- Organization
- Memory Size
- Mounting Styles
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- Supply Voltage-Max
- Supply Voltage-Min
- Interface Type
- Maximum Operating Temperature
- Minimum Operating Temperature
- Supply Current-Max
- Maximum Clock Frequency
- Manufacturer
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Manufacturer
GSI Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Brand | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Length | Width |
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 GS8342S36BGD-400I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | - | DDR | - | - | Parallel | - | - | 400 MHz | 400 MHz | 1.9 V | + 85 C | - | 1.7 V | - 40 C | - | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | - | 1.8000 V | Industrial grade | -40 to 100 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 36 Mbit | 2 | - | 915 mA | - | Pipelined | 1 M x 36 | - | - | - | 19 Bit | - | 36 Mbit | - | - | Industrial | - | - | - | - | - | - | - | ||
GS880E36CGT-150V GSI Technology | In Stock | - | - | 8 Weeks | TQFP-100 | YES | 100 | 7.5 ns | GSI Technology | SDR | 66 | GSI TECHNOLOGY | Parallel | GSI Technology | GS880E36CGT-150V | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 36 Bit | 256 kWords | 256000 | 70 °C | - | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | NOT SPECIFIED | 5.38 | Details | Yes | TQFP | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS880E36CGT | e3 | Yes | 3A991.B.2.B | DCD | PURE MATTE TIN | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2 V | 1.8/2.5 V | COMMERCIAL | 1.7 V | 9 Mbit | 2 | SYNCHRONOUS | 110 mA, 125 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | 3-STATE | 1.6 mm | 36 | 18 Bit | SRAM | 9 Mbit | 0.025 A | 9437184 bit | Commercial | PARALLEL | COMMON | CACHE SRAM | 1.7 V | SRAM | 20 mm | 14 mm | ||
GS88236CD-250 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | 72 | - | Parallel | GSI Technology | - | 250 MHz | - | - | + 70 C | SDR | - | 0 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | - | 3.6 V | 2.3 V | - | - | SyncBurst | - | - | - | Tray | GS88236CD | - | - | - | Pipeline/Flow Through | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9 Mbit | - | - | 155 mA, 195 mA | 5.5 ns | - | 256 k x 36 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | SRAM | - | - | ||
GS881E32CGT-150V GSI Technology | In Stock | - | - | 8 Weeks | TQFP-100 | YES | 100 | 7.5 ns | GSI Technology | SDR | 66 | GSI TECHNOLOGY | Parallel | GSI Technology | GS881E32CGT-150V | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 32 Bit | 256 kWords | 256000 | 70 °C | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | NOT SPECIFIED | 5.3 | Details | Yes | TQFP | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS881E32CGT | e3 | Yes | 3A991.B.2.B | DCD Pipeline/Flow Through | Matte Tin (Sn) | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2 V | - | COMMERCIAL | 1.7 V | 9 Mbit | 4 | SYNCHRONOUS | 110 mA, 125 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 32 | - | 1.6 mm | 32 | 18 Bit | SRAM | 8 Mbit | - | 8388608 bit | Commercial | PARALLEL | - | CACHE SRAM | - | SRAM | 20 mm | 14 mm | ||
GS81302T11GE-350I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | DDR | 10 | - | Parallel | GSI Technology | - | 350 MHz | 350 MHz | 1.9 V | + 85 C | DDR-II | 1.7 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 9 Bit | 16 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaDDR-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS81302T11GE | - | - | - | SigmaDDR-II+ | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | 1 | - | 810 mA | - | Pipelined | 16 M x 9 | - | - | - | 23 Bit | SRAM | 144 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - | ||
GS81302TT06GE-500 GSI Technology | In Stock | - | - | 12 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | - | 10 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81302TT06GE-500 | 500 MHz | - | - | + 70 C | DDR-II | - | 0 C | Yes | 3 | - | SMD/SMT | - | 16777216 words | 16000000 | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Not Recommended | BGA | NOT SPECIFIED | 5.31 | Details | Yes | - | 1.9 V | 1.7 V | 1.8 V | - | SigmaDDR-II+ | - | - | - | Tray | GS81302TT06GE | e1 | Yes | 3A991.B.2.B | SigmaDDR-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | - | COMMERCIAL | 1.7 V | 144 Mbit | - | SYNCHRONOUS | 1.07 A | - | - | 16 M x 8 | - | 1.5 mm | 8 | - | SRAM | - | - | 144 | - | PARALLEL | - | DDR SRAM | - | SRAM | 17 mm | 15 mm | ||
GS8662TT37BGD-300 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | - | DDR | - | - | Parallel | - | - | 300 MHz | 300 MHz | 1.9 V | + 70 C | - | 1.7 V | 0 C | - | - | Surface Mount | SMD/SMT | 36 Bit | 2 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | - | 1.8000 V | Commercial grade | 0 to 85 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 72 Mbit | 1 | - | 625 mA | - | Pipelined | 2 M x 36 | - | - | - | 20 Bit | - | 72 Mbit | - | - | Commercial | - | - | - | - | - | - | - | ||
GS81302DT38E-500 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | QDR | 10 | - | Parallel | GSI Technology | - | 500 MHz | 500 MHz | 1.9 V | + 70 C | QDR-II | 1.7 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 4 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II+ | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS81302DT38E | - | - | - | SigmaQuad-II+ | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | 2 | - | 1.66 A | - | Pipelined | 4 M x 36 | - | - | - | 20 Bit | SRAM | 144 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS880E36CGT-250I GSI Technology | In Stock | - | - | - | TQFP-100 | - | - | - | GSI Technology | - | 72 | - | Parallel | GSI Technology | - | 250 MHz | - | - | + 85 C | SDR | - | - 40 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 3.6 V | 2.3 V | - | - | SyncBurst | - | - | - | Tray | GS880E36CGT | - | - | - | DCD | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9 Mbit | - | - | 175 mA, 215 mA | 5.5 ns | - | 256 k x 36 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | SRAM | - | - | ||
GS842Z18CGB-200I GSI Technology | In Stock | - | - | - | BGA-119 | - | - | - | GSI Technology | - | 84 | - | Parallel | GSI Technology | - | 200 MHz | - | - | + 85 C | SDR | - | - 40 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 3.6 V | 2.3 V | - | - | NBT SRAM | - | - | - | Tray | GS842Z18CGB | - | - | - | NBT Pipeline/Flow Through | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4 Mbit | - | - | 150 mA, 175 mA | 6.5 ns | - | 256 k x 18 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | SRAM | - | - | ||
GS81302T10GE-400I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | - | - | - | - | Parallel | - | - | 400 MHz | - | - | + 85 C | - | - | - 40 C | - | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.9 V | 1.7 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 144 Mbit | - | - | 905 mA | - | - | 16 M x 9 | - | - | - | - | - | - | - | 144 | - | - | - | - | - | - | - | - | ||
GS81302TT38E-400I GSI Technology | In Stock | - | - | 12 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | DDR | 10 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81302TT38E-400I | 400 MHz | 400 MHz | 1.9 V | + 85 C | DDR-II | 1.7 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 4 MWords | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Not Recommended | BGA | NOT SPECIFIED | 5.06 | - | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaDDR-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS81302TT38E | - | No | 3A991.B.2.B | SigmaDDR-II+ | - | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | - | INDUSTRIAL | 1.7 V | 144 Mbit | 1 | SYNCHRONOUS | 1.005 A | - | Pipelined | 4 M x 36 | - | 1.5 mm | 36 | 21 Bit | SRAM | 144 Mbit | - | 150994944 bit | Industrial | PARALLEL | - | DDR SRAM | - | SRAM | 17 mm | 15 mm | ||
GS832036AGT-400 GSI Technology | In Stock | - | - | 8 Weeks | TQFP-100 | YES | 100 | 4 ns | GSI Technology | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832036AGT-400 | 400 MHz | 250@Flow-Through/400@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 85 °C | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | NOT SPECIFIED | 5.7 | Details | Yes | TQFP | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | Commercial grade | 0 to 85 °C | Tray | GS832036AGT | - | - | 3A991.B.2.B | Pipeline/Flow Through | - | ALSO OPERATES AT 3.3; SYNCHRONOUS BURST | - | Memory & Data Storage | CMOS | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2.7 V | - | OTHER | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | 285 mA, 395 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | - | 1.6 mm | 36 | 20 Bit | SRAM | 36 Mbit | - | 37748736 bit | Commercial | PARALLEL | - | CACHE SRAM | - | SRAM | 20 mm | 14 mm | ||
GS881Z32CGD-200 GSI Technology | In Stock | - | - | 8 Weeks | BGA-165 | YES | 100 | 6.5 ns | GSI Technology | - | 72 | GSI TECHNOLOGY | Parallel | GSI Technology | GS881Z32CGD-200 | 200 MHz | - | - | + 70 C | SDR | - | 0 C | Yes | 3 | - | SMD/SMT | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | NOT SPECIFIED | 5.29 | Details | Yes | - | 3.6 V | 2.3 V | 2.5 V | - | NBT SRAM | - | - | - | Tray | GS881Z32CGD | e1 | Yes | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2.7 V | - | COMMERCIAL | 2.3 V | 9 Mbit | - | SYNCHRONOUS | 140 mA, 170 mA | 6.5 ns | - | 256 k x 32 | - | 1.6 mm | 32 | - | SRAM | - | - | 8388608 bit | - | PARALLEL | - | ZBT SRAM | - | SRAM | 20 mm | 14 mm | ||
GS71108AU-7 GSI Technology | In Stock | - | - | 6 Weeks | - | YES | 48 | 7 ns | GSI Technology | - | 240 | GSI TECHNOLOGY | - | GSI Technology | GS71108AU-7 | - | - | 3.6 V | - | - | 3 V | - | - | 3 | Surface Mount | - | 8 Bit | 128 kWords | 128000 | 70 °C | - | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | BGA | NOT SPECIFIED | 5.22 | - | No | FBGA | - | - | 3.3 V | Asynchronous | - | 3.3000 V | Commercial grade | 0 to 70 °C | - | GS71108AGU | - | No | 3A991.B.2.B | - | - | - | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.75 mm | compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | - | COMMERCIAL | 3 V | - | 1 | ASYNCHRONOUS | - | - | - | 128KX8 | - | 1.2 mm | 8 | 17 Bit | SRAM | 1 Mbit | - | 1048576 bit | Commercial | PARALLEL | - | STANDARD SRAM | - | SRAM | 8 mm | 6 mm | ||
GS81302S18E-375 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | DDR | 10 | - | Parallel | GSI Technology | - | 375 MHz | 375 MHz | - | + 70 C | DDR-II | - | 0 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 8 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaSIO DDR-II | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS81302S18E | - | - | - | SigmaSIO DDR-II | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | 2 | - | 995 mA | - | Pipelined | 8 M x 18 | - | - | - | - | SRAM | 144 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS864218B-300 GSI Technology | In Stock | - | - | 8 Weeks | BGA-119 | YES | 119 | 5.5 ns | - | SDR | - | GSI TECHNOLOGY | Parallel | GSI Technology | GS864218B-300 | 300 MHz | 181.8@Flow-Through/300@Pipelined MHz | 2.7, 3.6 V | + 70 C | - | 2.3, 3 V | 0 C | - | 3 | Surface Mount | SMD/SMT | 18 Bit | 4 MWords | 4000000 | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.17 | - | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | - | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | - | GS864218B | e0 | No | 3A991.B.2.B | - | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | - | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2.7 V | - | COMMERCIAL | 2.3 V | 72 Mbit | 2 | SYNCHRONOUS | 270 mA, 370 mA | 5.5 ns | Flow-Through/Pipelined | 4MX18 | - | 1.99 mm | 18 | 22 Bit | - | 72 Mbit | - | 75497472 bit | Commercial | PARALLEL | - | CACHE SRAM | - | - | 22 mm | 14 mm | ||
GS8673EQ18BGK-714 GSI Technology | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 72 | - | - | - | - | - | - | - | - | ||
GS8662S09BD-333 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | DDR | 15 | - | Parallel | GSI Technology | - | 333 MHz | 333 MHz | 1.9 V | + 70 C | DDR | 1.7 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 9 Bit | 8 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | - | 1.9 V | 1.7 V | - | Synchronous | SigmaSIO DDR-II | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS8662S09BD | - | - | - | SigmaSIO DDR-II | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 72 Mbit | 2 | - | 630 mA | - | Pipelined | 8 M x 9 | - | - | - | 22 Bit | SRAM | 72 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS8161Z18DD-375I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | SDR | 36 | - | Parallel | GSI Technology | - | 375 MHz | 238@Flow-Through/375@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 1 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 3.6 V | 2.3 V | - | Synchronous | NBT SRAM | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS8161Z18DD | - | - | - | NBT | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 18 Mbit | 2 | - | 270 mA, 340 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | - | - | - | 20 Bit | SRAM | 18 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - |