- Contact Finish - Post
- Contact Finish Mating
- Contact Finish Thickness - Mating
- Contact Finish Thickness - Post
- Contact Material - Mating
- Contact Material - Post
- Contact Materials
- Contact Plating
- Convert From (Adapter End)
- Convert To (Adapter End)
- Current Rating (Amps)
- Housing Material
Attribute column
Manufacturer
3M Sockets for ICs, Transistors - Adapters
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Number of Pins | Housing Material | Weight | Body Material | Contact Material - Mating | Contact Material - Post | Contact Finish Mating | Contact Materials | Voltage Rated | Operating Temperature | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Number of Positions | Max Operating Temperature | Min Operating Temperature | Gender | Current Rating (Amps) | Pitch | Orientation | Depth | Current Rating | Pitch - Mating | Number of Contacts | Contact Finish - Post | Insulation Resistance | Row Spacing | Termination Post Length | Pitch - Post | Convert From (Adapter End) | Convert To (Adapter End) | Features | Height | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | RoHS Status | Flammability Rating | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 32 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Solder | - | 32 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 32 | Gold | 1GOhm | - | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Wire | Through Hole | 28 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 28 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 28 | Gold | - | - | - | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | - | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 64 | Polysulfone (PSU), Glass Filled | - | Glass, Polysulfone | Beryllium Copper | Beryllium Copper | Gold | Copper | 1kV | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 64 | 150°C | -55°C | Female | 1A | 1.78mm | Straight | 6.9mm | 1A | 0.070 1.78mm | 64 | Gold | - | 20.32 mm | 0.130 3.30mm | 0.070 1.78mm | DIP, 0.8 (20.32mm) Row Spacing | DIP, 0.8 (20.32mm) Row Spacing | Closed Frame | - | 72.5mm | 38.5mm | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 16 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | DIP, Socket | 16 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 16 | Gold | - | 7.62 mm | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 40 | Polysulfone (PSU), Glass Filled | - | Glass, Polysulfone | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 40 | 150°C | -55°C | Female | 1A | 2.54mm | Straight | - | 1A | 0.100 2.54mm | 40 | Gold | - | 25.4 mm | 0.130 3.30mm | 0.100 2.54mm | DIP, 1.0 (25.40mm) Row Spacing | DIP, 1.0 (25.40mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 64 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Solder | - | 64 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.070 1.78mm | 64 | Gold | - | - | 0.130 3.30mm | 0.070 1.78mm | DIP, 0.8 (20.32mm) Row Spacing | DIP, 0.8 (20.32mm) Row Spacing | Closed Frame | 6.9mm | 72.5mm | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 64 | Polysulfone (PSU), Glass Filled | - | Glass, Polysulfone | Beryllium Copper | Beryllium Copper | Gold | Copper | 1kV | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 64 | 150°C | -55°C | Female | 1A | 2.54mm | Straight | 6.9mm | 1A | 0.070 1.78mm | 64 | Gold | - | 22.86 mm | 0.130 3.30mm | 0.070 1.78mm | DIP, 0.9 (22.86mm) Row Spacing | DIP, 0.9 (22.86mm) Row Spacing | - | - | 100.3mm | 43.2mm | 30.0μin 0.76μm | 300.0μin 7.62μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 20 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 20 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 20 | Gold | - | - | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 90 | Polysulfone (PSU), Glass Filled | 680.388555g | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Solder | - | 90 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.070 1.78mm | 90 | Gold | 1GOhm | - | 0.130 3.30mm | 0.070 1.78mm | DIP, 0.9 (22.86mm) Row Spacing | DIP, 0.9 (22.86mm) Row Spacing | Closed Frame | 6.9mm | 95.7mm | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 40 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 40 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 40 | Gold | - | - | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 14 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 14 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 14 | Gold | - | - | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | - | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole, Wire | Through Hole | 64 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Wire Wrap | - | 64 | 150°C | -55°C | - | 1A | 2.54mm | - | 43.2mm | 1A | 0.100 2.54mm | 64 | Gold | 1GOhm | - | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.9 (22.86mm) Row Spacing | DIP, 0.9 (22.86mm) Row Spacing | - | - | 100.3mm | 6.9mm | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 22 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 22 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | - | 0.100 2.54mm | 22 | Gold | - | - | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.4 (10.16mm) Row Spacing | DIP, 0.4 (10.16mm) Row Spacing | - | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | - | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Wire | Through Hole | 22 | Polysulfone (PSU), Glass Filled | 453.59237g | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Wire Wrap | - | 22 | 150°C | -55°C | - | 1A | 2.54mm | - | - | - | 0.100 2.54mm | 22 | Gold | - | - | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.4 (10.16mm) Row Spacing | DIP, 0.4 (10.16mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | - | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 90 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Solder | - | 90 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.070 1.78mm | 90 | Gold | 1GOhm | - | 0.130 3.30mm | 0.070 1.78mm | DIP, 0.9 (22.86mm) Row Spacing | DIP, 0.9 (22.86mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Wire | Through Hole | 48 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Wire Wrap | - | 48 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 48 | Gold | - | - | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Wire | Through Hole | 48 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2009 | Textool™ | Active | 1 (Unlimited) | Wire Wrap | - | 48 | 150°C | -55°C | Female | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 48 | Gold | 1GOhm | - | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | Closed Frame | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 24 | Polysulfone (PSU), Glass Filled | 453.59237g | Glass, Polysulfone | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | - | 24 | 150°C | -55°C | Female | 1A | 2.54mm | Straight | 6.9mm | 1A | 0.100 2.54mm | 24 | Gold | - | 15.24 mm | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | - | - | 45mm | 32mm | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole, Wire | Through Hole | 24 | Polysulfone (PSU), Glass Filled | 453.59237g | Glass, Polysulfone | Beryllium Copper | Beryllium Copper | Gold | Copper | 1kV | -55°C~125°C | 2001 | Textool™ | Active | 1 (Unlimited) | Wire Wrap | - | 24 | 150°C | -55°C | Female | 1A | 2.54mm | Straight | 6.9mm | 1A | 0.100 2.54mm | 24 | Gold | - | 15.24 mm | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | Closed Frame | - | 45mm | 32mm | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free | ||
| Tiny WHSL | In Stock | - | Datasheet | 8 Weeks | Gold | Through Hole | Through Hole | 28 | Polysulfone (PSU), Glass Filled | - | - | Beryllium Copper | Beryllium Copper | Gold | Copper | - | -55°C~125°C | 2011 | Textool™ | Active | 1 (Unlimited) | Solder | - | 28 | 150°C | -55°C | - | 1A | 2.54mm | - | - | 1A | 0.100 2.54mm | 28 | Gold | - | - | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | - | - | - | - | 30.0μin 0.76μm | 30.0μin 0.76μm | UL94 V-0 | RoHS Compliant | UL94 V-0 | Lead Free |
