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6623 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Surface Mount

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

Ihs Manufacturer

Moisture Sensitivity Levels

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Rohs Code

Supply Voltage-Nom (Vsup)

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Number of Ports

Operating Mode

Supply Current-Max

Organization

Output Characteristics

Seated Height-Max

Memory Width

Standby Current-Max

Memory Density

Screening Level

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Output Enable

Length

Width

IDT70V27S25PFI
IDT70V27S25PFI

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

100

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

32768 words

32000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

-

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

3.3 V

e0

No

EAR99

Tin/Lead (Sn/Pb)

-

8542.32.00.41

QUAD

GULL WING

NOT SPECIFIED

1

0.5 mm

compliant

NOT SPECIFIED

100

S-PQFP-G100

Not Qualified

3.6 V

INDUSTRIAL

3 V

-

ASYNCHRONOUS

-

32KX16

-

1.6 mm

16

-

524288 bit

-

PARALLEL

-

MULTI-PORT SRAM

-

-

14 mm

14 mm

IDT71256L20TP
IDT71256L20TP

Integrated Device Technology Inc

In Stock

-

Datasheet

NO

28

20 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

32768 words

32000

70 °C

-

PLASTIC/EPOXY

DIP

0.300 INCH, PLASTIC, DIP-28

DIP28,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

-

EAR99

Tin/Lead (Sn85Pb15)

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

28

R-PDIP-T28

Not Qualified

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

0.135 mA

32KX8

3-STATE

4.57 mm

8

0.00012 A

262144 bit

-

PARALLEL

COMMON

STANDARD SRAM

2 V

YES

34.67 mm

7.62 mm

IDT7142SA90L52
IDT7142SA90L52

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

52

90 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

2048 words

2000

70 °C

-

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC-52

LCC52,.75SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5 V

e0

No

EAR99

TIN LEAD

AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

NO LEAD

-

1

1.27 mm

not_compliant

-

52

S-CQCC-N52

Not Qualified

5.5 V

COMMERCIAL

4.5 V

2

ASYNCHRONOUS

0.18 mA

2KX8

3-STATE

2.2098 mm

8

0.015 A

16384 bit

MIL-STD-883 Class B (Modified)

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

YES

19.05 mm

19.05 mm

IDT71V546S117PFI
IDT71V546S117PFI

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

100

4.5 ns

117 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

14 X 20 MM, PLASTIC, TQFP-100

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

Obsolete

QFP

No

3.3 V

e0

No

3A991.B.2.A

Tin/Lead (Sn85Pb15)

-

8542.32.00.41

QUAD

GULL WING

225

1

0.65 mm

not_compliant

20

100

R-PQFP-G100

Not Qualified

3.465 V

INDUSTRIAL

3.135 V

-

SYNCHRONOUS

0.285 mA

128KX36

3-STATE

1.6 mm

36

0.045 A

4718592 bit

-

PARALLEL

COMMON

ZBT SRAM

3.14 V

-

20 mm

14 mm

IDT7198L45CB
IDT7198L45CB

Integrated Device Technology Inc

In Stock

-

Datasheet

NO

24

45 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

16384 words

16000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

0.300 INCH, SIDE BRAZED, DIP-24

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

No

3A001.A.2.C

TIN LEAD

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

24

R-CDIP-T24

Not Qualified

5.5 V

MILITARY

4.5 V

1

ASYNCHRONOUS

0.11 mA

16KX4

3-STATE

5.08 mm

4

0.0006 A

65536 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

STANDARD SRAM

2 V

YES

30.607 mm

7.62 mm

IDT70V7288S25PF
IDT70V7288S25PF

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

100

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

65536 words

64000

70 °C

-

PLASTIC/EPOXY

LFQFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

3.3 V

e0

-

EAR99

Tin/Lead (Sn85Pb15)

-

8542.32.00.41

QUAD

GULL WING

240

1

0.5 mm

not_compliant

20

100

S-PQFP-G100

Not Qualified

3.465 V

COMMERCIAL

3.135 V

2

ASYNCHRONOUS

0.25 mA

64KX16

3-STATE

1.6 mm

16

0.006 A

1048576 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3.14 V

-

14 mm

14 mm

IDT71V2577S85PF
IDT71V2577S85PF

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

100

8.5 ns

86 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

131072 words

128000

70 °C

-

PLASTIC/EPOXY

LQFP

14 X 20 MM, PLASTIC, TQFP-100

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

Obsolete

QFP

No

3.3 V

e0

-

3A991.B.2.A

Tin/Lead (Sn85Pb15)

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

QUAD

GULL WING

225

1

0.65 mm

not_compliant

20

100

R-PQFP-G100

Not Qualified

3.465 V

COMMERCIAL

3.135 V

-

SYNCHRONOUS

0.18 mA

128KX36

3-STATE

1.6 mm

36

0.03 A

4718592 bit

-

PARALLEL

COMMON

CACHE SRAM

3.14 V

-

20 mm

14 mm

IDT71321SA55PFG
IDT71321SA55PFG

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

64

55 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

2048 words

2000

70 °C

-

PLASTIC/EPOXY

LQFP

LQFP, QFP64,.66SQ,32

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

Transferred

QFP

Yes

5 V

e3

Yes

EAR99

Matte Tin (Sn) - annealed

AUTOMATIC POWER DOWN

8542.32.00.41

QUAD

GULL WING

260

1

0.8 mm

compliant

30

64

S-PQFP-G64

Not Qualified

5.5 V

COMMERCIAL

4.5 V

2

ASYNCHRONOUS

0.155 mA

2KX8

3-STATE

1.6 mm

8

0.015 A

16384 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

-

14 mm

14 mm

IDT71256S25L32B
IDT71256S25L32B

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

32

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

32768 words

32000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC-32

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

Obsolete

QFJ

No

5 V

e0

-

3A001.A.2.C

TIN LEAD

-

8542.32.00.41

QUAD

NO LEAD

-

1

1.27 mm

not_compliant

-

32

R-CQCC-N32

Not Qualified

5.5 V

MILITARY

4.5 V

1

ASYNCHRONOUS

0.15 mA

32KX8

3-STATE

3.048 mm

8

0.02 A

262144 bit

MIL-STD-883 Class B

PARALLEL

COMMON

STANDARD SRAM

4.5 V

YES

13.97 mm

11.43 mm

71V67703S75PF
71V67703S75PF

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

100

7.5 ns

117 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

262144 words

256000

70 °C

-

PLASTIC/EPOXY

LQFP

14 X 20 MM, 1.40 MM, PLASTIC, TQFP-100

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

Obsolete

QFP

No

3.3 V

e0

-

3A991.B.2.A

Tin/Lead (Sn85Pb15)

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

QUAD

GULL WING

225

1

0.65 mm

not_compliant

20

100

R-PQFP-G100

Not Qualified

3.465 V

COMMERCIAL

3.135 V

-

SYNCHRONOUS

0.265 mA

256KX36

3-STATE

1.6 mm

36

0.05 A

9437184 bit

-

PARALLEL

COMMON

CACHE SRAM

3.14 V

-

20 mm

14 mm

IDT70V24S25JI
IDT70V24S25JI

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

84

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

1

4096 words

4000

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC84,1.2SQ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

3.3 V

e0

No

EAR99

Tin/Lead (Sn85Pb15)

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

8542.32.00.41

QUAD

J BEND

225

1

2.54 mm

not_compliant

30

84

S-PQCC-J84

Not Qualified

3.6 V

INDUSTRIAL

3 V

2

ASYNCHRONOUS

0.19 mA

4KX16

3-STATE

4.572 mm

16

0.005 A

65536 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

-

29.3116 mm

29.3116 mm

IDT8M624S60CB
IDT8M624S60CB

Integrated Device Technology Inc

In Stock

-

Datasheet

NO

40

60 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

65536 words

64000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

-

DIP40,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Obsolete

-

No

5 V

e0

-

3A001.A.2.C

TIN LEAD

TTL COMPATIBLE INPUTS/OUTPUTS

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

-

R-CDMA-T40

Not Qualified

5.5 V

MILITARY

4.5 V

-

ASYNCHRONOUS

0.34 mA

64KX16

3-STATE

-

16

0.08 A

1048576 bit

MIL-STD-883 Class B (Modified)

PARALLEL

COMMON

SRAM MODULE

4.5 V

-

-

-

IDT7005S55JB
IDT7005S55JB

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

68

55 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

1

8192 words

8000

125 °C

-55 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC68,1.0SQ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

Transferred

LCC

No

5 V

e0

No

3A001.A.2.C

TIN LEAD

-

8542.32.00.41

QUAD

J BEND

225

1

1.27 mm

not_compliant

20

68

S-PQCC-J68

Not Qualified

5.5 V

MILITARY

4.5 V

2

ASYNCHRONOUS

0.3 mA

8KX8

3-STATE

4.572 mm

8

0.03 A

65536 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

-

24.2062 mm

24.2062 mm

IDT70V3399S133BFG
IDT70V3399S133BFG

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

208

4.2 ns

133 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

131072 words

128000

70 °C

-

CERAMIC, METAL-SEALED COFIRED

LFBGA

LFBGA, BGA208,17X17,32

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Transferred

BGA

Yes

3.3 V

e1

Yes

3A991.B.2.A

Tin/Silver/Copper (Sn/Ag/Cu)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

BOTTOM

BALL

260

1

0.8 mm

compliant

30

208

S-CBGA-B208

Not Qualified

3.45 V

COMMERCIAL

3.15 V

2

SYNCHRONOUS

0.4 mA

128KX18

3-STATE

1.7 mm

18

0.03 A

2359296 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3.15 V

-

15 mm

15 mm

IDT7198S35DB
IDT7198S35DB

Integrated Device Technology Inc

In Stock

-

Datasheet

NO

24

35 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

16384 words

16000

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

0.300 INCH, CERDIP-24

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

-

3A001.A.2.C

Tin/Lead (Sn/Pb)

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

not_compliant

-

24

R-GDIP-T24

Not Qualified

5.5 V

MILITARY

4.5 V

1

ASYNCHRONOUS

0.14 mA

16KX4

3-STATE

5.08 mm

4

0.02 A

65536 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

STANDARD SRAM

4.5 V

YES

32.004 mm

7.62 mm

IDT70V9089S7PF
IDT70V9089S7PF

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

100

18 ns

83 MHz

INTEGRATED DEVICE TECHNOLOGY INC

3

65536 words

64000

70 °C

-

PLASTIC/EPOXY

LFQFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Transferred

QFP

No

3.3 V

e0

No

3A991.B.2.B

Tin/Lead (Sn85Pb15)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

GULL WING

240

1

0.5 mm

not_compliant

20

100

S-PQFP-G100

Not Qualified

3.6 V

COMMERCIAL

3 V

2

SYNCHRONOUS

0.335 mA

64KX8

3-STATE

1.6 mm

8

0.005 A

524288 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

-

14 mm

14 mm

IDT6116SA20PGI
IDT6116SA20PGI

Integrated Device Technology Inc

In Stock

-

Datasheet

NO

24

19 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

2048 words

2000

85 °C

-40 °C

PLASTIC/EPOXY

DIP

0.600 INCH, PLASTIC, DIP-24

DIP24,.6

RECTANGULAR

IN-LINE

Obsolete

DIP

Yes

5 V

e3

-

EAR99

MATTE TIN

-

8542.32.00.41

DUAL

THROUGH-HOLE

-

1

2.54 mm

unknown

-

24

R-PDIP-T24

Not Qualified

5.5 V

INDUSTRIAL

4.5 V

-

ASYNCHRONOUS

0.105 mA

2KX8

3-STATE

4.699 mm

8

0.002 A

16384 bit

-

PARALLEL

COMMON

STANDARD SRAM

4.5 V

-

31.75 mm

15.24 mm

IDT70V7288L25PF
IDT70V7288L25PF

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

100

25 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

65536 words

64000

70 °C

-

PLASTIC/EPOXY

LFQFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

3.3 V

e0

-

EAR99

Tin/Lead (Sn85Pb15)

-

8542.32.00.41

QUAD

GULL WING

240

1

0.5 mm

not_compliant

20

100

S-PQFP-G100

Not Qualified

3.465 V

COMMERCIAL

3.135 V

2

ASYNCHRONOUS

0.2 mA

64KX16

3-STATE

1.6 mm

16

0.003 A

1048576 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

3.14 V

-

14 mm

14 mm

IDT71V321L35TFI
IDT71V321L35TFI

Integrated Device Technology Inc

In Stock

-

Datasheet

YES

64

35 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

3

2048 words

2000

85 °C

-40 °C

PLASTIC/EPOXY

QFP

-

QFP64,.47SQ,20

SQUARE

FLATPACK

Obsolete

-

No

3.3 V

e0

No

EAR99

Tin/Lead (Sn85Pb15)

-

8542.32.00.41

QUAD

GULL WING

240

-

0.5 mm

not_compliant

30

-

S-PQFP-G64

Not Qualified

-

INDUSTRIAL

-

2

ASYNCHRONOUS

0.095 mA

2KX8

3-STATE

-

8

0.004 A

16384 bit

-

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

-

-

-

IDT7026L20GB
IDT7026L20GB

Integrated Device Technology Inc

In Stock

-

Datasheet

NO

84

20 ns

-

INTEGRATED DEVICE TECHNOLOGY INC

-

16384 words

16000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

PGA, PGA84M,11X11

PGA84M,11X11

SQUARE

GRID ARRAY

Transferred

PGA

No

5 V

e0

No

3A001.A.2.C

TIN LEAD

16K X 16 DUAL PORT SRAM

8542.32.00.41

PERPENDICULAR

PIN/PEG

-

1

2.54 mm

not_compliant

-

84

S-CPGA-P84

Not Qualified

5.5 V

MILITARY

4.5 V

2

ASYNCHRONOUS

0.315 mA

16KX16

3-STATE

5.207 mm

16

0.01 A

262144 bit

MIL-PRF-38535

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

-

27.94 mm

27.94 mm