- Clock Frequency-Max
- Ihs Manufacturer
- JESD-30 Code
- Length
- Number of Terminals
- Package Body Material
- Package Code
- Package Description
- Package Equivalence Code
- Package Shape
- Package Style
- Part Life Cycle Code
Attribute column
Manufacturer
Freescale Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Series | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Number of Inputs | Organization | Halogen Free | Seated Height-Max | Programmable Logic Type | Address Bus Width | Product Type | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XPC860TCZP66D4 Freescale | In Stock | - | - | YES | 357 | Taiyo Yuden | 66 MHz | 4000 | MOTOROLA INC | Taiyo Yuden | XPC860TCZP66D4 | - | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Transferred | NOT SPECIFIED | 5.69 | Details | No | 3.465 V | 3.135 V | 3.3 V | MCAR | - | 3A001.A.3 | - | - | 8542.31.00.01 | Capacitors | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | unknown | - | S-PBGA-B357 | - | Not Qualified | 3.3 V | - | 66 MHz | MICROPROCESSOR, RISC | 32 | - | - | Not Halogen Free | 2.05 mm | - | 32 | Ceramic Capacitors | YES | YES | 32 | FIXED POINT | YES | - | - | - | - | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 25 mm | 25 mm | ||
MPA1036DH Freescale Semiconductor | In Stock | - | Datasheet | YES | 160 | - | 16 MHz | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | - | - | - | No | 5.25 V | 4.75 V | 5 V | - | e0 | - | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; IEEE 1149.1 JTAG BOUNDARY SCAN CIRCUITRY | - | - | - | QUAD | GULL WING | NOT SPECIFIED | 0.635 mm | unknown | NOT SPECIFIED | S-PQFP-G160 | 120 | Not Qualified | 3.3/5,5 V | COMMERCIAL | - | - | - | 120 | 3600 CLBS, 8000 GATES | - | 3.85 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1.75 ns | 3600 | 3600 | 8000 | - | 28 mm | 28 mm |