- Manufacturer Part Number
- Access Mode
- Access Time-Max
- Additional Feature
- Background Color
- Clock Frequency-Max (fCLK)
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- Interleaved Burst Length
- JESD-30 Code
Attribute column
Manufacturer
Infineon Memory Connectors - Accessories
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Material | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | ECCN Code | Type | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | I/O Type | Memory IC Type | Legend | Refresh Cycles | Background Color | Sequential Burst Length | Interleaved Burst Length | Access Mode | Language | Self Refresh | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 HYB18T512800BF-3S Infineon Technologies | In Stock | - | Datasheet | YES | - | 60 | 0.45 ns | 333 MHz | QIMONDA AG | - | HYB18T512800BF-3S | 3 | 67108864 words | 64000000 | 95 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA60,9X11,32 | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | 40 | 8.48 | - | Yes | 1.8 V | EAR99 | - | AUTO/SELF REFRESH | 8542.32.00.28 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 60 | R-PBGA-B60 | Not Qualified | 1.9 V | 1.8 V | OTHER | 1.7 V | 1 | SYNCHRONOUS | 0.152 mA | 64MX8 | 3-STATE | 1.2 mm | 8 | 0.007 A | 536870912 bit | COMMON | DDR DRAM | - | 8192 | - | 4,8 | 4,8 | FOUR BANK PAGE BURST | - | YES | 10.5 mm | 10 mm | ||
HYS72D64300GBR-6-C Infineon | In Stock | - | Datasheet | - | Aluminum | - | - | - | - | Brady | 126798 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-Compliant | - | - | - | Safety Signs | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Confined Space Follow Entry Procedures #__________ | - | White | - | - | - | English | - | - | - |