- Base Part Number
- Moisture Sensitivity Level (MSL)
- Mount
- Mounting Type
- Nominal Supply Current
- Package / Case
- Packaging
- Part Status
- RoHS Status
- Series
- Voltage - Supply
- Published
Attribute column
Manufacturer
Cypress Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Number of Pins | Supplier Device Package | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Function | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Number of Channels | Interface | Number of Circuits | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Nominal Supply Current | Max Supply Current | Current - Supply | Data Rate | Max Frequency | Telecom IC Type | Number of Transceivers | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 CYP15G0101DXB-BBC Cypress Semiconductor Corp | 375 | - | Datasheet | - | Surface Mount | Surface Mount | 100-LBGA | 100 | - | 0°C~70°C | Tray | 2004 | HOTlink II™ | e0 | - | Obsolete | 3 (168 Hours) | 100 | - | Tin/Lead (Sn/Pb) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 225 | - | 3.3V | - | not_compliant | NOT SPECIFIED | CY*15G01 | - | Transceiver | Not Qualified | 3.3V | - | - | 1 | LVTTL | - | - | - | - | 500mA | - | 390mA | - | - | TELECOM CIRCUIT | 1 | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 CYP15G0403DXB-BGXC Cypress Semiconductor Corp | 35 | - | Datasheet | 15 Weeks | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | yes | Active | 3 (168 Hours) | 256 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | 1.27mm | - | 30 | CY*15G04 | - | Transceiver | - | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.27A | - | 900mA | 1500000 Mbps | - | - | 4 | - | - | 27mm | 27mm | No | - | ROHS3 Compliant | Lead Free | ||
CYP15G0101DXB-BBXI Cypress Semiconductor Corp | 555 | - | - | - | Surface Mount | Surface Mount | 100-LBGA | 100 | - | -40°C~85°C | Tray | 2004 | HOTlink II™ | e1 | yes | Active | 3 (168 Hours) | 100 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 1.25W | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | - | - | 30 | CY*15G01 | - | Transceiver | - | 3.3V | - | - | 1 | LVTTL | - | - | - | - | 510mA | 510mA | 390mA | - | - | INTERFACE CIRCUIT | 1 | 890μm | - | 11mm | 11mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
CYP15G0401DXB-BGXC Cypress Semiconductor Corp | 45 |
| - | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | yes | Active | 3 (168 Hours) | 256 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 2.5W | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | 1.27mm | - | 30 | CY*15G04 | - | Transceiver | - | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.06A | - | 830mA | 1500000 Mbps | - | - | 4 | - | - | 27mm | 27mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
CYP15G0101DXB-BBXC Cypress Semiconductor Corp | 4 | - | - | 15 Weeks | Surface Mount | Surface Mount | 100-LBGA | 100 | - | 0°C~70°C | Tray | 2004 | HOTlink II™ | e1 | yes | Active | 3 (168 Hours) | 100 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 1.25W | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | - | - | 30 | CY*15G01 | - | Transceiver | - | 3.3V | - | - | 1 | LVTTL | - | - | - | 500mA | 500mA | 500mA | - | - | 150MHz | INTERFACE CIRCUIT | 1 | 890μm | - | 11mm | 11mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
CYP15G0401DXB-BGI Cypress Semiconductor Corp | 35 | - | Datasheet | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | - | Obsolete | 3 (168 Hours) | 256 | - | Tin/Lead (Sn/Pb) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 235 | - | 3.3V | 1.27mm | - | NOT SPECIFIED | CY*15G04 | - | Transceiver | Not Qualified | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.1A | - | 830mA | 1500000 Mbps | - | - | 4 | - | - | 27mm | 27mm | - | - | Non-RoHS Compliant | - | ||
 CYP15G0201DXB-BBXC Cypress Semiconductor Corp | 112 | - | Datasheet | 13 Weeks | Surface Mount | Surface Mount | 196-LBGA | 196 | - | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | yes | Active | 5 (48 Hours) | 196 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | 1mm | - | 20 | CY*15G02 | - | Transceiver | - | 3.3V | - | - | - | LVTTL | 2 | - | - | - | 700mA | - | 570mA | 1500000 Mbps | - | - | 2 | - | 1.5mm | - | 15mm | No | - | ROHS3 Compliant | Lead Free | ||
CYP15G0201DXB-BBC Cypress Semiconductor Corp | 35 | - | Datasheet | - | Surface Mount | Surface Mount | 196-LBGA | 196 | - | 0°C~70°C | Tray | 2003 | HOTlink II™ | e0 | - | Obsolete | 3 (168 Hours) | 196 | - | Tin/Lead (Sn/Pb) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 220 | - | 3.3V | 1mm | not_compliant | NOT SPECIFIED | CY*15G02 | - | Transceiver | Not Qualified | 3.3V | - | - | - | LVTTL | 2 | - | - | - | 700mA | - | 570mA | 1500000 Mbps | - | - | 2 | - | 1.5mm | 15mm | 15mm | - | - | Non-RoHS Compliant | - | ||
CYP15G0401DXB-BGXI Cypress Semiconductor Corp | 100 | - | - | 14 Weeks | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | -40°C~85°C | Tray | 2003 | HOTlink II™ | e1 | yes | Active | 3 (168 Hours) | 256 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | - | - | 30 | CY*15G04 | - | Transceiver | - | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.1A | 1.1A | 830mA | 1500000 Mbps | - | - | 4 | 970μm | - | 27mm | 27mm | No | - | ROHS3 Compliant | Lead Free | ||
CYP15G0201DXB-BBXI Cypress Semiconductor Corp | 35 | - | Datasheet | - | Surface Mount | Surface Mount | 196-LBGA | 196 | - | -40°C~65°C | Tray | 2003 | HOTlink II™ | e1 | yes | Active | 5 (48 Hours) | 196 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | 1mm | - | 20 | CY*15G02 | - | Transceiver | - | 3.3V | - | - | - | LVTTL | 2 | - | - | - | 710mA | - | 570mA | 1500000 Mbps | - | - | 2 | - | 1.5mm | 15mm | 15mm | No | - | ROHS3 Compliant | Lead Free | ||
CYV15G0101DXB-BBXC Cypress Semiconductor Corp | 3 | - | - | 15 Weeks | Surface Mount | Surface Mount | 100-LBGA | 100 | - | 0°C~70°C | Tray | 2004 | HOTlink II™ | e1 | yes | Active | 3 (168 Hours) | 100 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | - | - | 30 | CY*15G01 | - | Transceiver | - | 3.3V | - | - | 1 | LVTTL | - | - | - | - | 500mA | - | 390mA | - | - | INTERFACE CIRCUIT | 1 | - | - | - | 11mm | No | - | ROHS3 Compliant | Lead Free | ||
CYP15G0401DXB-BGC Cypress Semiconductor Corp | 1073 | - | Datasheet | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | 0°C~70°C | Tray | 2002 | HOTlink II™ | e0 | - | Obsolete | 3 (168 Hours) | 256 | - | Tin/Lead (Sn/Pb) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 235 | - | 3.3V | 1.27mm | unknown | NOT SPECIFIED | CY*15G04 | - | Transceiver | Not Qualified | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.06A | - | 830mA | 1500000 Mbps | - | - | 4 | - | - | 27mm | 27mm | - | - | Non-RoHS Compliant | - | ||
CYP15G0402DXB-BGXC Cypress Semiconductor Corp | 38 | - | Datasheet | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | - | Obsolete | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | 1 | 3.3V | 1.27mm | not_compliant | 20 | CY*15G04 | 256 | - | Not Qualified | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.06A | - | 830mA | 1.5 Gbps | - | TELECOM CIRCUIT | 4 | - | - | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
CYV15G0404DXB-BGXC Cypress Semiconductor Corp | 2662 |
| - | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | 0°C~70°C | Tray | 2004 | HOTlink II™ | - | - | Obsolete | 3 (168 Hours) | 256 | - | - | - | - | - | 3.135V~3.465V | BOTTOM | BALL | - | 1 | 3.3V | 1.27mm | unknown | - | CY*15G04 | 256 | - | Not Qualified | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.27A | - | 900mA | - | - | ETHERNET TRANSCEIVER | - | - | - | 27mm | 27mm | - | - | ROHS3 Compliant | Lead Free | ||
CYV15G0403DXB-BGXC Cypress Semiconductor Corp | 175 |
| Datasheet | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | - | Obsolete | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | - | 3.3V | 1.27mm | - | 20 | CY*15G04 | - | Transceiver | - | 3.3V | - | - | - | LVTTL | 4 | - | - | - | 1.27A | - | 900mA | 1500000 Mbps | - | TELECOM CIRCUIT | 4 | - | - | 27mm | 27mm | No | - | ROHS3 Compliant | - | ||
CYV15G0402DXB-BGXC Cypress Semiconductor Corp | 35 | - | Datasheet | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | - | Obsolete | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 260 | 1 | 3.3V | 1.27mm | not_compliant | 20 | CY*15G04 | 256 | - | Not Qualified | - | 3.3V | - | - | LVTTL | 4 | - | - | - | 1.06A | - | 830mA | 1.5 Gbps | - | TELECOM CIRCUIT | 4 | - | - | 27mm | 27mm | - | - | ROHS3 Compliant | Lead Free | ||
CYP15G0101DXB-BBI Cypress Semiconductor Corp | 6 | - | Datasheet | - | Surface Mount | Surface Mount | 100-LBGA | 100 | - | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | - | Obsolete | 3 (168 Hours) | 100 | - | Tin/Lead (Sn/Pb) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 225 | - | 3.3V | - | - | - | CY*15G01 | - | Transceiver | - | 3.3V | - | - | 1 | LVTTL | - | - | - | - | 510mA | - | 390mA | - | - | INTERFACE CIRCUIT | 1 | - | - | - | - | No | - | Non-RoHS Compliant | - | ||
CYW15G0403DXB-BGI Cypress Semiconductor Corp | 350 |
| - | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | - | - | Tray | - | HOTlink II™ | e0 | - | Obsolete | 3 (168 Hours) | 256 | - | Tin/Lead (Sn/Pb) | 85°C | -40°C | - | 3.135V~3.465V | BOTTOM | BALL | 225 | 1 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 256 | - | Not Qualified | - | 3.3V | INDUSTRIAL | - | - | 4 | - | - | - | 1.32A | - | - | 1500000 Mbps | - | TELECOM CIRCUIT | 4 | - | - | 27mm | 27mm | - | - | Non-RoHS Compliant | - | ||
CYP15G0201DXB-BBI Cypress Semiconductor Corp | 35 | - | Datasheet | - | Surface Mount | Surface Mount | 196-LBGA | 196 | - | -40°C~85°C | Tray | 2003 | HOTlink II™ | e0 | - | Obsolete | 3 (168 Hours) | 196 | - | Tin/Lead (Sn/Pb) | - | - | - | 3.135V~3.465V | BOTTOM | BALL | 240 | - | 3.3V | 1mm | not_compliant | 30 | CY*15G02 | - | Transceiver | Not Qualified | - | 3.3V | - | - | LVTTL | 2 | - | - | - | 710mA | - | 570mA | 1500000 Mbps | - | - | 2 | - | 1.5mm | 15mm | 15mm | - | - | Non-RoHS Compliant | - | ||
CYP15G0403DXB-BGC Cypress Semiconductor Corp | 35 |
| Datasheet | - | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 256-BGA (27x27) | 0°C~70°C | Tray | 2003 | HOTlink II™ | - | - | Obsolete | 3 (168 Hours) | - | - | - | 70°C | 0°C | - | 3.135V~3.465V | - | - | - | - | - | - | - | - | CY*15G04 | - | Transceiver | - | 3.3V | - | - | 4 | LVTTL | 4 | 3.465V | 3.135V | - | 1.27A | - | 900mA | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - |