supply Voltage | Card Type | Max Supply Voltage | Min Supply Voltage | Data Bus Width | Organization | Max Frequency | PLL | Refresh Cycles | Self Refresh | Module Type | Radiation Hardening | RoHS Status |
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 MT18KDF51272PDZ-1G6K1 TR Micron Technology | In Stock | - | Datasheet | - | - | - | 11 | 256Mx8 | 2G | - | - | - | - | 72 | Yes | EAR99 | - | 8473.30.11.40 | No Lead | - | 1600 | 1.45 | 70 | - | 1.283 | 0 | DRAM Module | 4Gbyte | Double | Socket | - | - | 8 | 18 | Dual | 981 | - | 18.9(Max) | 133.5(Max) | - | 4(Max) | PC3-12800 | 240 | - | - | Yes | DIM | RDIMM | Commercial | 1.35 | - | Active | - | - | 240 | - | - | - | - | - | 512Mx72 | - | Yes | 8K | Yes | 240RDIMM | - | Yes with exemptions | ||
 TS1GSH64V4B Transcend Information | In Stock | - | Datasheet | - | - | - | 17 | 1Gx8 | 8G | - | - | - | - | - | Yes | - | - | - | - | - | 2400 | 1.26 | 85 | - | 1.14 | 0 | DRAM Module | 8Gbyte | - | Socket | - | - | - | 8 | Single | - | - | - | - | - | - | - | 260 | - | - | Yes | - | SODIMM | - | 1.2 | - | Active | - | - | 260 | - | - | - | - | - | - | - | No | - | Yes | 260SODIMM | - | RoHS Compliant | ||
 KVR667D2N5/1G Kingston Technology | In Stock | - | Datasheet | - | - | - | 5 | 128Mx8 | 1G | FBGA | - | - | - | 64 | No | EAR99 | - | 8542.32.00.32 | No Lead | - | 667 | 1.9 | - | - | 1.7 | - | DRAM Module | 1Gbyte | Single | Socket | - | - | - | 8 | - | - | - | 18.3 | 133.35 | - | - | - | 240 | - | - | No | DIM | DIMM | - | 1.8 | - | Obsolete | - | - | 240 | - | - | - | - | - | 128Mx64 | - | No | - | No | 240DIMM | - | Yes with exemptions | ||
 M471B5674QH0-YK000 Samsung Electronics | In Stock | - | Datasheet | - | - | - | 11 | 256Mx16 | 4G | 78FBGA | - | - | - | 64 | Yes | 4A994.a | - | - | No Lead | - | 1600 | 1.45/1.575 | 95 | - | 1.283/1.425 | 0 | DRAM Module | 2Gbyte | - | Socket | - | - | - | 4 | Single | 535 | - | 30 | 67.6 | - | 2.2(Max) | - | 204 | - | - | - | DIM | USODIMM | - | 1.35/1.5 | - | Obsolete | - | - | 204 | - | - | - | - | - | 256Mx64 | - | - | - | - | 204USODIMM | - | RoHS Compliant | ||
 KSM26RD8/32MEI Kingston Technology | In Stock | - | Datasheet | - | - | - | 19 | 2Gx8 | 16G | FBGA | - | - | - | 72 | Yes | 4A994.a | - | 8473.30.11.40 | - | - | 2666 | - | 85 | - | - | 0 | DRAM Module | 32Gbyte | Double | Socket | - | - | - | 18 | Dual | 1656 | - | 31.25 | 133.35 | - | - | - | 288 | - | - | No | - | RDIMM | - | 1.2 | - | Active | - | - | 288 | - | - | - | - | - | 4Gx72 | - | No | - | Yes | 288RDIMM | - | RoHS Compliant | ||
 XKSIM-0605 XKB CONNECTIVITY | In Stock | - | - | - | - | 0.404 | - | - | - | - | Plug and Play | Gold plated | Copper alloys | - | - | - | 1.2 | - | - | - | - | - | - | 1.2mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W10.0XD7.62XH1.2 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 6 | - | NanoSIM卡 | - | - | - | - | - | - | - | - | - | - | - | ||
 XKTF-N02-G XKB CONNECTIVITY | In Stock | - | - | - | - | 0.001 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.8 | - | - | - | - | - | - | 2mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W14.5XD14.75XH1.80 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 9 | - | MicroSD卡(TF卡) | - | - | - | - | - | - | - | - | - | - | - | ||
 XKTF-005 XKB CONNECTIVITY | In Stock | - | - | - | - | 7.05 | - | - | - | - | Plug and Play | Gold plated | Brass | - | - | - | 1.8 | - | - | - | - | - | - | 1.85mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W11.5XD13.7XH1.80 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 10 | - | MicroSD卡(TF卡) | - | - | - | - | - | - | - | - | - | - | - | ||
 XKSD-001-1 XKB CONNECTIVITY | In Stock | - | - | - | - | 0 | - | - | - | - | Plug and Play | Gold plated | Copper alloys | - | - | - | 2.8 | - | - | - | - | - | - | 2.8mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W27.70XD16.5XH2.8 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 11 | - | 标准SD卡 | - | - | - | - | - | - | - | - | - | - | - | ||
 XKTF-001A XKB CONNECTIVITY | In Stock | - | - | - | - | 0.828 | - | - | - | - | Plug and Play | Gold plated | Copper alloys | - | - | - | 1.88 | - | - | - | - | - | - | 1.85mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W15.25XD14.0XH1.88 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 8 | - | MicroSD卡(TF卡) | - | - | - | - | - | - | - | - | - | - | - | ||
 XKTF-015-N XKB CONNECTIVITY | In Stock | - | - | - | - | 0.942 | - | - | - | - | Self-ejecting | Nickel Plating | Copper alloys | - | - | - | 2.8 | - | - | - | - | - | - | 2mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W14.5XD14.75XH1.81 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 10 | - | MicroSD卡(TF卡) | - | - | - | - | - | - | - | - | - | - | - | ||
 XKNANO-113 XKB CONNECTIVITY | In Stock | - | - | - | - | 0.63 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 1.37 | - | - | - | - | - | - | 1.25mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W13.72XD13.09XH1.37 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 7 | - | NanoSIM卡 | - | - | - | - | - | - | - | - | - | - | - | ||
 XKSIM-011B-P8-B XKB CONNECTIVITY | In Stock | - | - | - | - | 1.6 | - | - | - | - | Flip-lid type | Gold plated | Copper alloys | - | - | - | 3.5 | - | - | - | - | - | - | 2.5mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W29.6XD17.2XH2.6 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 9 | - | MiniSIM卡 | - | - | - | - | - | - | - | - | - | - | - | ||
 XKSIM-010 XKB CONNECTIVITY | In Stock | - | - | - | - | 2.581 | - | - | - | - | Self-ejecting | Gold plated | Copper alloys | - | - | - | 2.25 | - | - | - | - | - | - | 2mm | - | - | - | - | - | - | #REF! | - | - | - | - | - | W28.05XD18.85XH2.25 | - | - | SMD | - | - | - | - | 260°C | - | - | - | - | - | - | Active | - | - | 8 | - | MiniSIM卡 | - | - | - | - | - | - | - | - | - | - | - | ||
 KSM26RD4/64MER Kingston Technology | In Stock | - | Datasheet | - | - | - | 19 | 4Gx4 | 16G | FBGA | - | - | - | 72 | Yes | 4A994.a | - | 8473.30.11.40 | - | - | 2666 | - | 85 | - | - | 0 | DRAM Module | 64Gbyte | Double | Socket | - | - | - | 36 | Dual | 2700 | - | 31.25 | 133.35 | - | - | - | 288 | - | - | No | - | RDIMM | - | 1.2 | - | Active | - | - | 288 | - | - | - | - | - | 8Gx72 | - | No | - | Yes | 288RDIMM | - | RoHS Compliant | ||
 KVR13R9D8/4I Kingston Technology | In Stock | - | Datasheet | Socket | 240 | - | 9 | 256Mx8 | 2G | FBGA | - | - | - | 72 | Yes | EAR99 | - | - | No Lead | - | 1333 | 1.575 | 85 | - | 1.425 | 0 | DRAM Module | 4Gbyte | Double | Socket | - | 18 | 8 | 18 | Dual | - | - | 30 | 133.35 | - | - | PC3-10600 | 240 | Compliant | - | No | DIM | RDIMM | - | 1.5 | - | Obsolete | 85 °C | 0 °C | 240 | 1.5 V | - | 1.575 V | 1.425 V | 72 b | 512Mx72 | 1.333 GHz | Yes | - | No | 240RDIMM | No | Supplier Unconfirmed | ||
M471A1G43DB1-CRC000 Samsung Electronics | In Stock | - | Datasheet | - | - | - | 17 | 512Mx8 | 4G | - | - | - | - | 64 | No | 4A994.a | - | 8542.32.00.71 | - | - | 2400 | - | 95 | - | - | 0 | DRAM Module | 8Gbyte | - | Socket | - | - | - | 16 | Dual | - | - | - | - | - | - | - | 260 | - | - | - | - | SODIMM | Commercial | 1.2 | - | - | - | - | 260 | - | - | - | - | - | 1Gx64 | - | - | - | - | 204USODIMM | - | - | ||
MT4LSDT1664AG-13EG1 Micron Technology | In Stock | - | Datasheet | - | - | - | 2 | 16Mx16 | 256M | - | - | - | - | 64 | No | EAR99 | - | - | No Lead | 5.4 | 133 | 3.6 | 65 | - | 3 | 0 | DRAM Module | 128Mbyte | Single | Socket | - | - | 4 | 4 | Single | 540 | - | 25.53(Max) | 133.5(Max) | - | 3.18(Max) | PC-133 | 168 | - | - | Yes | DIM | DIMM | Commercial | 3.3 | Tray | Unconfirmed | - | - | 168 | - | - | - | - | - | 16Mx64 | - | No | 8K | Yes | 168UDIMM | - | RoHS non-compliant | ||
 KSM26SED8/16ME Kingston Technology | In Stock | - | Datasheet | - | - | - | 17 | 1Gx8 | 8G | FBGA | - | - | - | 72 | Yes | EAR99 | - | 8473.30.11.40 | - | - | 2666 | - | 85 | - | - | 0 | DRAM Module | 16Gbyte | - | Socket | - | - | - | 18 | Dual | 1629 | - | 30 | 69.6 | - | 3.7(Max) | - | 260 | - | - | - | - | SODIMM | - | 1.2 | - | Obsolete | - | - | 260 | - | - | - | - | - | 2Gx72 | - | - | - | - | 260SODIMM | - | RoHS Compliant | ||
 M393A2K43BB1-CPB Samsung Electronics | 6 |
| Datasheet | - | - | - | 15 | 1Gx8 | 8G | - | - | - | - | 72 | No | 4A994.a | - | 8473.30.11.40 | - | - | 2133 | - | 95 | - | - | 0 | DRAM Module | 16Gbyte | - | - | - | - | 16 | 18 | Dual | - | - | - | - | - | - | - | - | - | - | - | - | - | Commercial | 1.2 | - | Active | - | - | - | - | - | - | - | - | 2Gx72 | - | - | - | - | 288RDIMM | - | - |