- Clock Frequency-Max (fCLK)
- ECCN Code
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Length
- Memory Density
- Memory IC Type
- Memory Width
- Number of Functions
- Number of Terminals
- Number of Words
Attribute column
Manufacturer
GigaDevice Memory - Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Nom (Vsup) | ECCN Code | Type | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 GD25Q41BSIG GigaDevice Semiconductor (Beijing) Inc | In Stock | - | Datasheet | YES | 8 | 104 MHz | GIGADEVICE SEMICONDUCTOR INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.208 INCH, GREEN, SOP-8 | - | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | Yes | - | EAR99 | NOR TYPE | - | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | - | 512KX8 | - | 2.16 mm | 8 | - | 4194304 bit | SERIAL | FLASH | 2.7 V | - | - | - | - | - | 5.28 mm | 5.23 mm | ||
GD5F2GQ4RBYIG GigaDevice Semiconductor (Beijing) Inc | In Stock | - | Datasheet | YES | 8 | 120 MHz | GIGADEVICE SEMICONDUCTOR INC | 536870912 words | 512000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HSON | HSON, | - | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | Contact Manufacturer | Yes | 1.8 V | EAR99 | - | IT ALSO HAVE MEMORY WIDTH X1 | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | R-PDSO-N8 | 2 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | - | 512MX4 | - | - | 4 | - | 2147483648 bit | SERIAL | FLASH | 1.8 V | - | - | - | - | 2 | 8 mm | 6 mm | ||
GD5F2GQ4UBZIGY GigaDevice Semiconductor (Beijing) Inc | In Stock | - | Datasheet | YES | 24 | 120 MHz | GIGADEVICE SEMICONDUCTOR INC | 536870912 words | 512000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE | Contact Manufacturer | Yes | 3.3 V | EAR99 | - | IT ALSO HAVE MEMORY WIDTH X1 | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | R-PBGA-B24 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | - | 512MX4 | - | 1.2 mm | 4 | - | 2147483648 bit | SERIAL | FLASH | 3.3 V | - | - | - | - | 2 | 8 mm | 6 mm | ||
GD25Q128EWIG GigaDevice Semiconductor (Beijing) Inc | In Stock | - | Datasheet | YES | 8 | 133 MHz | GIGADEVICE SEMICONDUCTOR INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | WSON-8 | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Contact Manufacturer | - | 3.3 V | EAR99 | NOR TYPE | - | 8542.32.00.51 | DUAL | NO LEAD | - | 1 | 1.27 mm | unknown | - | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 16MX8 | 3-STATE | 0.8 mm | 8 | 0.00005 A | 134217728 bit | SERIAL | FLASH | 3.3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | 6 mm | 5 mm |