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Serial Device Servers

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827 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Surface Mount

Number of Terminals

Factory Pack Quantity

Ihs Manufacturer

Moisture Sensitivity Levels

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

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Package Description

Package Equivalence Code

Package Shape

Package Style

Part # Aliases

Part Life Cycle Code

Part Package Code

RoHS

Rohs Code

Supply Voltage-Nom

JESD-609 Code

Pbfree Code

Terminal Finish

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Temperature Grade

Supply Current-Max

Seated Height-Max

Telecom IC Type

Length

Width

TEA1118M/C2
TEA1118M/C2

NXP Semiconductors

In Stock

-

Datasheet

YES

16

-

NXP SEMICONDUCTORS

-

75 °C

-25 °C

PLASTIC/EPOXY

LSSOP

PLASTIC, SOT-369, SSOP-16

-

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

-

Obsolete

SOIC

-

-

2.9 V

-

-

-

8542.39.00.01

DUAL

GULL WING

-

1

0.65 mm

unknown

-

16

R-PDSO-G16

Not Qualified

COMMERCIAL EXTENDED

1.4 mA

1.5 mm

CORDLESS TELEPHONE BASEBAND CIRCUIT

5.2 mm

4.4 mm

U2786B-MFS
U2786B-MFS

Temic Semiconductors

In Stock

-

Datasheet

YES

28

-

TEMIC SEMICONDUCTORS

-

85 °C

-25 °C

PLASTIC/EPOXY

SSOP

SSO-28

SOP28,.4,32

RECTANGULAR

SMALL OUTLINE

-

Transferred

-

-

No

3 V

e0

-

Tin/Lead (Sn/Pb)

-

DUAL

GULL WING

-

1

0.8 mm

unknown

-

-

R-PDSO-G28

Not Qualified

OTHER

-

-

CORDLESS TELEPHONE SUPPORT CIRCUIT

-

-

SC14CVM480FL
SC14CVM480FL

Dialog Semiconductor GmbH

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

TA31136F(EL)
TA31136F(EL)

Toshiba America Electronic Components

In Stock

-

Datasheet

YES

16

-

TOSHIBA CORP

-

85 °C

-30 °C

PLASTIC/EPOXY

SSOP

SSOP,

-

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

-

Active

SOIC

-

-

2 V

-

-

-

8542.39.00.01

DUAL

GULL WING

-

1

1 mm

unknown

-

16

R-PDSO-G16

Not Qualified

OTHER

4.6 mA

1.9 mm

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

8.2 mm

4.6 mm

UA31136L-P16-R
UA31136L-P16-R

Unisonic Technologies Co Ltd

In Stock

-

Datasheet

YES

16

-

UNISONIC TECHNOLOGIES CO LTD

-

85 °C

-30 °C

PLASTIC/EPOXY

TSSOP

TSSOP,

-

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

-

Active

TSSOP

-

Yes

2 V

-

-

-

8542.39.00.01

DUAL

GULL WING

NOT SPECIFIED

1

0.65 mm

compliant

NOT SPECIFIED

16

R-PDSO-G16

-

OTHER

-

1.2 mm

CORDLESS TELEPHONE SUPPORT CIRCUIT

5.075 mm

4.4 mm

TA31101F(EL)
TA31101F(EL)

Toshiba America Electronic Components

In Stock

-

Datasheet

YES

16

-

TOSHIBA CORP

-

75 °C

-25 °C

PLASTIC/EPOXY

SSOP

SSOP,

-

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

-

Active

SOIC

-

No

3 V

e0

No

TIN LEAD

8542.39.00.01

DUAL

GULL WING

-

1

1 mm

unknown

-

16

R-PDSO-G16

Not Qualified

COMMERCIAL EXTENDED

5 mA

1.9 mm

CORDLESS TELEPHONE SUPPORT CIRCUIT

8.2 mm

4.6 mm

UBA1707TS
UBA1707TS

NXP Semiconductors

In Stock

-

Datasheet

YES

28

-

NXP SEMICONDUCTORS

-

75 °C

-25 °C

PLASTIC/EPOXY

SSOP

SSOP, SSOP28,.3

SSOP28,.3

RECTANGULAR

SMALL OUTLINE

-

Obsolete

SSOP

-

-

3.3 V

-

-

-

8542.39.00.01

DUAL

GULL WING

-

1

0.65 mm

compliant

-

28

R-PDSO-G28

Not Qualified

COMMERCIAL EXTENDED

3.2 mA

2 mm

CORDLESS TELEPHONE SUPPORT CIRCUIT

10.2 mm

5.3 mm

KS8804B
KS8804B

Samsung Semiconductor

In Stock

-

Datasheet

YES

16

-

SAMSUNG SEMICONDUCTOR INC

-

75 °C

-30 °C

PLASTIC/EPOXY

SOP

SOP, DIP16,.3

DIP16,.3

RECTANGULAR

SMALL OUTLINE

-

Obsolete

-

-

No

5 V

e0

No

TIN LEAD

8542.39.00.01

DUAL

GULL WING

-

1

2.54 mm

compliant

-

-

R-PDSO-G16

Not Qualified

COMMERCIAL EXTENDED

0.007 mA

-

CORDLESS TELEPHONE SUPPORT CIRCUIT

-

-

SC14408B80VD
SC14408B80VD

Texas Instruments

In Stock

-

Datasheet

YES

80

-

NATIONAL SEMICONDUCTOR CORP

-

-

-

PLASTIC/EPOXY

QFP

QFP, QFP80,.68SQ

QFP80,.68SQ

SQUARE

FLATPACK

-

Obsolete

-

-

No

-

e0

-

TIN LEAD

8542.39.00.01

QUAD

GULL WING

-

1

0.65 mm

unknown

-

-

S-PQFP-G80

Not Qualified

-

-

2.35 mm

CORDLESS TELEPHONE BASEBAND CIRCUIT

14 mm

14 mm

SC14408B80VD
SC14408B80VD

National Semiconductor Corporation

In Stock

-

Datasheet

YES

80

-

NATIONAL SEMICONDUCTOR CORP

-

-

-

PLASTIC/EPOXY

QFP

QFP, QFP80,.68SQ

QFP80,.68SQ

SQUARE

FLATPACK

-

Obsolete

-

-

No

-

e0

-

TIN LEAD

8542.39.00.01

QUAD

GULL WING

-

1

0.65 mm

unknown

-

-

S-PQFP-G80

Not Qualified

-

-

2.35 mm

CORDLESS TELEPHONE BASEBAND CIRCUIT

14 mm

14 mm

TA4500F
TA4500F

Toshiba America Electronic Components

In Stock

-

Datasheet

YES

16

-

TOSHIBA CORP

-

85 °C

-40 °C

PLASTIC/EPOXY

QFF

-

-

SQUARE

FLATPACK

-

Active

QFP

-

Yes

3 V

-

-

-

-

QUAD

FLAT

-

1

0.4 mm

unknown

-

16

S-PQFP-F16

Not Qualified

INDUSTRIAL

-

0.6 mm

RF AND BASEBAND CIRCUIT

2.1 mm

2.1 mm

SC14CVM2.4R6C2N
SC14CVM2.4R6C2N

Sitel Semiconductor BV

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

PCD5042H
PCD5042H

NXP Semiconductors

In Stock

-

Datasheet

YES

64

-

NXP SEMICONDUCTORS

-

70 °C

-25 °C

PLASTIC/EPOXY

QFP

QFP, QFP64,.7X.95,40

QFP64,.7X.95,40

RECTANGULAR

FLATPACK

-

Obsolete

-

-

No

3 V

-

-

-

8542.39.00.01

QUAD

GULL WING

-

1

1 mm

unknown

-

-

R-PQFP-G64

Not Qualified

OTHER

12 mA

3.2 mm

CORDLESS TELEPHONE BURST MODE CONTROLLER

20 mm

14 mm

TA31092F
TA31092F

Toshiba America Electronic Components

In Stock

-

Datasheet

YES

10

-

TOSHIBA CORP

-

70 °C

-20 °C

PLASTIC/EPOXY

SSOP

SSOP,

-

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

-

Active

SSOP

-

No

2 V

e0

No

TIN LEAD

8542.39.00.01

DUAL

GULL WING

-

1

1 mm

unknown

-

10

R-PDSO-G10

Not Qualified

COMMERCIAL

1.4 mA

1.9 mm

CORDLESS TELEPHONE SUPPORT CIRCUIT

5.2 mm

4.4 mm

LMX4168FLQ
LMX4168FLQ

Texas Instruments

In Stock

-

Datasheet

YES

44

-

NATIONAL SEMICONDUCTOR CORP

2

60 °C

-10 °C

UNSPECIFIED

HVQCCN

HVQCCN,

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

-

Obsolete

QFN

-

No

2.5 V

e0

No

TIN LEAD

8542.39.00.01

QUAD

NO LEAD

235

1

0.5 mm

compliant

-

44

S-XQCC-N44

Not Qualified

COMMERCIAL

-

0.8 mm

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

7 mm

7 mm

LMX4168FLQ
LMX4168FLQ

National Semiconductor Corporation

In Stock

-

Datasheet

YES

44

-

NATIONAL SEMICONDUCTOR CORP

2

60 °C

-10 °C

UNSPECIFIED

HVQCCN

HVQCCN,

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

-

Obsolete

-

-

No

2.5 V

e0

No

TIN LEAD

8542.39.00.01

QUAD

NO LEAD

235

1

0.5 mm

not_compliant

-

-

S-XQCC-N44

Not Qualified

COMMERCIAL

-

0.8 mm

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

7 mm

7 mm

SM5130AS
SM5130AS

Seiko NPC Corporation

In Stock

-

Datasheet

YES

16

-

SEIKO NPC CORP

-

80 °C

-30 °C

PLASTIC/EPOXY

SOP

SOP, SOP16,.3

SOP16,.3

RECTANGULAR

SMALL OUTLINE

-

Obsolete

-

-

No

3 V

-

-

-

8542.39.00.01

DUAL

GULL WING

-

1

1.27 mm

unknown

-

-

R-PDSO-G16

Not Qualified

COMMERCIAL EXTENDED

7 mA

-

CORDLESS TELEPHONE SUPPORT CIRCUIT

-

-

SM5130AS
SM5130AS

Nippon Precision Circuits Inc

In Stock

-

Datasheet

YES

16

-

NIPPON PRECISION CIRCUITS INC

-

80 °C

-30 °C

PLASTIC/EPOXY

SOP

SOP, SOP16,.3

SOP16,.3

RECTANGULAR

SMALL OUTLINE

-

Transferred

-

-

No

-

e0

-

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

GULL WING

-

-

1.27 mm

unknown

-

-

R-PDSO-G16

Not Qualified

COMMERCIAL EXTENDED

-

-

-

-

-

S9232WK1HAC
S9232WK1HAC

Intel

In Stock

-

-

-

-

1

-

-

-

-

-

-

-

-

-

-

999MVJ

-

-

Details

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCB2208WFAF7R
MCB2208WFAF7R

Intel

In Stock

-

-

-

-

1

-

-

-

-

-

-

-

-

-

-

999GKV

-

-

Details

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

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