- Organization
- Memory Size
- Mounting Styles
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- Supply Voltage-Max
- Supply Voltage-Min
- Interface Type
- Maximum Operating Temperature
- Minimum Operating Temperature
- Supply Current-Max
- Maximum Clock Frequency
- Manufacturer
Attribute column
Manufacturer
GSI Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Memory Organization | Length | Width | Radiation Hardening |
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 GS8342Q09BD-250 GSI Technology | In Stock | - | - | - | - | BGA-165 | - | - | - | - | - | GSI Technology | - | QDR | 15 | - | Parallel | GSI Technology | - | 250 MHz | 250 MHz | 1.9 V | + 70 C | DDR | - | 1.7 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 9 Bit | 4 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II | 1.8000 V | - | Commercial grade | 0 to 85 °C | Tray | GS8342Q09BD | - | - | - | SigmaQuad-II | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | - | 36 Mbit | 2 | - | - | 665 mA | 450 ps | - | - | Pipelined | 4 M x 9 | - | - | - | - | 21 Bit | SRAM | 36 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | - | - | ||
GS88118CGD-200I GSI Technology | In Stock | - | - | 8 Weeks | - | BGA-165 | YES | - | 165 | - | - | GSI Technology | - | SDR | 72 | GSI TECHNOLOGY | Parallel | GSI Technology | GS88118CGD-200I | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | - | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 512 kWords | 512000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | NOT SPECIFIED | 4.81 | Details | Yes | FBGA | 3.6 V | 2.3 V | 3.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | - | Industrial grade | -40 to 85 °C | Tray | GS88118CGD | - | - | 3A991.B.2.B | Pipeline/Flow Through | - | - | - | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | - | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 3.6 V | - | INDUSTRIAL | 3 V | 9 Mbit | 1 | SYNCHRONOUS | - | 150 mA, 175 mA | 6.5 ns | - | - | Flow-Through/Pipelined | 512 k x 18 | - | 1.4 mm | 18 | - | 19 Bit | SRAM | 9 Mbit | - | 9437184 bit | Industrial | SERIAL | - | CACHE SRAM | - | SRAM | - | 15 mm | 13 mm | - | ||
GS8182Q36BGD-167I GSI Technology | In Stock | - | - | 8 Weeks | - | BGA-165 | YES | - | 165 | 0.5 ns | - | GSI Technology | - | DDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8182Q36BGD-167I | 167 MHz | 167 MHz | 1.9 V | + 85 C | DDR | - | 1.7 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 36 Bit | 512 kWords | 512000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | NOT SPECIFIED | 4.64 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II | 1.8000 V | - | Industrial grade | -40 to 85 °C | Tray | GS8182Q36BGD | e1 | Yes | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | - | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 1.9 V | - | INDUSTRIAL | 1.7 V | 18 Mbit | 2 | SYNCHRONOUS | - | 495 mA | 500 ps | - | - | Pipelined | 512 k x 36 | - | 1.4 mm | 36 | - | 18 Bit | SRAM | 18 Mbit | - | 18874368 bit | Industrial | PARALLEL | - | DDR SRAM | - | SRAM | - | 15 mm | 13 mm | - | ||
GS8342QT37BGD-333 GSI Technology | In Stock | - | - | 10 Weeks | - | BGA-165 | YES | - | 165 | 0.45 ns | - | GSI Technology | 333 MHz | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342QT37BGD-333 | 333 MHz | 333 MHz | 1.9 V | + 70 C | DDR | - | 1.7 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 70 °C | - | - | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | NOT SPECIFIED | 4.66 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | - | Commercial grade | 0 to 85 °C | Tray | GS8342QT37BGD | e1 | Yes | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | - | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.8 V | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | - | 1.01 A | 450 ps | - | - | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | - | 19 Bit | SRAM | 36 Mbit | - | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | - | 15 mm | 13 mm | No | ||
GS8342Q09BD-250I GSI Technology | In Stock | - | - | 10 Weeks | - | BGA-165 | YES | - | 165 | 0.45 ns | - | GSI Technology | 250 MHz | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342Q09BD-250I | 250 MHz | 250 MHz | - | + 85 C | DDR | - | - | - 40 C | Yes | - | Surface Mount | SMD/SMT | 9 Bit | 4 MWords | 4000000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | - | 5.06 | - | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II | 1.8000 V | 0.541455 oz | Industrial grade | -40 to 100 °C | Tray | GS8342Q09BD | - | - | 3A991.B.2.B | SigmaQuad-II | - | - | - | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | - | BOTTOM | BALL | - | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | - | 675 mA | 450 ps | - | - | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | - | 21 Bit | SRAM | 36 Mbit | 0.215 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | - | 15 mm | 13 mm | - | ||
GS816018DGT-150 GSI Technology | In Stock | - | - | 5 Weeks, 3 Days | - | TQFP-100 | YES | - | 100 | 7.5 ns | - | GSI Technology | - | SDR | 36 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816018DGT-150 | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | - | 2.3, 3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 1 MWords | 1000000 | 70 °C | - | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | - | NOT SPECIFIED | 1.71 | Details | Yes | TQFP | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | - | Commercial grade | 0 to 85 °C | Tray | GS816018DGT | - | - | 3A991.B.2.B | Pipeline/Flow Through | - | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | - | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | - | - | 2.7 V | - | COMMERCIAL | 2.3 V | 18 Mbit | 2 | SYNCHRONOUS | - | 170 mA, 180 mA | 7.5 ns | - | - | Flow-Through/Pipelined | 1 M x 18 | - | 1.6 mm | 8 | - | 21 Bit | SRAM | 18 Mbit | - | 8388608 bit | Commercial | PARALLEL | - | CACHE SRAM | - | SRAM | - | 20 mm | 14 mm | - | ||
GS8321Z36AD-150I GSI Technology | In Stock | - | - | 8 Weeks | - | BGA-165 | YES | - | 165 | - | - | GSI Technology | - | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8321Z36AD-150I | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | - | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | - | - | - | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | NOT SPECIFIED | 4.78 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | - | Industrial grade | -40 to 100 °C | Tray | GS8321Z36AD | e0 | No | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | - | - | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | - | Memory & Data Storage | CMOS | - | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 2.7 V | - | - | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | - | 210 mA, 220 mA | 7.5 ns | - | - | Flow-Through/Pipelined | 1 M x 36 | - | 1.4 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | - | 37748736 bit | Industrial | PARALLEL | - | ZBT SRAM | - | SRAM | - | 15 mm | 13 mm | - | ||
GS816032DGT-200IV GSI Technology | In Stock | - | - | 10 Weeks | - | TQFP-100 | YES | - | 100 | 6.5 ns | - | GSI Technology | - | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816032DGT-200IV | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | - | 1.7, 2.3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 32 Bit | 512 kWords | 512000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | - | NOT SPECIFIED | 4.85 | Details | Yes | TQFP | 3.6 V | 2.3 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | - | Industrial grade | -40 to 100 °C | Tray | GS816032DGT | - | - | 3A991.B.2.B | Pipeline/Flow Through | - | 100 °C | -40 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | - | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | - | - | 2 V | - | INDUSTRIAL | 1.7 V | 18 Mbit | 4 | SYNCHRONOUS | - | 230 mA | 6.5 ns | - | - | Flow-Through/Pipelined | 512 k x 32 | - | 1.6 mm | 32 | - | 20 Bit | SRAM | 18 Mbit | - | 16777216 bit | Industrial | PARALLEL | - | CACHE SRAM | - | SRAM | - | 20 mm | 14 mm | No | ||
GS8320Z18AGT-333I GSI Technology | In Stock | - | - | - | Surface Mount | TQFP-100 | - | 100-TQFP (20x14) | - | - | GS8320Z | GSI Technology | - | SDR | 18 | - | Parallel | GSI Technology | - | 333 MHz | 333 MHz | 2.7, 3.6 V | + 85 C | SDR | GSI Technology Inc. | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | Details | - | TQFP | 3.6 V | 2.3 V | - | Synchronous | NBT SRAM | 2.5, 3.3 V | - | Industrial grade | -40 to 85 °C | Tray | GS8320Z18AGT | - | - | - | NBT Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | - | - | - | - | - | - | 100 | - | - | - | - | - | - | - | 36 Mbit | 2 | - | 333 MHz | 255 mA, 340 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 2 M x 18 | - | - | - | - | 21 Bit | SRAM | 36 Mbit | - | - | Industrial | - | - | - | - | SRAM | 2M x 18 | - | - | - | ||
GS832036AGT-250I GSI Technology | In Stock | - | - | 7 Weeks, 5 Days | Surface Mount | TQFP-100 | YES | 100-TQFP (20x14) | 100 | 5.5 ns | GS832036 | GSI Technology | - | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832036AGT-250I | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | GSI Technology Inc. | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | - | - | Tray | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | Active | NOT SPECIFIED | 4.88 | Details | Yes | TQFP | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | 0.460219 oz | Industrial grade | -40 to 100 °C | Tray | GS832036AGT | - | - | 3A991.B.2.B | Pipeline/Flow Through | - | - | - | ALSO OPERATES AT 3.3; SYNCHRONOUS BURST | - | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | - | 2.7 V | - | - | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | 250 MHz | 250 mA, 305 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | - | 1.6 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | - | 37748736 bit | Industrial | PARALLEL | - | CACHE SRAM | - | SRAM | 1M x 36 | 20 mm | 14 mm | - | ||
GS8322Z36AGB-333I GSI Technology | In Stock | - | - | 8 Weeks | Surface Mount | BGA-119 | YES | 119-FPBGA (22x14) | 119 | 4.5 ns | GS8322Z | GSI Technology | 333 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8322Z36AGB-333I | 333 MHz | 222.2@Flow-Through/333@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | GSI Technology Inc. | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | Active | NOT SPECIFIED | 5.11 | Details | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | - | Industrial grade | -40 to 100 °C | Tray | GS8322Z36AGB | e1 | Yes | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | - | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | 333 MHz | 280 mA, 365 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.99 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 1M x 36 | 22 mm | 14 mm | - | ||
GS84036CGT-200I GSI Technology | In Stock | - | - | 12 Weeks | - | TQFP-100 | YES | - | 100 | 6.5 ns | - | GSI Technology | - | SDR | 72 | GSI TECHNOLOGY | Parallel | GSI Technology | GS84036CGT-200I | 200 MHz | 200 MHz | 2.7, 3.6 V | + 85 C | SDR | - | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 36 Bit | 128 kWords | 128000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | - | - | NOT SPECIFIED | 5.37 | Non-Compliant | Yes | TQFP | 3.6 V | 2.3 V | 3.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | 0.304823 oz | Industrial grade | -40 to 100 °C | Tray | GS84036CGT | - | - | 3A991.B.2.B | Pipeline/Flow Through | Pure Matte Tin (Sn) | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE | - | Memory & Data Storage | CMOS | - | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | - | - | 3.6 V | - | INDUSTRIAL | 3 V | 4 Mbit | 4 | SYNCHRONOUS | - | 160 mA, 190 mA | 6.5 ns | - | - | Flow-Through/Pipelined | 128 k x 36 | - | 1.6 mm | 36 | - | 17 Bit | SRAM | 4 Mbit | - | 4718592 bit | Industrial | PARALLEL | - | CACHE SRAM | - | SRAM | - | 20 mm | 14 mm | - | ||
GS8662Q36BGD-300I GSI Technology | In Stock | - | - | 8 Weeks | - | BGA-165 | YES | - | 165 | 0.45 ns | - | - | 300 MHz | QDR | - | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662Q36BGD-300I | 300 MHz | 300 MHz | 1.9 V | + 85 C | - | - | 1.7 V | - 40 C | - | 3 | Surface Mount | SMD/SMT | 36 Bit | 2 MWords | 2000000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | NOT SPECIFIED | 4.53 | Compliant | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | - | 1.8000 V | - | Industrial grade | -40 to 100 °C | - | GS8662Q36BGD | e1 | Yes | 3A991.B.2.B | - | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | - | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.8 V | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 72 Mbit | 2 | SYNCHRONOUS | - | 1.07 A | 450 ps | - | - | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | - | 20 Bit | - | 72 Mbit | - | 75497472 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | - | - | 15 mm | 13 mm | No | ||
GS8160Z18DGT-200I GSI Technology | In Stock | - | - | 10 Weeks | - | TQFP-100 | YES | - | 100 | - | - | GSI Technology | - | SDR | 36 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8160Z18DGT-200I | 200 MHz | - | 2.7, 3.6 V | + 100 C | SDR | - | 2.3, 3 V | - 40 C | Yes | - | - | SMD/SMT | 18 Bit | 1 MWords | 1000000 | - | - | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | - | - | NOT SPECIFIED | 1.68 | Details | Yes | - | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | - | Industrial grade | -40 to 100 °C | Tray | GS8160Z18DGT | - | - | 3A991.B.2.B | NBT Pipeline/Flow Through | - | 100 °C | -40 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | - | Memory & Data Storage | CMOS | - | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | - | R-PQFP-G100 | - | - | 2.7 V | - | - | 2.3 V | 18 Mbit | 2 | SYNCHRONOUS | - | 215 mA | 6.5 ns | - | - | Flow-Through/Pipelined | 1 M x 18 | - | 1.6 mm | 18 | - | 20 b | SRAM | 18 Mbit | - | 18874368 bit | Industrial | PARALLEL | - | ZBT SRAM | - | SRAM | - | 20 mm | 14 mm | No | ||
GS8322Z36AD-200 GSI Technology | In Stock | - | - | 8 Weeks, 5 Days | - | BGA-165 | YES | - | 165 | 6.5 ns | - | GSI Technology | 200 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8322Z36AD-200 | 200 MHz | - | 2.7, 3.6 V | + 70 C | SDR | - | 2.3, 3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 70 °C | - | - | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | NOT SPECIFIED | 4.74 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | - | Commercial grade | 0 to 85 °C | Tray | GS8322Z36AD | e0 | No | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | - | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | - | 205 mA, 240 mA | 6.5 ns | - | - | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | - | 20 b | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | - | 15 mm | 13 mm | No | ||
GS8322Z36AD-150I GSI Technology | In Stock | - | - | 8 Weeks | - | BGA-165 | YES | - | 165 | 7.5 ns | - | GSI Technology | 150 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8322Z36AD-150I | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | - | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | - | NOT SPECIFIED | 1.59 | Compliant | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | 0.203046 oz | Industrial grade | -40 to 100 °C | Bulk | GS8322Z36AD | e0 | No | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | - | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | - | 210 mA, 220 mA | 7.5 ns | - | - | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | - | 15 mm | 13 mm | No | ||
GS8320Z18AGT-250I GSI Technology | In Stock | - | - | 8 Weeks | Surface Mount | 100-LQFP | YES | 100-TQFP (20x14) | 100 | - | GS8320Z | - | - | - | - | GSI TECHNOLOGY | Parallel | GSI Technology | GS8320Z18AGT-250I | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 85 C | Volatile | GSI Technology Inc. | 2.3, 3 V | - 40 C | - | - | - | SMD/SMT | 18 Bit | 2097152 words | 2000000 | - | - | Tray | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | - | Active | NOT SPECIFIED | 4.85 | - | Yes | TQFP | 3.6 V | 2.3 V | 2.5 V | Synchronous | - | 2.5, 3.3 V | - | - | -40 to 85 °C | - | - | - | - | 3A991.B.2.B | - | - | - | - | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | - | - | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | - | - | 2.7 V | - | - | 2.3 V | 36Mbit | - | SYNCHRONOUS | 250 MHz | 235 mA, 275 mA | 5.5@Flow-Through/2.5 | SRAM | Parallel | - | 2 M x 18 | - | 1.6 mm | 18 | - | - | - | - | - | 36 | - | PARALLEL | - | ZBT SRAM | - | - | 2M x 18 | 20 mm | 14 mm | - | ||
GS832032AGT-250 GSI Technology | In Stock | - | - | 8 Weeks | - | TQFP-100 | YES | - | 100 | 5.5 ns | - | GSI Technology | - | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832032AGT-250 | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | - | 2.3, 3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 32 Bit | 1 MWords | 1000000 | 85 °C | - | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | - | NOT SPECIFIED | 1.72 | Compliant | Yes | TQFP | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | - | Commercial grade | 0 to 85 °C | Bulk | GS832032AGT | - | - | 3A991.B.2.B | Pipeline/Flow Through | - | 85 °C | 0 °C | ALSO OPERATES AT 3.3; SYNCHRONOUS BURST | - | Memory & Data Storage | CMOS | - | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | - | 2.7 V | - | OTHER | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | - | 230 mA, 285 mA | 5.5 ns | - | - | Flow-Through/Pipelined | 1 M x 32 | - | 1.6 mm | 32 | - | 20 Bit | SRAM | 36 Mbit | - | 33554432 bit | Commercial | PARALLEL | - | CACHE SRAM | - | SRAM | - | 20 mm | 14 mm | No | ||
GS8342D18BGD-400I GSI Technology | In Stock | - | - | - | Surface Mount | BGA-165 | - | 165-FPBGA (13x15) | - | - | GS8342D | GSI Technology | - | QDR | 15 | - | Parallel | GSI Technology | - | 400 MHz | 400 MHz | 1.9 V | + 85 C | DDR | GSI Technology Inc. | 1.7 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | Details | - | FBGA | 1.9 V | 1.7 V | - | Synchronous | SigmaQuad-II | 1.8000 V | - | Industrial grade | -40 to 100 °C | Tray | GS8342D18BGD | - | - | - | SigmaQuad-II | - | - | - | - | - | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II | 1.7V ~ 1.9V | - | - | - | - | - | - | 165 | - | - | - | - | - | - | - | 36 Mbit | 2 | - | 400 MHz | 715 mA | - | SRAM | Parallel | Pipelined | 2 M x 18 | - | - | - | - | 19 Bit | SRAM | 36 Mbit | - | - | Industrial | - | - | - | - | SRAM | 2M x 18 | - | - | - | ||
GS832036AGT-333IV GSI Technology | In Stock | - | - | 8 Weeks | Surface Mount | TQFP-100 | YES | 100-TQFP (20x14) | 100 | 5 ns | GS832036 | GSI Technology | - | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832036AGT-333IV | 333 MHz | 200@Flow-Through/333@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | GSI Technology Inc. | 1.7, 2.3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | - | - | Tray | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | Active | NOT SPECIFIED | 5.66 | Details | Yes | TQFP | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | - | Industrial grade | -40 to 100 °C | Tray | GS832036AGT | - | - | 3A991.B.2.B | Synchronous Burst | - | - | - | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | - | Memory & Data Storage | SRAM - Synchronous, Standard | 1.7V ~ 2V, 2.3V ~ 2.7V | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | - | 2 V | - | - | 1.7 V | 36 Mbit | 4 | SYNCHRONOUS | 333 MHz | 290 mA, 375 mA | 5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | - | 1.6 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | - | 37748736 bit | Industrial | PARALLEL | - | CACHE SRAM | - | SRAM | 1M x 36 | 20 mm | 14 mm | - |