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IDT Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Package / Case | Number of Pins | Frequency(Max) | Memory Types | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Max Supply Current | Access Time | Organization | Output Characteristics | Address Bus Width | Density | Standby Current-Max | I/O Type | Sync/Async | Word Size | Standby Voltage-Min | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 71T75602S100BG8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 8 Weeks | Surface Mount | BGA | 119 | - | RAM, SRAM | Tape & Reel | 2012 | e0 | no | Active | 3 (168 Hours) | 119 | - | Tin/Lead (Sn63Pb37) | 70°C | 0°C | PIPELINED ARCHITECTURE | BOTTOM | BALL | 225 | 1 | 2.5V | - | 100MHz | - | 119 | 2.5V | - | COMMERCIAL | Parallel | 2.625V | 2.375V | - | 1 | 175mA | - | 5 ns | - | 3-STATE | 19b | 18 Mb | 0.04A | COMMON | Synchronous | 36b | 2.38V | - | 2.36mm | 14mm | 22mm | 2.15mm | No | RoHS Compliant | Contains Lead | ||
 71V3556SA133BG8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | BGA | 119 | 133MHz | RAM, SDR, SRAM | - | 2015 | e0 | no | Active | 3 (168 Hours) | 119 | - | Tin/Lead (Sn63Pb37) | 70°C | 0°C | - | BOTTOM | BALL | 225 | 1 | 3.3V | - | 133MHz | 20 | 119 | 3.3V | - | COMMERCIAL | Parallel | 3.465V | 3.135V | 512kB | 1 | 300mA | - | 4.2 ns | - | 3-STATE | 17b | 4.5 Mb | 0.04A | COMMON | Synchronous | 36b | - | - | 2.36mm | 14mm | 22mm | 2.15mm | No | RoHS Compliant | Contains Lead | ||
 7143LA25PFI8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | 100 | - | RAM, SRAM | Tape & Reel | 2013 | - | - | Active | - | - | - | - | 85°C | -40°C | - | - | - | - | - | - | - | - | - | - | 5V | - | - | Parallel | 5.5V | 4.5V | - | 2 | 300mA | - | 25 ns | - | - | 22b | 32 kb | - | - | Asynchronous | 16b | - | - | - | 14mm | 14mm | 1.4mm | - | RoHS Compliant | Contains Lead | ||
 71V3556SA133BQGI8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 11 Weeks | Surface Mount | - | 165 | - | RAM, SRAM | Tape & Reel | 2015 | e1 | yes | Active | 3 (168 Hours) | 165 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | - | BOTTOM | BALL | 260 | 1 | 3.3V | - | 133MHz | - | 165 | 3.3V | - | INDUSTRIAL | Parallel | 3.465V | 3.135V | - | 1 | 310mA | - | 4.2 ns | - | - | 17b | 4.5 Mb | - | - | Synchronous | 36b | - | - | - | 15mm | 13mm | 1.2mm | No | RoHS Compliant | Lead Free | ||
 71421SA55JI Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | PLCC | 52 | - | RAM, SDR, SRAM | - | 2008 | e0 | no | Active | 3 (168 Hours) | 52 | EAR99 | Tin/Lead (Sn85Pb15) | 85°C | -40°C | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | QUAD | J BEND | 225 | 1 | 5V | - | - | - | 52 | 5V | 5V | INDUSTRIAL | Parallel | 5.5V | 4.5V | 2kB | 2 | 190mA | - | 55 ns | - | 3-STATE | 22b | 16 kb | 0.03A | COMMON | Asynchronous | 8b | - | - | - | 19mm | 19mm | 3.63mm | No | RoHS Compliant | Contains Lead | ||
 71V3559S75BG8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | BGA | 119 | - | RAM, SRAM | Tape & Reel | 2009 | e0 | no | - | 3 (168 Hours) | 119 | - | Tin/Lead (Sn63Pb37) | 70°C | 0°C | - | BOTTOM | BALL | 225 | - | 3.3V | - | 100MHz | - | 119 | 3.3V | - | COMMERCIAL | Parallel | 3.465V | 3.135V | - | 1 | 275mA | - | 7.5 ns | - | 3-STATE | 18b | 4.5 Mb | 0.04A | COMMON | Synchronous | 18b | - | - | - | 14mm | 22mm | 2.15mm | No | RoHS Compliant | Contains Lead | ||
 7009L15PF8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | 100 | - | RAM, SRAM | Tape & Reel | 2008 | e0 | no | Active | 3 (168 Hours) | 100 | - | Tin/Lead (Sn85Pb15) | 70°C | 0°C | - | QUAD | GULL WING | 240 | 1 | 5V | 0.5mm | - | 20 | 100 | 5V | 5V | COMMERCIAL | Parallel | 5.5V | 4.5V | - | 2 | 340mA | - | 15 ns | - | 3-STATE | 17b | 1 Mb | 0.003A | COMMON | Asynchronous | 8b | - | - | 1.6mm | 14mm | 14mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 70V9389L12PRF8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | 128 | 83MHz | RAM, SDR, SRAM | - | 2005 | e0 | no | Active | 3 (168 Hours) | 128 | - | Tin/Lead (Sn85Pb15) | 70°C | -40°C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | QUAD | GULL WING | 225 | 1 | 3.3V | 0.5mm | 33.3MHz | - | 128 | 3.3V | - | COMMERCIAL | Parallel | 3.6V | 3V | 128kB | 2 | 200mA | - | 12 ns | 64KX18 | 3-STATE | 32b | 1.1 Mb | - | COMMON | Synchronous | 18b | 3V | - | 1.6mm | 20mm | 14mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 709279L9PF Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | 100 | - | RAM, SDR, SRAM | Bulk | 2009 | - | - | Active | - | - | - | - | 70°C | 0°C | - | - | - | - | - | - | - | 40MHz | - | - | 5V | - | - | Parallel | 5.5V | 4.5V | 64kB | 2 | 350mA | - | 9 ns | - | - | 30b | 512 kb | - | - | Synchronous | 16b | - | - | - | 14mm | 14mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 7026S15J Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | PLCC | 84 | - | RAM, SDR, SRAM | - | 2009 | e0 | no | Active | 1 (Unlimited) | 84 | EAR99 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | - | QUAD | J BEND | 225 | 1 | 5V | - | - | - | 84 | 5V | 5V | COMMERCIAL | Parallel | 5.5V | 4.5V | 32kB | 2 | 325mA | - | 15 ns | 16KX16 | 3-STATE | 28b | 256 kb | 0.015A | COMMON | Asynchronous | 16b | - | - | - | 29.21mm | 29.21mm | 3.63mm | No | RoHS Compliant | Contains Lead | ||
 70V26L25JI Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | PLCC | 84 | - | RAM, SDR, SRAM | - | 2009 | - | no | Active | - | - | EAR99 | - | 85°C | -40°C | - | - | - | - | - | - | - | - | - | 84 | 3.3V | - | - | Parallel | 3.6V | 3V | 32kB | 2 | 185mA | - | 25 ns | - | - | 28b | 256 kb | - | - | Asynchronous | 16b | - | - | - | 29.21mm | 29.21mm | 3.63mm | No | RoHS Compliant | Contains Lead | ||
 70V3579S4BF8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | - | 208 | - | RAM, SRAM | Tape & Reel | 2008 | e0 | no | Active | 3 (168 Hours) | 208 | - | Tin/Lead (Sn63Pb37) | 70°C | 0°C | PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE | BOTTOM | BALL | 225 | 1 | 3.3V | 0.8mm | 133MHz | 20 | 208 | 3.3V | - | COMMERCIAL | Parallel | 3.45V | 3.15V | - | 2 | 460mA | - | 4.2 ns | - | 3-STATE | 30b | 1.1 Mb | - | COMMON | Synchronous | 36b | - | - | - | 15mm | 15mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 70V9289L12PRF8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | 128 | 83MHz | RAM, SDR, SRAM | - | 2009 | e0 | no | Active | 3 (168 Hours) | 128 | - | Tin/Lead (Sn85Pb15) | 70°C | -40°C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | QUAD | GULL WING | 225 | 1 | 3.3V | 0.5mm | 33.3MHz | - | 128 | 3.3V | - | COMMERCIAL | Parallel | 3.6V | 3V | 128kB | 2 | 200mA | - | 12 ns | 64KX16 | 3-STATE | 32b | 1 Mb | - | COMMON | Synchronous | 16b | 3V | - | 1.6mm | 20mm | 14mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 70V7519S166DR Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | PQFP | 208 | - | RAM, SDR, SRAM | - | 2009 | e0 | no | Active | 3 (168 Hours) | 208 | - | Tin/Lead (Sn/Pb) | 70°C | 0°C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | QUAD | GULL WING | 225 | 1 | 3.3V | 0.5mm | 166MHz | 20 | 208 | 3.3V | - | INDUSTRIAL | Parallel | 3.45V | 3.15V | 1.1MB | 2 | 790mA | - | 20 ns | - | 3-STATE | 36b | 9 Mb | 0.03A | COMMON | Synchronous | 36b | - | - | 4.1mm | 28mm | 28mm | 3.5mm | No | RoHS Compliant | Contains Lead | ||
 7130LA20TF Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | 64 | - | RAM, SDR, SRAM | - | 2005 | - | - | Active | - | - | - | - | 70°C | 0°C | - | - | - | - | - | - | - | - | - | - | 5V | - | - | Parallel | 5.5V | 4.5V | 1kB | 2 | 200mA | - | 20 ns | - | - | 20b | 8 kb | - | - | Asynchronous | 8b | - | - | - | 10mm | 10mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 70V3389S6PRF Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | 128 | - | RAM, SDR, SRAM | - | 2009 | e0 | no | Active | 3 (168 Hours) | 128 | - | Tin/Lead (Sn85Pb15) | 70°C | 0°C | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | QUAD | GULL WING | 225 | 1 | 3.3V | 0.5mm | 83.3MHz | - | 128 | 3.3V | - | COMMERCIAL | Parallel | 3.45V | 3.15V | 128kB | 2 | 310mA | - | 6 ns | 64KX18 | 3-STATE | 32b | 1.1 Mb | 0.015A | COMMON | Synchronous | 18b | - | - | - | 20mm | 14mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 70V28L20PF8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | - | TQFP | 100 | - | RAM, SDR, SRAM | - | 2008 | - | - | Active | - | - | - | - | 70°C | 0°C | - | - | - | - | - | - | - | - | - | - | 3.3V | - | - | Parallel | 3.6V | 3V | 128kB | 2 | - | - | 20 ns | - | - | 32b | 1 Mb | - | - | - | - | - | - | - | 14mm | 14mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 70V631S15BC Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | - | 256 | - | RAM, SDR, SRAM | - | 2009 | e0 | no | Active | 3 (168 Hours) | 256 | - | Tin/Lead (Sn63Pb37) | 70°C | 0°C | - | BOTTOM | BALL | 225 | 1 | 3.3V | 1mm | - | - | 256 | 3.3V | - | COMMERCIAL | Parallel | 3.45V | 3.15V | 512kB | 2 | 440mA | - | 15 ns | - | 3-STATE | 18b | 4.5 Mb | 0.015A | COMMON | Asynchronous | 18b | - | - | 1.7mm | 17mm | 17mm | 1.4mm | No | RoHS Compliant | Contains Lead | ||
 70V3569S5DR Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | PQFP | 208 | - | RAM, SDR, SRAM | Bulk | 2008 | e0 | no | Active | 3 (168 Hours) | 208 | - | Tin/Lead (Sn/Pb) | 70°C | 0°C | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | QUAD | GULL WING | 225 | 1 | 3.3V | 0.5mm | 100MHz | - | 208 | 3.3V | - | COMMERCIAL | Parallel | 3.45V | 3.15V | 72kB | 2 | 360mA | - | 10 ns | 16KX36 | 3-STATE | 28b | 576 kb | 0.015A | COMMON | Synchronous | 36b | - | - | - | 28mm | 28mm | 3.5mm | No | RoHS Compliant | Contains Lead | ||
 70V7519S166BF8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | - | 208 | - | RAM, SDR, SRAM | - | 2009 | e0 | no | Active | 3 (168 Hours) | 208 | - | Tin/Lead (Sn63Pb37) | 70°C | 0°C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | BOTTOM | BALL | 225 | 1 | 3.3V | 0.8mm | 166MHz | - | 208 | 3.3V | - | COMMERCIAL | Parallel | 3.45V | 3.15V | 1.1MB | 2 | 790mA | 790mA | 20 ns | - | 3-STATE | 18b | 9 Mb | 0.015A | COMMON | Synchronous | 36b | - | 1.4mm | - | 15mm | 15mm | 1.4mm | No | RoHS Compliant | Contains Lead |