Filters
  • Manufacturer
    • Swissbit
    • Apacer
    • Kingston
    • Advantech
    • Western Digital Corporation
    • Micron Technology
    • SanDisk
    • Samsung
    • FLEx
    • Transcend
    • TDK
    • Panasonic
    • Smart Global Holdings
    • Corsair
    • XKB Connectivity
    • Phoenix Contact
    • Greenliant
    • Viking Tech
    • Silicon Power
    • Exar Corporation
    • Analog Devices, Inc.
    • Microsemi
    • ISSI
    • Microchip
    • Adafruit
    • Kioxia
    • CIT
    • SparkFun
    • Eaton
    • Epson
    • HARTING
    • WAGO
    • E2V
    • Olimex
    • Omron
    • PNY Technologies
    • Raspberry Pi
    • Red Lion
    • Apex Tool Group
    • Parallax
    • Terasic Technologies
    • Toshiba
    • AMD
    • Bridgetek
    • DFRobot
    • Digilent
    • FTDI
    • KOA Speer
    • Philips
    • Schneider
    • Xilinx
    • ABB
    • Advanced Chemistry & Technology Inc
    • Alliance Memory
    • Atmel
    • Brady Corporation
    • Digi
    • IDEC
    • Keystone Electronics Corp
    • Maxim Integrated
    • MikroElektronika
    • Molex
    • Pi Supply
    • Rochester Electronics
    • Seeed
    • Siemens
    • TE Connectivity
    • Tripp Lite
    • Winchester
    • Xeltek
    • Yageo
  • Memory Size
  • Series
  • Part Status
  • RoHS Status
  • Memory Types
  • Operating Temperature
  • Factory Lead Time
  • Moisture Sensitivity Level (MSL)
  • Speed
  • JESD-30 Code
  • Published
  • Terminal Position

Attribute column

Categories

Memory Cards

View Mode:
4503 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Card

CAS Latency

Chip Configuration

Chip Density (bit)

Chip Density (byte)

Chip Package Type

Data Bus Width (bit)

ECC Support

ECCN (US)

HTS

Interface Type

Lead Shape

Max. Access Time (ns)

Maximum Clock Rate (MHz)

Maximum Operating Supply Voltage (V)

Maximum Operating Temperature (°C)

Memory Types

Minimum Operating Supply Voltage (V)

Minimum Operating Temperature (°C)

Module

Module Density

Module Sides

Mounting

Number of Chip Banks

Number of Chip per Module

Number of Ranks

Operating Current (mA)

Package Height

Package Length

Package Width

PC Type

PCB changed

Pins

Programmability

SPD EEPROM Support

Standard Package Name

Supplier Package

Supplier Temperature Grade

Typical Operating Supply Voltage (V)

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

Pin Count

Voltage

Memory Size

Speed

Organization

Memory Density

PLL

Capacity

Refresh Cycles

Self Refresh

Module Type

RoHS Status

KSM26ED8/16ME
KSM26ED8/16ME

Kingston Technology

In Stock

-

Datasheet

-

-

19

1Gx8

8G

-

FBGA

72

Yes

EAR99

8473.30.11.40

-

-

-

2666

-

85

-

-

0

DRAM Module

16Gbyte

-

Socket

-

18

Dual

1629

31.25

133.35

-

-

288

-

-

-

-

DIMM

-

1.2

-

-

-

Obsolete

-

288

-

-

-

2Gx72

-

-

-

-

-

288DIMM

Yes with exemptions

KVR18R13S8/4
KVR18R13S8/4

Kingston Technology

In Stock

-

Datasheet

-

-

13

512Mx8

4G

-

FBGA

72

Yes

EAR99

-

-

No Lead

-

1866

1.575

85

-

1.425

0

DRAM Module

4Gbyte

Double

Socket

-

9

Single

-

30

133.35

-

PC3-14900

240

-

-

-

DIM

RDIMM

-

1.5

-

-

-

Obsolete

-

240

-

-

-

512Mx72

-

Yes

-

-

-

240RDIMM

Supplier Unconfirmed

In Stock

-

Datasheet

-

CompactFlash

-

-

-

16G

-

-

-

EAR99

8523.59.00.00

PATA

-

-

-

3.63|5.5

85

-

2.97|4.5

-40

-

-

-

Socket

-

-

-

-

3.93

42.8

36.4

-

50

-

Yes

-

-

-

Industrial

5|3.3

-

-

-

LTB

-

50

-

-

-

-

-

-

-

-

-

-

Yes with exemptions

M393A2K43BB1-CTD6Q
M393A2K43BB1-CTD6Q

Samsung Electronics

In Stock

-

Datasheet

-

-

19

1Gx8

8G

-

FBGA

72

No

4A994.a

8542.32.00.71

-

No Lead

-

2666

-

85

-

-

0

DRAM Module

16Gbyte

-

Socket

-

18

Dual

-

31.25

133.35

3.9(Max)

-

288

-

-

-

DIM

RDIMM

Commercial

1.2

-

-

-

Active

-

288

-

-

-

2Gx72

-

-

-

-

-

288RDIMM

RoHS Compliant

M393A2G40DB1-CRC
M393A2G40DB1-CRC

Samsung Electronics

In Stock

-

Datasheet

-

-

17

1Gx4

4G

-

78FBGA

72

No

EAR99

8473.30.11.40

-

-

-

2400

1.26

-

-

1.14

-

DRAM Module

16Gbyte

-

Socket

-

36

Dual

2750

31.25

133.35

4.3(Max)

-

288

-

-

-

-

RDIMM

-

1.2

-

-

-

Obsolete

-

288

-

-

-

2Gx72

-

-

-

-

-

288RDIMM

RoHS Compliant

M393A1G43EB1-CPB
M393A1G43EB1-CPB

Samsung Electronics

22
Datasheet

-

-

15

512Mx8

4G

-

78FBGA

72

Yes

EAR99

8473.30.11.40

-

-

-

2133

1.26

-

-

1.14

-

DRAM Module

8Gbyte

Double

Socket

16

18

Dual

1293

31.25

133.35

1.4 + 2.8(Max)

-

288

-

-

No

-

RDIMM

-

1.2

-

-

-

Active

-

288

-

-

-

1Gx72

-

No

-

-

Yes

288RDIMM

-

KSM26ES8/8HD
KSM26ES8/8HD

Kingston Technology

In Stock

-

Datasheet

-

-

19

1Gx8

8G

-

FBGA

72

Yes

4A994.a

-

-

-

-

2666

-

85

-

-

0

DRAM Module

8Gbyte

Single

Socket

-

9

Single

894

31.25

133.35

-

PC4-2666

288

-

-

Yes

-

DIMM

-

1.2

-

-

-

Active

-

288

-

-

-

1Gx72

-

No

-

-

Yes

288DIMM

RoHS Compliant

MT16JTF1G64HZ-1G4D1
MT16JTF1G64HZ-1G4D1

Micron Technology

In Stock

-

Datasheet

-

-

9

512Mx8

4G

-

-

64

No

EAR99

8473.30.51.00

-

No Lead

-

1333

1.575

70

-

1.425

0

DRAM Module

8Gbyte

Double

Socket

8

16

Dual

2416

30.15(Max)

67.75(Max)

3.8(Max)

PC3-10600

204

-

-

Yes

DIM

SODIMM

Commercial

1.5

-

-

-

Obsolete

-

204

-

-

-

1Gx64

-

No

-

8K

Yes

204SODIMM

Yes with exemptions

KVR26N19S6/4
KVR26N19S6/4

Kingston Technology

68
Datasheet

-

-

19

512Mx16

8G

-

FBGA

64

No

EAR99

8473.30.11.40

-

-

-

2666

-

85

-

-

0

DRAM Module

4Gbyte

Single

Socket

-

4

Single

-

31.25

133.35

-

PC4-2666

288

288

-

Yes

-

DIMM

-

1.2

-

-

-

Active

-

288

1.2V

-

2666MHz

512Mx64

4

-

4 GB

-

Yes

288DIMM

RoHS Compliant

KVR32S22S6/4
KVR32S22S6/4

Kingston Technology

21
Datasheet

-

-

22

512Mx16

8G

-

FBGA

64

No

EAR99

-

-

-

-

3200

-

85

-

-

0

DRAM Module

4Gbyte

Single

Socket

-

4

Single

-

30

69.6

2.45(Max)

PC4-3200

260

260

-

Yes

-

SODIMM

-

1.2

-

-

-

Active

-

260

1.2V

-

3200MHz

512Mx64

-

-

4 GB

-

Yes

260SODIMM

RoHS Compliant

KVR667D2N5/1G
KVR667D2N5/1G

Kingston Technology

In Stock

-

Datasheet

-

-

5

128Mx8

1G

-

FBGA

64

No

EAR99

8542.32.00.32

-

No Lead

-

667

1.9

-

-

1.7

-

DRAM Module

1Gbyte

Single

Socket

-

8

-

-

18.3

133.35

-

-

240

-

-

No

DIM

DIMM

-

1.8

-

-

-

Obsolete

-

240

-

-

-

128Mx64

-

No

-

-

No

240DIMM

Yes with exemptions

KSM24SES8/8ME
KSM24SES8/8ME

Kingston Technology

In Stock

-

Datasheet

-

-

17

1Gx8

8G

-

FBGA

72

Yes

EAR99

-

-

-

-

2400

-

85

-

-

0

DRAM Module

8Gbyte

-

Socket

-

9

Single

1305

30

69.6

3.7(Max)

-

260

-

-

-

-

SODIMM

-

1.2

-

-

-

Obsolete

-

260

-

-

-

1Gx72

-

-

-

-

-

260SODIMM

Yes with exemptions

RP-TDUC16DA1
RP-TDUC16DA1

Panasonic Electronic Components

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SDHC™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-25°C~85°C

-

UC

Active

Not Applicable

-

-

16GB

Class 10, UHS Class 1

-

-

-

-

-

-

-

RoHS Compliant

RP-SMSC01DA1
RP-SMSC01DA1

Panasonic Electronic Components

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

microSD™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~85°C

-

SC

Active

Not Applicable

-

-

1GB

Class 6

-

-

-

-

-

-

-

RoHS Compliant

RP-TMTC25DA1
RP-TMTC25DA1

Panasonic Electronic Components

In Stock

-

Datasheet

12 Weeks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

microSDXC™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-25°C~85°C

-

TC

Active

Not Applicable

-

-

256GB

Class 10, UHS Class 1

-

-

-

-

-

-

-

RoHS Compliant

KVR1066D3S7/1G
KVR1066D3S7/1G

Kingston Technology

In Stock

-

Datasheet

-

-

7

128Mx8

1G

-

-

64

No

EAR99

-

-

No Lead

-

1066

1.575

85

-

1.425

0

DRAM Module

1Gbyte

Double

Socket

8

8

-

-

30

67.6

-

PC3-8500

204

-

-

No

DIMM

SODIMM

-

1.5

-

-

-

Obsolete

-

204

-

-

-

128Mx64

-

No

-

-

No

204SODIMM

Supplier Unconfirmed

KVR16N11H/8BK
KVR16N11H/8BK

Kingston Technology

In Stock

-

Datasheet

-

-

11

512Mx8

4G

-

FBGA

64

No

EAR99

8473.30.11.40

-

-

-

1600

1.575

85

-

1.425

0

DRAM Module

8Gbyte

Double

-

-

16

Dual

-

-

-

-

PC3-12800

-

-

-

Yes

-

-

-

1.5

-

-

-

Unconfirmed

-

-

-

-

-

1Gx64

-

No

-

-

Yes

240DIMM

Supplier Unconfirmed

KVR16LS11/4BK
KVR16LS11/4BK

Kingston Technology

In Stock

-

Datasheet

-

-

11

512Mx8

4G

-

FBGA

64

No

EAR99

8473.30.11.40

-

-

-

1600

1.45/1.575

85

-

1.28/1.425

0

DRAM Module

4Gbyte

Double

-

-

8

Single

-

-

-

-

PC3L-12800

-

-

-

Yes

-

-

-

1.35/1.5

-

-

-

Active

-

-

-

-

-

512Mx64

4

No

-

-

Yes

204SODIMM

Supplier Unconfirmed

M393A2G40DB1-CRC10
M393A2G40DB1-CRC10

Samsung Electronics

In Stock

-

Datasheet

-

-

17

1Gx4

4G

-

78FBGA

72

No

EAR99

-

-

-

-

2400

1.26

-

-

1.14

-

DRAM Module

16Gbyte

-

Socket

-

36

Dual

2750

31.25

133.35

4.3(Max)

-

288

-

-

-

-

RDIMM

-

1.2

-

-

-

Obsolete

-

288

-

-

-

2Gx72

-

-

-

-

-

288RDIMM

RoHS Compliant

MT9HTF3272AY-53EB3
MT9HTF3272AY-53EB3

Micron Technology

In Stock

-

Datasheet

-

-

4

32Mx8

256M

-

-

72

Yes

4A994.a

-

-

No Lead

0.05

533

1.9

85

-

1.7

0

DRAM Module

256Mbyte

-

Socket

-

9

Single

1440

30.5(Max)

133.5(Max)

2.7(Max)

-

240

-

-

-

DIM

UDIMM

Commercial

1.8

-

Tray

-

Obsolete

-

240

-

-

-

32Mx72

-

-

-

-

-

240UDIMM

Yes with exemptions