- Packaging
- Factory Pack QuantityFactory Pack Quantity
- Package / Case
- Memory Size
- Maximum Operating Temperature
- Minimum Operating Temperature
- Interface Type
- Mounting Styles
- Supply Voltage-Max
- Supply Voltage-Min
- Maximum Clock Frequency
- Manufacturer
Attribute column
Manufacturer
GigaDevice Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Memory Types | Operating Temperature | Packaging | Published | Part Status | Moisture Sensitivity Level (MSL) | Voltage - Supply | Memory Size | Clock Frequency | Memory Format | Memory Interface | Write Cycle Time - Word, Page | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 GD25WD40CTIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~3.6V | 4Mb 512K x 8 | - | FLASH | SPI - Quad I/O | - | ROHS3 Compliant | ||
 GD25LQ80CEIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-XFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~2.1V | 8Mb 1M x 8 | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
GD25WD20CEIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-XFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~3.6V | 2Mb 256K x 8 | - | FLASH | SPI - Quad I/O | - | ROHS3 Compliant | ||
GD25WD20CTIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~3.6V | 2Mb 256K x 8 | - | FLASH | SPI - Quad I/O | - | ROHS3 Compliant | ||
GD25WD10CEIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-XFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~3.6V | 1Mb 128K x 8 | - | FLASH | SPI - Quad I/O | - | ROHS3 Compliant | ||
GD25WD40CEIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-XFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~3.6V | 4Mb 512K x 8 | - | FLASH | SPI - Quad I/O | - | ROHS3 Compliant | ||
GD25WD80CTIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~3.6V | 8Mb 1M x 8 | - | FLASH | SPI - Quad I/O | - | ROHS3 Compliant | ||
GD25Q32CSIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 6 Weeks | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | Active | 3 (168 Hours) | 2.7V~3.6V | 32Mb 4M x 8 | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
 GD25Q64CFIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 6 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | Active | 3 (168 Hours) | 2.7V~3.6V | 64Mb 8M x 8 | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
GD25D10CKIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-XFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 2.7V~3.6V | 1Mb 128K x 8 | 100MHz | FLASH | SPI - Dual I/O | 50μs, 4ms | ROHS3 Compliant | ||
GD25S512MDFIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 2.7V~3.6V | 512Mb 64M x 8 | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
GD25VE32CSIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 6 Weeks | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 2.1V~3.6V | 32Mb 4M x 8 | 104MHz | FLASH | SPI - Quad I/O | - | ROHS3 Compliant | ||
 GD25Q64CZIGY GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 6 Weeks | Surface Mount | 24-TBGA | Non-Volatile | -40°C~85°C TA | Tray | 2016 | Active | 3 (168 Hours) | 2.7V~3.6V | 64Mb 8M x 8 | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
GD25LD10CEIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-XFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~2V | 1Mb 128K x 8 | 50MHz | FLASH | SPI - Dual I/O | 55μs, 6ms | ROHS3 Compliant | ||
GD25LD05CEIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-XFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~2V | 512Kb 64K x 8 | 50MHz | FLASH | SPI - Dual I/O | 55μs, 6ms | ROHS3 Compliant | ||
 GD25Q20COIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 6 Weeks | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 2.7V~3.6V | 2Mb 256K x 8 | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
 GD5F1GQ4UEYIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-WDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 2.7V~3.6V | 1Gb 128M x 8 | 120MHz | FLASH | SPI - Quad I/O | 700μs | ROHS3 Compliant | ||
GD25LQ05CTIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 1.65V~2.1V | 512Kb 64K x 8 | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
GD25Q40CSIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | - | Active | 3 (168 Hours) | 2.7V~3.6V | 4Mb 512K x 8 | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||
GD25Q127CFIGR GigaDevice Semiconductor (HK) Limited | In Stock | - | Datasheet | 4 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2018 | Active | 3 (168 Hours) | 2.7V~3.6V | 128Mb 16M x 8 | 104MHz | FLASH | SPI - Quad I/O | 12μs, 2.4ms | ROHS3 Compliant |