-

NO

48

70 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

2048 words

2000

70 °C

-

CERAMIC, METAL-SEALED COFIRED

DIP

0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-48

DIP48,.6

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

-

EAR99

TIN LEAD

BATTERY BACKUP OPERATION

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

48

R-CDIP-T48

Not Qualified

5.5 V

COMMERCIAL

4.5 V

2

ASYNCHRONOUS

-

2KX8

3-STATE

4.826 mm

8

0.015 A

16384 bit

-

PARALLEL

-

MULTI-PORT SRAM

4.5 V

-

60.96 mm

15.24 mm

-

YES

64

20 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

1024 words

1000

70 °C

-

PLASTIC/EPOXY

LQFP

LQFP, QFP64,.66SQ,32

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

Transferred

QFP

Yes

5 V

e3

Yes

EAR99

Matte Tin (Sn) - annealed

-

8542.32.00.41

QUAD

GULL WING

260

1

0.8 mm

compliant

30

64

S-PQFP-G64

Not Qualified

5.5 V

COMMERCIAL

4.5 V

2

ASYNCHRONOUS

0.25 mA

1KX8

3-STATE

1.6 mm

8

0.015 A

8192 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

-

14 mm

14 mm

-

NO

48

55 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

1024 words

1000

70 °C

-

PLASTIC/EPOXY

DIP

GREEN, PLASTIC, DIP-48

-

RECTANGULAR

IN-LINE

Obsolete

DIP

Yes

5 V

e3

-

EAR99

MATTE TIN

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

compliant

-

48

R-PDIP-T48

Not Qualified

5.5 V

COMMERCIAL

4.5 V

-

ASYNCHRONOUS

-

1KX8

-

5.08 mm

8

-

8192 bit

-

PARALLEL

-

MULTI-PORT SRAM

-

-

61.849 mm

15.24 mm

-

YES

256

4.2 ns

133 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

131072 words

128000

70 °C

-

CERAMIC, METAL-SEALED COFIRED

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Transferred

BGA

Yes

2.5 V

e1

Yes

3A991.B.2.A

Tin/Silver/Copper (Sn/Ag/Cu)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

BOTTOM

BALL

260

1

1 mm

compliant

30

256

S-CBGA-B256

Not Qualified

2.6 V

COMMERCIAL

2.4 V

2

SYNCHRONOUS

0.37 mA

128KX18

3-STATE

1.7 mm

18

0.015 A

2359296 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

2.4 V

-

17 mm

17 mm

-

NO

28

30 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

32768 words

32000

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

0.600 INCH, CERDIP-28

DIP28,.6

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

-

3A001.A.2.C

TIN LEAD

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

28

R-GDIP-T28

Not Qualified

5.5 V

MILITARY

4.5 V

1

ASYNCHRONOUS

0.125 mA

32KX8

3-STATE

5.08 mm

8

0.0005 A

262144 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

STANDARD SRAM

2 V

YES

37.211 mm

15.24 mm

-

YES

100

18 ns

83 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

16384 words

16000

70 °C

-

PLASTIC/EPOXY

LFQFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-64

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

3.3 V

e0

No

EAR99

Tin/Lead (Sn85Pb15)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

GULL WING

240

1

0.5 mm

not_compliant

20

100

S-PQFP-G100

Not Qualified

3.6 V

COMMERCIAL

3 V

2

SYNCHRONOUS

0.28 mA

16KX9

3-STATE

1.6 mm

9

0.003 A

147456 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

-

14 mm

14 mm

-

NO

24

55 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

16384 words

16000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

0.300 INCH, SIDE BRAZED, DIP-24

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

No

3A001.A.2.C

TIN LEAD

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

24

R-CDIP-T24

Not Qualified

5.5 V

MILITARY

4.5 V

1

ASYNCHRONOUS

0.11 mA

16KX4

3-STATE

5.08 mm

4

0.0006 A

65536 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

STANDARD SRAM

2 V

YES

30.607 mm

7.62 mm

-

YES

100

30 ns

40 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

32768 words

32000

70 °C

-

PLASTIC/EPOXY

LFQFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

3.3 V

e0

No

EAR99

Tin/Lead (Sn85Pb15)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

GULL WING

240

1

0.5 mm

not_compliant

20

100

S-PQFP-G100

Not Qualified

3.6 V

COMMERCIAL

3 V

2

SYNCHRONOUS

0.185 mA

32KX8

3-STATE

1.6 mm

8

0.003 A

262144 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

-

14 mm

14 mm

-

YES

68

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

1

8192 words

8000

125 °C

-55 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC68,1.0SQ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

Transferred

LCC

No

5 V

e0

No

3A001.A.2.C

TIN LEAD

-

8542.32.00.41

QUAD

J BEND

225

1

1.27 mm

not_compliant

20

68

S-PQCC-J68

Not Qualified

5.5 V

MILITARY

4.5 V

2

ASYNCHRONOUS

0.34 mA

8KX8

3-STATE

4.572 mm

8

0.03 A

65536 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

-

24.2062 mm

24.2062 mm

-

YES

208

10 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

15 X 15 MM, 1.40 MM PITCH, GREEN, FBGA-208

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

Yes

2.5 V

e1

Yes

3A991.B.2.A

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.32.00.41

BOTTOM

BALL

260

1

0.8 mm

unknown

30

208

S-PBGA-B208

Not Qualified

2.6 V

INDUSTRIAL

2.4 V

2

ASYNCHRONOUS

0.445 mA

128KX36

3-STATE

1.5 mm

36

0.02 A

4718592 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

2.4 V

-

15 mm

15 mm

-

YES

100

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

32768 words

32000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

-

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

Yes

3.3 V

e3

Yes

EAR99

Matte Tin (Sn)

-

8542.32.00.41

QUAD

GULL WING

NOT SPECIFIED

1

0.5 mm

compliant

NOT SPECIFIED

100

S-PQFP-G100

Not Qualified

3.6 V

INDUSTRIAL

3 V

-

ASYNCHRONOUS

-

32KX16

-

1.6 mm

16

-

524288 bit

-

PARALLEL

-

MULTI-PORT SRAM

-

-

14 mm

14 mm

-

YES

100

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

4096 words

4000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

LFQFP, QFP100,.63SQ,20

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Transferred

QFP

Yes

3.3 V

e3

Yes

EAR99

Matte Tin (Sn) - annealed

-

8542.32.00.41

QUAD

GULL WING

260

1

0.5 mm

compliant

30

100

S-PQFP-G100

Not Qualified

3.6 V

INDUSTRIAL

3 V

2

ASYNCHRONOUS

0.18 mA

4KX16

3-STATE

1.6 mm

16

0.0025 A

65536 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

-

14 mm

14 mm

-

NO

22

20 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

4096 words

4000

70 °C

-

PLASTIC/EPOXY

DIP

0.300 INCH, PLASTIC, DIP-22

DIP22,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

No

EAR99

TIN LEAD

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

22

R-PDIP-T22

Not Qualified

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

0.12 mA

4KX4

3-STATE

4.191 mm

4

0.02 A

16384 bit

-

PARALLEL

COMMON

STANDARD SRAM

4.5 V

YES

26.797 mm

7.62 mm

-

YES

64

55 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

1024 words

1000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

TQFP-64

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

Obsolete

QFP

No

5 V

e0

No

EAR99

TIN LEAD

-

8542.32.00.41

QUAD

GULL WING

240

1

0.8 mm

not_compliant

30

64

S-PQFP-G64

Not Qualified

5.5 V

INDUSTRIAL

4.5 V

2

ASYNCHRONOUS

0.14 mA

1KX8

3-STATE

1.6 mm

8

0.004 A

8192 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

-

14 mm

14 mm

-

NO

22

45 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

16384 words

16000

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP, DIP22,.3

DIP22,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

-

3A001.A.2.C

TIN LEAD

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

22

R-GDIP-T22

Not Qualified

5.5 V

MILITARY

4.5 V

1

ASYNCHRONOUS

0.14 mA

16KX4

3-STATE

5.08 mm

4

0.02 A

65536 bit

MIL-STD-883 Class B

PARALLEL

COMMON

STANDARD SRAM

4.5 V

NO

27.051 mm

7.62 mm

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

64

20 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

16384 words

16000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

LQFP, QFP64,.66SQ,32

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

Transferred

QFP

No

5 V

e0

No

EAR99

TIN LEAD

-

8542.32.00.41

QUAD

GULL WING

240

1

0.8 mm

not_compliant

30

64

S-PQFP-G64

Not Qualified

5.5 V

INDUSTRIAL

4.5 V

2

ASYNCHRONOUS

0.37 mA

16KX8

3-STATE

1.6 mm

8

0.03 A

131072 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

-

14 mm

14 mm

-

YES

20

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

16384 words

16000

70 °C

-

PLASTIC/EPOXY

SOJ

0.300 INCH, 1.27 MM PITCH, PLASTIC, SOJ-20

SOJ20,.34

RECTANGULAR

SMALL OUTLINE

Obsolete

SOJ

No

5 V

e0

-

EAR99

TIN LEAD

-

8542.32.00.41

DUAL

J BEND

-

1

1.27 mm

not_compliant

-

20

R-PDSO-J20

Not Qualified

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

0.1 mA

16KX1

3-STATE

3.556 mm

1

0.005 A

16384 bit

-

PARALLEL

SEPARATE

STANDARD SRAM

4.5 V

NO

12.8524 mm

7.5184 mm

-

NO

68

70 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

2048 words

2000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

CAVITY-UP, CERAMIC, PGA-68

PGA68,11X11

SQUARE

GRID ARRAY

Obsolete

PGA

No

5 V

e0

Yes

3A001.A.2.C

TIN LEAD

AUTOMATIC POWER-DOWN

8542.32.00.41

PERPENDICULAR

PIN/PEG

-

1

2.54 mm

not_compliant

-

68

S-CPGA-P68

Not Qualified

5.5 V

MILITARY

4.5 V

2

ASYNCHRONOUS

0.24 mA

2KX16

3-STATE

5.207 mm

16

0.004 A

32768 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

YES

29.464 mm

29.464 mm

-

YES

24

15 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

2048 words

2000

70 °C

-

PLASTIC/EPOXY

SOJ

0.300 INCH, 1.27 MM PITCH, SOJ-24

SOJ24,.34

RECTANGULAR

SMALL OUTLINE

Obsolete

SOJ

No

5 V

e0

-

EAR99

TIN LEAD

-

8542.32.00.41

DUAL

J BEND

225

1

1.27 mm

not_compliant

30

24

R-PDSO-J24

Not Qualified

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

0.14 mA

2KX8

3-STATE

3.76 mm

8

0.00002 A

16384 bit

-

PARALLEL

COMMON

STANDARD SRAM

2 V

YES

15.88 mm

7.62 mm