- Manufacturer
- Packaging
- Part Status
- RoHS Status
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- B25/85
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Resistance Tolerance
- Resistance in Ω @ 25°C
- Series
- B25/50
Attribute column
Categories
Temperature Sensors - NTC Thermistors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Package / Case | B Tolerance | Beta Value | Brand | CoilResistance | Contact Materials | Data RAM Size | Data RAM Type | Factory Pack QuantityFactory Pack Quantity | Interface Type | Manufacturer | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Part # Aliases | Processor Series | RoHS | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Tradename | Unit Weight | Voltage, Rating | Packaging | Series | Tolerance | Type | Resistance | Number of Positions | Number of Rows | Subcategory | Power Rating | Technology | Current Rating | Termination Style | Operating Frequency | Lead Spacing | Lead Diameter | Program Memory Type | Program Memory Size | Output Power | Contact Current Rating | Data Bus Width | Contact Termination | Contact Form | Product Type | Coil Voltage | Coil Type | Coil Current | Power Consumption | Sensitivity | Number of Timers | Product | Mounting Angle | Product Category | IP Rating | Diameter | Height | Length | Width | Flammability Rating |
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 NRL1154F4150B1F Cooper Bussmann | In Stock | - | - | QFN-32 | 1 % | B25/50 | Silicon Labs | - | - | 64 kB | RAM | 490 | I2C, USART | Silicon Laboratories | 80 MHz | 2 Mbps | + 125 C | - 40 C | Yes | SMD/SMT | 20 I/O | - | EFR32MG21 | Details | 8.8 mA | 33.8 mA | 3.8 V | 1.71 V | - | 0.000035 oz | - | Tray | NRLx | 1 % | Bluetooth, Zigbee | 15 kOhms | - | - | Wireless & RF Integrated Circuits | - | Si | - | Wire Lead | 2.4 GHz | - | - | Flash | 512 kB | 20 dBm | - | 32 bit | - | - | RF System on a Chip - SoC | - | - | - | - | - 94.4 dBm | 3 Timer | - | - | RF System on a Chip - SoC | - | - | - | 4 mm | 4 mm | - | ||
NRBG353F3435B2F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/85 | Amphenol Technical Products | - | - | - | - | 30 | - | Amphenol | - | - | + 125 C | - 40 C | - | Cable | - | - | - | Details | - | - | - | - | PowerLok | 0.000035 oz | 1 kV | Bulk | 300 | 1 % | NTC | 3.485 kOhms | 3 Position | 1 Row | Power Connectors | - | - | 150 A | Crimp | - | - | 0.3 mm | - | - | - | - | - | - | - | Heavy Duty Power Connectors | - | - | - | - | - | - | Connectors | Right Angle | Heavy Duty Power Connectors | IP67 | - | - | 5 mm | 1.9 mm | UL 94 V-0 | ||
NRBE10423380B1F Cooper Bussmann | In Stock | - | - | QFN-32 | 1 % | B25/50 | Silicon Labs | - | - | 96 kB | RAM | 2500 | I2C, USART | Silicon Laboratories | 80 MHz | 2 Mbps | + 125 C | - 40 C | Yes | SMD/SMT | 20 I/O | - | EFR32BG21 | Details | 8.8 mA | 33.8 mA | 3.8 V | 1.71 V | - | 0.000035 oz | - | MouseReel | NRBE | - | Bluetooth | 10 kOhms | - | - | Wireless & RF Integrated Circuits | - | Si | - | Wire Lead | 2.4 GHz | 3 mm | 0.38 mm | Flash | 1 MB | 10 dBm | - | 32 bit | - | - | RF System on a Chip - SoC | - | - | - | - | - 94.4 dBm | 3 Timer | - | - | RF System on a Chip - SoC | - | - | - | 4 mm | 4 mm | - | ||
NRL2203J4250B2F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/85 | Amphenol Technical Products | - | - | - | - | 60 | - | Amphenol | - | - | + 125 C | - 40 C | - | Off Board | - | AC-HA001111 | - | Details | - | - | - | - | PowerLok | 0.000035 oz | - | Bulk | 300 | 5 % | NTC | 2.208 kOhms | - | - | Power Connectors | - | - | - | Crimp | - | - | - | - | - | - | - | - | - | - | Heavy Duty Power Connectors | - | - | - | - | - | - | - | - | Heavy Duty Power Connectors | - | - | - | 7 mm | 3 mm | - | ||
NRL2503J3950B1F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/50 | TE Connectivity / AMP | 220 Ohms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 5 % | NTC | 5 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | - | - | - | - | 2 A | - | Solder Pin | DPDT (2 Form C) | PCB Relays | 12 VDC | Non-Latching | - | 650 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | 3 mm | - | ||
NRL2503J3950B1J Cooper Bussmann | In Stock | - | - | - | 5 % | B25/50 | TE Connectivity / AMP | - | - | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Off Board | - | - | - | Details | - | - | - | - | - | 0.000035 oz | - | Bulk | NRLx | 5 % | NTC | 5 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | - | - | - | - | - | - | - | - | PCB Relays | - | - | - | - | - | - | - | - | Low Signal Relays - PCB | - | - | - | 7 mm | 3 mm | - | ||
NRL2105F4150B1F Cooper Bussmann | In Stock | - | - | QFN-32 | 1 % | B25/50 | Silicon Labs | - | - | 96 kB | RAM | 2500 | I2C, USART | Silicon Laboratories | 80 MHz | 2 Mbps | + 125 C | - 40 C | Yes | SMD/SMT | 20 I/O | - | EFR32MG21 | Details | 8.8 mA | 33.8 mA | 3.8 V | 1.71 V | - | 0.000035 oz | - | Cut Tape | NRLx | 1 % | Bluetooth, Zigbee | 100 kOhms | - | - | Wireless & RF Integrated Circuits | - | Si | - | Wire Lead | 2.4 GHz | - | - | Flash | 1 MB | 20 dBm | - | 32 bit | - | - | RF System on a Chip - SoC | - | - | - | - | - 94.4 dBm | 3 Timer | - | - | RF System on a Chip - SoC | - | - | - | 4 mm | 4 mm | - | ||
NRMR503J3950B1F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/50 | TE Connectivity / AMP | 325 Ohms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 5 % | NTC | 5 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | 0.38 mm | - | - | - | 2 A | - | Solder Pin | DPDT (2 Form C) | PCB Relays | 15 VDC | Non-Latching | 46.1 mA | 700 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | 2.3 mm | - | ||
NRMF10523950B1F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/50 | TE Connectivity / AMP | 220 Ohms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 0.2 % | NTC | 100 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | 0.38 mm | - | - | - | 5 A | - | Solder Pin | SPST (1 Form A), SPST (1 Form B) | PCB Relays | 12 VDC | Non-Latching | - | 650 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | - | - | ||
NRL2105F3950B1F Cooper Bussmann | In Stock | - | - | QFN-32 | 1 % | B25/50 | Silicon Labs | - | - | 64 kB | RAM | 490 | I2C, USART | Silicon Laboratories | 80 MHz | 2 Mbps | + 125 C | - 40 C | Yes | SMD/SMT | 20 I/O | - | EFR32BG21 | Details | 8.8 mA | 33.8 mA | 3.8 V | 1.71 V | - | 0.000035 oz | - | Tray | NRLx | 1 % | Bluetooth | 100 kOhms | - | - | Wireless & RF Integrated Circuits | 1.8 mW | Si | - | Wire Lead | 2.4 GHz | - | - | Flash | 768 kB | 10 dBm | - | 32 bit | - | - | RF System on a Chip - SoC | - | - | - | - | - 94.4 dBm | 3 Timer | - | - | RF System on a Chip - SoC | - | 4 mm | 8 mm | 4 mm | 4 mm | - | ||
NRL3234J4200B1J Cooper Bussmann | In Stock | - | - | - | 5 % | B25/50 | TE Connectivity / AMP | 890 Ohms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Socket | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 5 % | NTC | 23 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | - | - | - | - | 5 A | - | Plug Pin | SPST (1 Form A), SPST (1 Form B) | PCB Relays | 24 VDC | Non-Latching | 27 mA | 650 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | 3 mm | - | ||
NRMR50323470B1F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/50 | TE Connectivity / AMP | 20.9 kOhms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 0.2 % | NTC | 5 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | 0.38 mm | - | - | - | 5 A | - | Solder Pin | DPDT (2 Form C) | PCB Relays | 125 VDC | Non-Latching | - | 750 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | 2.3 mm | - | ||
NRL2105J3950B1J Cooper Bussmann | In Stock | - | - | - | 5 % | B25/50 | TE Connectivity / AMP | 7.6 kOhms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 5 % | NTC | 100 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | - | - | - | - | 200 mA | - | Solder Pin | SPST (1 Form A), SPST (1 Form B) | PCB Relays | 72 VDC | Non-Latching | - | 700 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | 3 mm | - | ||
NRL2303J3950B1F Cooper Bussmann | In Stock | - | - | QFN-32 | 1 % | B25/50 | Silicon Labs | - | - | 64 kB | RAM | 490 | I2C, USART | Silicon Laboratories | 80 MHz | 2 Mbps | + 125 C | - 40 C | Yes | SMD/SMT | 20 I/O | - | EFR32MG21 | Details | 8.8 mA | 33.8 mA | 3.8 V | 1.71 V | - | 0.000035 oz | - | Tray | NRLx | 5 % | Bluetooth, Zigbee | 3 kOhms | - | - | Wireless & RF Integrated Circuits | - | Si | - | Wire Lead | 2.4 GHz | - | - | Flash | 768 kB | 10 dBm | - | 32 bit | - | - | RF System on a Chip - SoC | - | - | - | - | - 94.4 dBm | 3 Timer | - | - | RF System on a Chip - SoC | - | - | - | 4 mm | 4 mm | - | ||
NRBG353F3435B2J Cooper Bussmann | In Stock | - | - | - | 5 % | B25/85 | TE Connectivity / AMP | 7.6 kOhms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 300 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 1 % | NTC | 3.485 kOhms | - | - | Relays | - | - | - | Radial | - | - | 0.3 mm | - | - | - | 200 mA | - | Solder Pin | SPST (1 Form A), SPST (1 Form B) | PCB Relays | 72 VDC | Non-Latching | - | 700 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 5 mm | 1.9 mm | - | ||
NRL3353J3435B2F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/85 | TE Connectivity / AMP | 530 Ohms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Socket | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 5 % | NTC | 3.4513 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | - | - | - | - | 5 A | - | Plug Pin | SPST (1 Form A), SPST (1 Form B) | PCB Relays | 20 VDC | Non-Latching | 36.3 mA | 750 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | 3 mm | - | ||
NRMF353J3435B2F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/85 | TE Connectivity / AMP | 325 Ohms | Silver (Ag) with Gold Plating | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | V23154/Cradle Relay N | 5 % | NTC | 3.4513 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | 0.38 mm | - | - | - | 5 A | - | Solder Pin | DPST (2 Form A) | PCB Relays | 14.5 VDC | Non-Latching | - | 700 mW | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | - | - | ||
NRMF503F3300B2J Cooper Bussmann | In Stock | - | - | - | 5 % | B25/85 | TE Connectivity / AMP | - | - | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | NRMx | 1 % | NTC | 5 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | 0.38 mm | - | - | - | - | - | Solder Pin | DPDT (2 Form C) | PCB Relays | - | Non-Latching | - | - | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | - | - | ||
NRMF503F3470B1J Cooper Bussmann | In Stock | - | - | - | 5 % | B25/50 | TE Connectivity / AMP | - | - | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Off Board | - | - | - | Details | - | - | - | - | - | 0.705479 oz | - | Bulk | NRMx | 1 % | NTC | 5 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | 0.38 mm | - | - | - | - | - | - | - | PCB Relays | - | Non-Latching | - | - | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | - | - | ||
NRMF303J3950B1F Cooper Bussmann | In Stock | - | - | - | 1 % | B25/50 | TE Connectivity / AMP | - | - | - | - | 5 | - | TE Connectivity | - | - | + 125 C | - 40 C | - | Through Hole | - | - | - | Details | - | - | - | - | - | 0.000035 oz | - | Bulk | NRMx | 5 % | NTC | 3 kOhms | - | - | Relays | - | - | - | Wire Lead | - | - | 0.38 mm | - | - | - | - | - | Solder Pin | DPDT (2 Form C) | PCB Relays | - | Non-Latching | - | - | - | - | Communications Relays | - | Low Signal Relays - PCB | - | - | - | 7 mm | - | - |