- Technology
- Series
- Operating Temperature
- Package / Case
- Supplier Device Package
- Access Time
- Memory Format
- Memory Interface
- Memory Size
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- Voltage - Supply
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Manufacturer
IDT Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Memory Types | Mfr | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Rohs Code | Supply Voltage-Nom (Vsup) | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Memory Format | Memory Interface | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Output Enable | Memory Organization | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 71V3559S85PF IDT | 597 |
| - | Surface Mount | 100-LQFP | - | 100-TQFP (14x14) | - | - | 71V3559 | - | - | Volatile | IDT, Integrated Device Technology Inc | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | 0°C ~ 70°C (TA) | - | - | - | - | - | - | - | - | - | SRAM - Synchronous, SDR (ZBT) | 3.135V ~ 3.465V | - | - | - | - | - | - | - | - | - | - | - | - | - | 4.5Mbit | - | - | - | 8.5 ns | SRAM | Parallel | - | - | - | - | - | - | - | - | - | - | - | - | - | 256K x 18 | - | - | ||
70V25L45J IDT | In Stock | - | - | Surface Mount | 84-LCC (J-Lead) | - | 84-PLCC (29.21x29.21) | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 70°C (TA) | Tube | -- | - | - | Obsolete | - | - | - | - | SRAM - Dual Port, Asynchronous | 3 V ~ 3.6 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 128Kb (8K x 16) | - | - | - | 45ns | SRAM | Parallel | - | - | - | - | 45ns | - | - | - | - | - | - | - | - | - | - | - | ||
7007S20JI8 IDT | In Stock | - | - | Surface Mount | 68-LCC (J-Lead) | - | 68-PLCC (24.21x24.21) | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 85°C (TA) | Tape & Reel (TR) | -- | - | - | Obsolete | - | - | - | - | SRAM - Dual Port, Asynchronous | 4.5 V ~ 5.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 256Kb (32K x 8) | - | - | - | 20ns | SRAM | Parallel | - | - | - | - | 20ns | - | - | - | - | - | - | - | - | - | - | - | ||
IDT6167SA70D Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | NO | - | 20 | 70 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | - | 16384 words | 16000 | 70 °C | - | - | CERAMIC | DIP | - | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | - | - | No | 5 V | - | - | - | e0 | No | - | EAR99 | TIN LEAD | - | 8542.32.00.41 | - | - | DUAL | THROUGH-HOLE | - | - | 2.54 mm | not_compliant | - | - | R-XDIP-T20 | Not Qualified | - | COMMERCIAL | - | - | - | ASYNCHRONOUS | - | - | - | - | 16KX1 | 3-STATE | - | 1 | - | - | 16384 bit | - | PARALLEL | SEPARATE | STANDARD SRAM | - | - | - | - | - | ||
 5962-8700206ZC Integrated Device Technology Inc | In Stock | - | - | - | - | NO | - | - | 90 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | - | 2048 words | 2000 | 125 °C | -55 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, | - | - | IN-LINE | Obsolete | DIP | - | - | 5 V | - | - | - | e0 | - | - | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | - | - | DUAL | THROUGH-HOLE | - | 1 | - | unknown | - | 48 | - | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | - | ASYNCHRONOUS | - | - | - | - | 2KX8 | - | - | 8 | - | - | 16384 bit | - | PARALLEL | - | MULTI-PORT SRAM | - | - | - | - | - | ||
IDT6198S25Y Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 24 | 25 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 3 | 16384 words | 16000 | 70 °C | - | - | PLASTIC/EPOXY | SOJ | 0.300 INCH, SOJ-24 | SOJ24,.34 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | - | No | 5 V | - | - | - | e0 | - | - | EAR99 | TIN LEAD | - | 8542.32.00.41 | - | - | DUAL | J BEND | 225 | 1 | 1.27 mm | not_compliant | 30 | 24 | R-PDSO-J24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | 1 | ASYNCHRONOUS | 0.125 mA | - | - | - | 16KX4 | 3-STATE | 3.76 mm | 4 | - | 0.015 A | 65536 bit | - | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | YES | - | 15.88 mm | 7.62 mm | ||
 IDT70T3519S133BCG Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 256 | 15 ns | - | 133 MHz | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 3 | 262144 words | 256000 | 70 °C | - | - | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Transferred | BGA | - | Yes | 2.5 V | - | - | - | e1 | Yes | - | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | - | - | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 30 | 256 | S-PBGA-B256 | Not Qualified | 2.6 V | COMMERCIAL | 2.4 V | - | 2 | SYNCHRONOUS | 0.37 mA | - | - | - | 256KX36 | 3-STATE | 1.7 mm | 36 | - | 0.015 A | 9437184 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 2.4 V | - | - | 17 mm | 17 mm | ||
 IDT7005L35PFGI Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 64 | 35 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 3 | 8192 words | 8000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | LQFP | LQFP, QFP64,.66SQ,32 | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Transferred | QFP | - | Yes | 5 V | - | - | - | e3 | Yes | - | EAR99 | MATTE TIN | - | 8542.32.00.41 | - | - | QUAD | GULL WING | 260 | 1 | 0.8 mm | compliant | 40 | 64 | S-PQFP-G64 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | - | 2 | ASYNCHRONOUS | 0.25 mA | - | - | - | 8KX8 | 3-STATE | 1.6 mm | 8 | - | 0.004 A | 65536 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 2 V | - | - | 14 mm | 14 mm | ||
 IDT7198L45CB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | NO | - | 24 | 45 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | - | 16384 words | 16000 | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | 0.300 INCH, SIDE BRAZED, DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | No | 5 V | - | - | - | e0 | No | - | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | - | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | 24 | R-CDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | 1 | ASYNCHRONOUS | 0.11 mA | - | - | - | 16KX4 | 3-STATE | 5.08 mm | 4 | - | 0.0006 A | 65536 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | - | 30.607 mm | 7.62 mm | ||
IDT8M624S60CB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | NO | - | 40 | 60 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | - | 65536 words | 64000 | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | - | DIP40,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | - | - | No | 5 V | - | - | - | e0 | - | - | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | - | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | - | R-CDMA-T40 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | - | ASYNCHRONOUS | 0.34 mA | - | - | - | 64KX16 | 3-STATE | - | 16 | - | 0.08 A | 1048576 bit | MIL-STD-883 Class B (Modified) | PARALLEL | COMMON | SRAM MODULE | 4.5 V | - | - | - | - | ||
 IDT70V24S25JI Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 84 | 25 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 1 | 4096 words | 4000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | No | 3.3 V | - | - | - | e0 | No | - | EAR99 | Tin/Lead (Sn85Pb15) | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 8542.32.00.41 | - | - | QUAD | J BEND | 225 | 1 | 2.54 mm | not_compliant | 30 | 84 | S-PQCC-J84 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | - | 2 | ASYNCHRONOUS | 0.19 mA | - | - | - | 4KX16 | 3-STATE | 4.572 mm | 16 | - | 0.005 A | 65536 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 3 V | - | - | 29.3116 mm | 29.3116 mm | ||
 IDT70V7288S25PF Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 100 | 25 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 3 | 65536 words | 64000 | 70 °C | - | - | PLASTIC/EPOXY | LFQFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | - | No | 3.3 V | - | - | - | e0 | - | - | EAR99 | Tin/Lead (Sn85Pb15) | - | 8542.32.00.41 | - | - | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 20 | 100 | S-PQFP-G100 | Not Qualified | 3.465 V | COMMERCIAL | 3.135 V | - | 2 | ASYNCHRONOUS | 0.25 mA | - | - | - | 64KX16 | 3-STATE | 1.6 mm | 16 | - | 0.006 A | 1048576 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 3.14 V | - | - | 14 mm | 14 mm | ||
IDT71V2577S85PF Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 100 | 8.5 ns | - | 86 MHz | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 3 | 131072 words | 128000 | 70 °C | - | - | PLASTIC/EPOXY | LQFP | 14 X 20 MM, PLASTIC, TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | - | No | 3.3 V | - | - | - | e0 | - | - | 3A991.B.2.A | Tin/Lead (Sn85Pb15) | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | - | - | QUAD | GULL WING | 225 | 1 | 0.65 mm | not_compliant | 20 | 100 | R-PQFP-G100 | Not Qualified | 3.465 V | COMMERCIAL | 3.135 V | - | - | SYNCHRONOUS | 0.18 mA | - | - | - | 128KX36 | 3-STATE | 1.6 mm | 36 | - | 0.03 A | 4718592 bit | - | PARALLEL | COMMON | CACHE SRAM | 3.14 V | - | - | 20 mm | 14 mm | ||
 IDT7165L35J Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 32 | 35 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 1 | 8192 words | 8000 | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | - | No | 5 V | - | - | - | e0 | - | - | EAR99 | TIN LEAD | - | 8542.32.00.41 | - | - | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 20 | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | 1 | ASYNCHRONOUS | 0.13 mA | - | - | - | 8KX8 | 3-STATE | 3.55 mm | 8 | - | 0.00006 A | 65536 bit | - | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | - | 13.97 mm | 11.43 mm | ||
IDT7005S55JB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 68 | 55 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 1 | 8192 words | 8000 | 125 °C | -55 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Transferred | LCC | - | No | 5 V | - | - | - | e0 | No | - | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | - | - | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 20 | 68 | S-PQCC-J68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | 2 | ASYNCHRONOUS | 0.3 mA | - | - | - | 8KX8 | 3-STATE | 4.572 mm | 8 | - | 0.03 A | 65536 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 4.5 V | - | - | 24.2062 mm | 24.2062 mm | ||
 IDT70V3399S133BFG Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 208 | 4.2 ns | - | 133 MHz | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 3 | 131072 words | 128000 | 70 °C | - | - | CERAMIC, METAL-SEALED COFIRED | LFBGA | LFBGA, BGA208,17X17,32 | BGA208,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Transferred | BGA | - | Yes | 3.3 V | - | - | - | e1 | Yes | - | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | - | - | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 30 | 208 | S-CBGA-B208 | Not Qualified | 3.45 V | COMMERCIAL | 3.15 V | - | 2 | SYNCHRONOUS | 0.4 mA | - | - | - | 128KX18 | 3-STATE | 1.7 mm | 18 | - | 0.03 A | 2359296 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 3.15 V | - | - | 15 mm | 15 mm | ||
IDT7130SA45L52 Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 52 | 45 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | - | 1024 words | 1000 | 70 °C | - | - | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC52,.75SQ | LCC52,.75SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | No | 5 V | - | - | - | e0 | No | - | EAR99 | TIN LEAD | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 8542.32.00.41 | - | - | QUAD | NO LEAD | - | 1 | 1.27 mm | not_compliant | - | 52 | S-CQCC-N52 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | 2 | ASYNCHRONOUS | 0.19 mA | - | - | - | 1KX8 | 3-STATE | 2.2098 mm | 8 | - | 0.015 A | 8192 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 4.5 V | YES | - | 19.05 mm | 19.05 mm | ||
IDT7005L20JB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | YES | - | 68 | 20 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 1 | 8192 words | 8000 | 125 °C | -55 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Transferred | LCC | - | No | 5 V | - | - | - | e0 | No | - | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | - | - | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 20 | 68 | S-PQCC-J68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | 2 | ASYNCHRONOUS | 0.32 mA | - | - | - | 8KX8 | 3-STATE | 4.572 mm | 8 | - | 0.004 A | 65536 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 2 V | - | - | 24.2062 mm | 24.2062 mm | ||
IDT8M824S45CB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | NO | - | 32 | 45 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | - | 131072 words | 128000 | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | - | DIP32,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | - | - | No | 5 V | - | - | - | e0 | - | - | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | - | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | - | R-CDMA-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | - | ASYNCHRONOUS | 0.265 mA | - | - | - | 128KX8 | 3-STATE | - | 8 | - | 0.08 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | SRAM MODULE | 4.5 V | - | - | - | - | ||
IDT7198S35DB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | NO | - | 24 | 35 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | - | 16384 words | 16000 | 125 °C | -55 °C | - | CERAMIC, GLASS-SEALED | DIP | 0.300 INCH, CERDIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | No | 5 V | - | - | - | e0 | - | - | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | - | - | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | 24 | R-GDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | 1 | ASYNCHRONOUS | 0.14 mA | - | - | - | 16KX4 | 3-STATE | 5.08 mm | 4 | - | 0.02 A | 65536 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | YES | - | 32.004 mm | 7.62 mm |