- Organization
- Memory Size
- Mounting Styles
- Package / Case
- Supply Voltage-Max
- Supply Voltage-Min
- Interface Type
- Maximum Operating Temperature
- Minimum Operating Temperature
- Supply Current-Max
- Maximum Clock Frequency
- Series
Attribute column
Manufacturer
GSI Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Length | Width |
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 GS81302T09GE-350 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | DDR | 10 | - | Parallel | GSI Technology | - | 350 MHz | 350 MHz | - | + 70 C | DDR-II | - | 0 C | Yes | - | Surface Mount | SMD/SMT | 9 Bit | 16 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaDDR-II | 1.8000 V | - | Commercial grade | 0 to 85 °C | Tray | GS81302T09GE | - | - | - | SigmaDDR-II B2 | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | 2 | - | 800 mA | - | Pipelined | 16 M x 9 | - | - | - | - | SRAM | 144 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS832018AGT-250IV GSI Technology | In Stock | - | - | - | TQFP-100 | - | - | - | GSI Technology | - | SDR | 18 | - | Parallel | GSI Technology | - | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | TQFP | 2.7 V | 1.7 V | - | Synchronous | SyncBurst | 1.8, 2.5 V | - | Industrial grade | -40 to 100 °C | Tray | GS832018AGT | - | - | - | Synchronous Burst | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 100 | - | - | - | - | - | - | 36 Mbit | 2 | - | 245 mA, 285 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 18 | - | - | - | 21 Bit | SRAM | 36 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - | ||
GS832218AD-375 GSI Technology | In Stock | - | - | 8 Weeks | BGA-165 | YES | 165 | 4.2 ns | GSI Technology | 375 MHz | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832218AD-375 | 375 MHz | 238@Flow-Through/375@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | 2000000 | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.11 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | - | Commercial grade | 0 to 85 °C | Tray | GS832218AD | e0 | No | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 36 Mbit | 2 | SYNCHRONOUS | 250 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | CACHE SRAM | 2.3 V | SRAM | 15 mm | 13 mm | ||
GS8322Z72GC-250EV GSI Technology | In Stock | - | - | - | BGA-209 | - | - | - | GSI Technology | - | SDR | 14 | - | Parallel | GSI Technology | - | 250 MHz | 250 MHz | 2.7, 3.6 V | + 125 C | SDR | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | FBGA | 2.7 V | 1.7 V | - | Synchronous | NBT SRAM | 2.5, 3.3 V | - | - | -40 to 125 °C | Tray | GS8322Z72GC | - | - | - | NBT | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 209 | - | - | - | - | - | - | 36 Mbit | 8 | - | - | 6.5 ns | Flow-Through/Pipelined | 512 k x 72 | - | - | - | 19 Bit | SRAM | 36 Mbit | - | - | Extended Industrial | - | - | - | - | SRAM | - | - | ||
GS864272GC-300I GSI Technology | In Stock | - | - | 8 Weeks | BGA-209 | YES | 209 | 5.5 ns | GSI Technology | - | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS864272GC-300I | 300 MHz | 181.8@Flow-Through/300@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 4.63 | Details | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | 1.270077 oz | Industrial grade | -40 to 85 °C | Tray | GS864272GC | e1 | Yes | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | - | INDUSTRIAL | 2.3 V | 72 Mbit | 8 | SYNCHRONOUS | 385 mA, 540 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 72 | - | 1.7 mm | 72 | 20 Bit | SRAM | 72 Mbit | - | 75497472 bit | Industrial | PARALLEL | - | CACHE SRAM | - | SRAM | 22 mm | 14 mm | ||
GS81302D08GE-300 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | QDR | 10 | - | Parallel | GSI Technology | - | 300 MHz | 300 MHz | 1.9 V | + 70 C | QDR-II | 1.7 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 8 Bit | 16 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II | 1.8000 V | - | Commercial grade | 0 to 85 °C | Tray | GS81302D08GE | - | - | - | SigmaQuad-II | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | 2 | - | 815 mA | - | Pipelined | 16 M x 8 | - | - | - | 22 Bit | SRAM | 144 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS8662D19BGD-350I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | - | - | QDR | - | - | Parallel | - | - | 350 MHz | 350 MHz | 1.9 V | + 85 C | - | 1.7 V | - 40 C | - | - | Surface Mount | SMD/SMT | 18 Bit | 4 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | - | 1.8000 V | - | Industrial grade | -40 to 100 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 72 Mbit | 2 | - | 705 mA | - | Pipelined | 4 M x 18 | - | - | - | 20 Bit | - | 72 Mbit | - | - | Industrial | - | - | - | - | - | - | - | ||
GS8320E32AGT-200IV GSI Technology | In Stock | - | - | 8 Weeks | TQFP-100 | - | - | - | GSI Technology | - | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8320E32AGT-200IV | 200 MHz | 200 MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 32 Bit | 1 MWords | - | - | - | - | - | , | - | - | - | Active | - | - | 5.8 | Details | Yes | TQFP | 2.7 V | 1.7 V | - | Synchronous | SyncBurst | 1.8, 2.5 V | - | Industrial grade | -40 to 85 °C | Tray | GS8320E32AGT | - | - | - | DCD Synchronous Burst | - | - | - | Memory & Data Storage | - | - | - | - | - | - | compliant | 100 | - | - | - | - | - | - | 36 Mbit | 4 | - | 235 mA, 270 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 32 | - | - | - | - | SRAM | 36 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - | ||
GS8161E36DGT-400I GSI Technology | In Stock | - | - | 10 Weeks | TQFP-100 | - | - | - | GSI Technology | - | SDR | 36 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8161E36DGT-400I | 400 MHz | 400 MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 512 kWords | - | - | - | - | - | , | - | - | - | Active | - | - | 5.8 | Details | Yes | TQFP | 3.6 V | 2.3 V | - | Synchronous | SyncBurst | 2.5, 3.3 V | - | Industrial grade | -40 to 70 °C | Tray | GS8161E36DGT | - | - | - | DCD Pipeline/Flow Through | - | - | - | Memory & Data Storage | - | - | - | - | - | - | compliant | 100 | - | - | - | - | - | - | 18 Mbit | 4 | - | 300 mA, 385 mA | 4 ns | Flow-Through/Pipelined | 512 k x 36 | - | - | - | 19 Bit | SRAM | 18 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - | ||
GS840H36AGB-166I GSI Technology | In Stock | - | - | 8 Weeks | - | YES | 119 | 8.5 ns | - | - | - | - | GSI TECHNOLOGY | - | GSI Technology | GS840H36AGB-166I | - | - | - | - | - | - | - | - | 3 | - | - | - | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.28 | - | Yes | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | e1 | Yes | 3A991.B.2.B | - | TIN SILVER COPPER | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | - | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 3.6 V | - | INDUSTRIAL | 3 V | - | - | SYNCHRONOUS | - | - | - | 128KX36 | - | 2.19 mm | 36 | - | - | - | - | 4.5 | - | PARALLEL | - | CACHE SRAM | - | - | 22 mm | 14 mm | ||
GS8662D11BGD-450I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | QDR | 15 | - | Parallel | GSI Technology | - | 450 MHz | 450 MHz | 1.9 V | + 85 C | DDR | 1.7 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 9 Bit | 8 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II+ | 1.8000 V | - | Industrial grade | -40 to 100 °C | Tray | GS8662D11BGD | - | - | - | SigmaQuad-II+ | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 72 Mbit | 2 | - | 830 mA | - | Pipelined | 8 M x 9 | - | - | - | 21 Bit | SRAM | 72 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - | ||
GS8662QT07BGD-200I GSI Technology | In Stock | - | - | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | - | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662QT07BGD-200I | 200 MHz | 200 MHz | 1.9 V | + 85 C | DDR | 1.7 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 8 Bit | 8 MWords | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.22 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | - | Industrial grade | -40 to 100 °C | Tray | GS8662QT07BGD | e1 | Yes | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | - | 1.9 V | - | INDUSTRIAL | 1.7 V | 72 Mbit | 2 | SYNCHRONOUS | 610 mA | - | Pipelined | 8 M x 8 | - | 1.4 mm | 8 | 22 Bit | SRAM | 72 Mbit | - | 67108864 bit | Industrial | PARALLEL | - | QDR SRAM | - | SRAM | 15 mm | 13 mm | ||
GS8662DT37BGD-300 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | QDR | 15 | - | Parallel | GSI Technology | - | 300 MHz | 300 MHz | 1.9 V | + 70 C | DDR | 1.7 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 2 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II+ | 1.8000 V | - | Commercial grade | 0 to 85 °C | Tray | GS8662DT37BGD | - | - | - | SigmaQuad-II+ B4 | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 72 Mbit | 2 | - | 735 mA | - | Pipelined | 2 M x 36 | - | - | - | 19 Bit | SRAM | 72 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS882Z18CGB-250IV GSI Technology | In Stock | - | - | - | BGA-119 | - | - | - | - | - | SDR | - | - | Parallel | - | - | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2, 2.7 V | + 85 C | - | 1.7, 2.3 V | - 40 C | - | - | Surface Mount | SMD/SMT | 18 Bit | 512 kWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 2.7 V | 1.7 V | - | Synchronous | - | 1.8, 2.5 V | - | Industrial grade | -40 to 85 °C | - | GS882Z18CGB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 119 | - | - | - | - | - | - | 9 Mbit | 2 | - | 145 mA, 185 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | - | - | - | 18 Bit | - | 9 Mbit | - | - | Industrial | - | - | - | - | - | - | - | ||
GS864418GE-133I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | SDR | 15 | - | Parallel | GSI Technology | - | 133 MHz | 117.6@Flow-Through/133@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 4 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | FBGA | 3.6 V | 2.3 V | - | Synchronous | SyncBurst | 2.5, 3.3 V | - | Industrial grade | -40 to 85 °C | Tray | GS864418GE | - | - | - | Synchronous Burst | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 72 Mbit | 2 | - | 235 mA, 285 mA | 8.5 ns | Flow-Through/Pipelined | 4 M x 18 | - | - | - | 22 Bit | SRAM | 72 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - | ||
GS81302D08E-250 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | QDR | 10 | - | Parallel | GSI Technology | - | 250 MHz | 250 MHz | 1.9 V | + 70 C | QDR-II | 1.7 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 8 Bit | 16 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II | 1.8000 V | - | Commercial grade | 0 to 85 °C | Tray | GS81302D08E | - | - | - | SigmaQuad-II | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | 2 | - | 700 mA | - | Pipelined | 16 M x 8 | - | - | - | 22 Bit | SRAM | 144 Mb | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS8321Z18AD-333I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | SDR | 18 | - | Parallel | GSI Technology | - | 333 MHz | - | 2.7, 3.6 V | + 100 C | SDR | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 3.6 V | 2.3 V | - | Synchronous | NBT SRAM | 2.5, 3.3 V | - | Industrial grade | -40 to 100 °C | Tray | GS8321Z18AD | - | - | - | NBT | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 36 Mbit | 2 | - | 255 mA, 340 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | - | - | - | - | SRAM | 36 Mbit | - | - | Industrial | - | - | - | - | SRAM | - | - | ||
GS8662QT07BGD-333 GSI Technology | In Stock | - | - | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | - | - | QDR | - | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662QT07BGD-333 | 333 MHz | 333 MHz | 1.9 V | + 70 C | - | 1.7 V | 0 C | - | 3 | Surface Mount | SMD/SMT | 8 Bit | 8 MWords | 8000000 | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.22 | - | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | - | 1.8000 V | - | Commercial grade | 0 to 85 °C | - | - | e1 | Yes | 3A991.B.2.B | - | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | - | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | - | 1.9 V | - | COMMERCIAL | 1.7 V | 72 Mbit | 2 | SYNCHRONOUS | 920 mA | - | Pipelined | 8 M x 8 | - | 1.4 mm | 8 | 22 Bit | - | 72 Mbit | - | 67108864 bit | Commercial | PARALLEL | - | QDR SRAM | - | - | 15 mm | 13 mm | ||
GS81302D08E-300 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | QDR | 10 | - | Parallel | GSI Technology | - | 300 MHz | 300 MHz | - | + 70 C | QDR-II | - | 0 C | Yes | - | Surface Mount | SMD/SMT | 8 Bit | 16 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II | 1.8000 V | - | Commercial grade | 0 to 85 °C | Tray | GS81302D08E | - | - | - | SigmaQuad-II | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | 2 | - | 815 mA | - | Pipelined | 16 M x 8 | - | - | - | 22 Bit | SRAM | 144 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | ||
GS81302R09E-333I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | GSI Technology | - | - | 10 | - | Parallel | GSI Technology | - | 333 MHz | - | 1.9 V | + 85 C | DDR-II | 1.7 V | - 40 C | Yes | - | - | SMD/SMT | 9 Bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaDDR-II | 1.8000 V | - | - | -40 to 100 °C | Tray | GS81302R09E | - | - | - | SigmaDDR-II B4 | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | 144 Mbit | - | - | 765 mA | 0.45 | - | 16 M x 9 | - | - | - | - | SRAM | - | - | 144 | - | - | - | - | - | SRAM | - | - |