- Series
- Mfr
- Package
- Product Status
- Speed
- Package / Case
- Ethernet
- USB
- Operating Temperature
- Supplier Device Package
- Core Processor
- Co-Processors/DSP
Attribute column
Manufacturer
Freescale Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Base Product Number | Clock Frequency-Max | Conductor Diameter (Cross Section) | Gross Weight | Ihs Manufacturer | Mfr | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Transport packaging size/quantity | Wire Insulation Color | Wire Length | Operating Temperature | Series | JESD-609 Code | Pbfree Code | ECCN Code | Connector Type | Type | Terminal Finish | Additional Feature | HTS Code | Power Rating | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Resistor Type | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Number of Contacts | Power Supplies | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Resistance Tolerance | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA | Saturation Current | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 SPC8548CPXAUJB Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 783 | - | 133 MHz | - | - | FREESCALE SEMICONDUCTOR INC | - | 3 | 105 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA783,28X28,40 | SQUARE | GRID ARRAY | Obsolete | - | - | No | 1.155 V | 1.045 V | 1.1 V | - | - | - | - | - | e0 | No | 3A991.A.2 | - | - | TIN LEAD | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1 mm | - | - | not_compliant | 40 | - | S-PBGA-B783 | Not Qualified | - | - | - | 1333 MHz | MICROPROCESSOR, RISC | - | - | 32 | - | 64 | YES | - | AEC-Q100 | 64 | FLOATING POINT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 XPC823ZT50Z3 Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 256 | - | - | - | - | FREESCALE SEMICONDUCTOR INC | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | - | - | - | unknown | - | - | S-PBGA-B256 | - | - | - | COMMERCIAL | 50 MHz | MICROPROCESSOR | - | - | 32 | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 XPC755BRX300LE Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 360 | - | 100 MHz | - | - | FREESCALE SEMICONDUCTOR INC | - | - | - | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | - | - | 2.1 V | 1.8 V | 2 V | - | - | - | - | - | - | - | 3A991 | - | - | - | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | - | 1.27 mm | - | - | unknown | - | 360 | S-CBGA-B360 | Not Qualified | - | - | - | 300 MHz | MICROPROCESSOR, RISC | - | - | 32 | 3.2 mm | 32 | YES | YES | - | 64 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 25 mm | 25 mm | ||
PPC7448HX1400NC Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 360 | - | 1400 MHz | - | - | FREESCALE SEMICONDUCTOR INC | - | 1 | 105 °C | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | BGA | - | No | 1.2 V | 1.1 V | 1.15 V | - | - | - | - | - | e0 | - | 3A991.A.2 | - | - | TIN LEAD | - | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.27 mm | - | - | not_compliant | 30 | 360 | S-CBGA-B360 | Not Qualified | - | - | OTHER | 1400 MHz | MICROPROCESSOR, RISC | - | - | 32 | 2.8 mm | - | NO | YES | - | - | FIXED POINT | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 25 mm | 25 mm | ||
PCC5E0RX266WB0B Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 840 | - | - | - | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, BGA840,29X29,40 | BGA840,29X29,40 | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1 mm | - | - | unknown | - | - | S-PBGA-B840 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XC7455ARX1250PF Freescale Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | - | - | - | FREESCALE SEMICONDUCTOR INC | - | 1 | - | - | - | - | - | , | - | - | - | Transferred | - | - | No | - | - | - | - | - | - | - | - | e0 | - | - | - | - | TIN LEAD | - | 8542.31.00.01 | - | - | - | 220 | - | - | - | not_compliant | 30 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XPC7451RX800RE Freescale Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | - | - | - | FREESCALE SEMICONDUCTOR INC | - | - | - | - | - | - | - | , | - | - | - | Transferred | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MPC8245LZU266B Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 352 | - | - | - | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, BGA352,26X26,50 | BGA352,26X26,50 | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | BOTTOM | BALL | - | 1.27 mm | - | - | unknown | - | - | S-PBGA-B352 | Not Qualified | - | 2,3.3 V | - | 266 MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XC7455CRX933LF Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 483 | - | 133 MHz | - | - | FREESCALE SEMICONDUCTOR INC | - | - | - | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | BGA | - | - | 1.35 V | 1.25 V | 1.3 V | - | - | - | - | - | - | - | 3A991 | - | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1.27 mm | - | - | unknown | - | 483 | S-CBGA-B483 | Not Qualified | - | - | - | 933 MHz | MICROPROCESSOR, RISC | - | - | 32 | 3.2 mm | 36 | YES | YES | - | 64 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 29 mm | 29 mm | ||
MPC885ZP66 Freescale | In Stock | - | - | Surface Mount | 357-BBGA | - | 357-PBGA (25x25) | - | - | MPC88 | - | - | - | - | Freescale Semiconductor | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | 0°C ~ 95°C (TA) | MPC8xx | - | - | - | - | - | - | - | - | 1 W | - | - | - | - | - | Industrial | - | - | - | - | - | - | - | - | 66MHz | - | MPC8xx | - | - | - | - | - | - | - | - | - | - | 3.3V | 0.5 | 10Mbps (3), 10/100Mbps (2) | 1 Core, 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | - | - | - | - | - | - | ||
MC68360ZQ25VL Freescale | In Stock | - | - | Surface Mount | 357-BBGA | - | 357-PBGA (25x25) | - | - | MC683 | - | - | - | - | Freescale Semiconductor | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | 0°C ~ 70°C (TA) | M683xx | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 25MHz | - | CPU32+ | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10Mbps (1) | 1 Core, 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | - | ||
MC68HC000P10 Freescale Semiconductor | In Stock | - | Datasheet | - | - | NO | - | - | 64 | - | - | - | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | 70 °C | - | - | PLASTIC/EPOXY | DIP | DIP, DIP64,.9 | DIP64,.9 | RECTANGULAR | IN-LINE | Obsolete | - | - | No | - | - | 5 V | - | - | - | - | - | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | DUAL | THROUGH-HOLE | - | 2.54 mm | - | - | unknown | - | - | R-PDIP-T64 | Not Qualified | - | 5 V | COMMERCIAL | 10 MHz | MICROPROCESSOR, RISC | - | 30 mA | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 MPC750ARX266TH Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | nylon PA66 (UL94V0), black | 255 | - | 266 MHz | 0.12mm2 (26AWG), insulation - PVC 0.4mm | 4.48 | FREESCALE SEMICONDUCTOR INC | - | - | 105 °C | -40 °C | - | CERAMIC, METAL-SEALED COFIRED | BGA | CERAMIC, BGA-255 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | - | No | - | - | 2.6 V | 48*32*22.5/3000 | red; black | 4*300mm | 0…+80 °C | - | e0 | - | 3A991 | BLS-4 with 2.54mm pitch | Interconnect Power Cable Connector (F - F) 2 x BLS | TIN LEAD | ALSO REQUIRES 3.3V I/O SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | - | 1.27 mm | connector housing - 14mm | - | not_compliant | - | 255 | S-CBGA-B255 | Not Qualified | 4 | - | INDUSTRIAL | 266 MHz | MICROPROCESSOR, RISC | - | - | 32 | - | 32 | NO | YES | - | 64 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | 1 | connector housing - 2.6mm | - | connector housing - 10.16mm | ||
XPC860ENZP50D3 Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 357 | - | 50 MHz | - | - | FREESCALE SEMICONDUCTOR INC | - | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | BGA | - | - | 3.465 V | 3.135 V | 3.3 V | - | - | - | - | - | - | - | 5A991 | - | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1.27 mm | - | - | unknown | - | 357 | S-PBGA-B357 | Not Qualified | - | - | - | 50 MHz | MICROPROCESSOR, RISC | - | - | 32 | 2.05 mm | 32 | YES | YES | - | 32 | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 25 mm | 25 mm | ||
MC7447RX1267LB Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 360 | - | 167 MHz | - | - | FREESCALE SEMICONDUCTOR INC | - | 1 | - | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | - | No | 1.35 V | 1.25 V | 1.3 V | - | - | - | - | - | e0 | - | 3A991.A.2 | - | - | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | - | BOTTOM | BALL | 220 | 1.27 mm | - | - | not_compliant | 30 | 360 | S-CBGA-B360 | Not Qualified | - | - | - | 1267 MHz | MICROPROCESSOR, RISC | - | - | 32 | 3.2 mm | 36 | YES | YES | - | 64 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 25 mm | 25 mm | ||
 MC68322FT16 Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 160 | - | 33.334 MHz | - | - | FREESCALE SEMICONDUCTOR INC | - | - | 70 °C | - | - | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | QFP | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | EAR99 | - | - | - | - | 8542.31.00.01 | - | QUAD | GULL WING | - | 0.65 mm | - | - | unknown | - | 160 | S-PQFP-G160 | Not Qualified | - | - | COMMERCIAL | 16.667 MHz | MICROPROCESSOR, RISC | - | - | 16 | 3.85 mm | 26 | NO | NO | - | 16 | FIXED POINT | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 28 mm | 28 mm | ||
MC68HC000L8 Freescale Semiconductor | In Stock | - | Datasheet | - | - | NO | - | - | 64 | - | - | - | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | 70 °C | - | - | CERAMIC | DIP | DIP, DIP64,.9 | DIP64,.9 | RECTANGULAR | IN-LINE | Obsolete | - | - | No | - | - | 5 V | - | - | - | - | - | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | DUAL | THROUGH-HOLE | - | 2.54 mm | - | - | unknown | - | - | R-XDIP-T64 | Not Qualified | - | 5 V | COMMERCIAL | 8 MHz | MICROPROCESSOR, RISC | - | 25 mA | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MC6800CLD Freescale Semiconductor | In Stock | - | Datasheet | - | - | NO | - | - | 40 | - | - | - | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | 85 °C | -40 °C | - | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | - | - | No | - | - | - | - | - | - | - | - | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | - | - | unknown | - | - | R-XDIP-T40 | - | - | - | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MC68HC001FC10 Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 68 | - | - | - | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | - | 70 °C | - | - | PLASTIC/EPOXY | BQFP | BQFP, SPQFP68,.7SQ | SPQFP68,.7SQ | SQUARE | FLATPACK | Obsolete | - | - | No | - | - | 5 V | - | - | - | - | - | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | QUAD | GULL WING | - | 0.635 mm | - | - | unknown | - | - | S-PQFP-G68 | Not Qualified | - | 5 V | COMMERCIAL | 10 MHz | MICROPROCESSOR, RISC | - | 30 mA | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XPC8240RZU250D Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | - | 352 | - | - | - | - | FREESCALE SEMICONDUCTOR INC | - | - | - | - | - | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 | BGA352,26X26,50 | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | BOTTOM | BALL | - | 1.27 mm | - | - | unknown | - | - | S-PBGA-B352 | Not Qualified | - | 2.5,3.3 V | - | 250 MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |