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IDT Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Frequency(Max) | Ihs Manufacturer | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Max Supply Current | Supply Current-Max | Access Time | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Standby Voltage-Min | Output Enable | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
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 IDT6116LA35L24B Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | 24 | 35 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC-24 | LCC24,.3X.4 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | - | - | e0 | No | - | - | - | 3A001.A.2.C | TIN LEAD | - | - | - | 8542.32.00.41 | QUAD | NO LEAD | - | 1 | - | 1.27 mm | not_compliant | - | - | 24 | R-CQCC-N24 | Not Qualified | - | 5.5 V | - | MILITARY | 4.5 V | - | - | - | - | 1 | - | ASYNCHRONOUS | - | 0.105 mA | - | 2KX8 | 3-STATE | 3.048 mm | 8 | - | - | 0.0002 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | - | - | STANDARD SRAM | 2 V | YES | - | 10.16 mm | 7.62 mm | - | - | - | - | ||
 IDT61970L20Y Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | 24 | 20 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 3 | 4096 words | 4000 | 70 °C | - | PLASTIC/EPOXY | SOJ | 0.300 INCH, SOJ-24 | SOJ24,.34 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | No | 5 V | - | - | e0 | - | - | - | - | EAR99 | TIN LEAD | - | - | - | 8542.32.00.41 | DUAL | J BEND | 225 | 1 | - | 1.27 mm | not_compliant | - | 30 | 24 | R-PDSO-J24 | Not Qualified | - | 5.5 V | - | COMMERCIAL | 4.5 V | - | - | - | - | 1 | - | ASYNCHRONOUS | - | 0.1 mA | - | 4KX4 | 3-STATE | 3.76 mm | 4 | - | - | 0.00002 A | 16384 bit | - | PARALLEL | COMMON | - | - | STANDARD SRAM | 2 V | YES | - | 15.88 mm | 7.62 mm | - | - | - | - | ||
 7130SA25JGI8 Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | 52 | 25 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 1 | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC52,.8SQ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 5 V | - | - | e3 | Yes | - | - | - | EAR99 | Matte Tin (Sn) - annealed | - | - | - | 8542.32.00.41 | QUAD | J BEND | 260 | 1 | - | 1.27 mm | compliant | - | 30 | 52 | S-PQCC-J52 | Not Qualified | - | 5.5 V | - | INDUSTRIAL | 4.5 V | - | - | - | - | 2 | - | ASYNCHRONOUS | - | 0.22 mA | - | 1KX8 | 3-STATE | - | 8 | - | - | 0.03 A | 8192 bit | - | PARALLEL | COMMON | - | - | MULTI-PORT SRAM | 4.5 V | - | - | - | - | - | - | - | - | ||
IDT7133L70XCB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | NO | - | 68 | 70 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | SDIP | 0.600 INCH, 0.070 INCH PITCH, SIDE BRAZED, SDIP-68 | SDIP68,.6 | RECTANGULAR | IN-LINE, SHRINK PITCH | Obsolete | DIP | No | 5 V | - | - | e0 | No | - | - | - | 3A001.A.2.C | TIN LEAD | - | - | AUTOMATIC POWER-DOWN | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | - | 1.778 mm | not_compliant | - | - | 68 | R-CDIP-T68 | Not Qualified | - | 5.5 V | - | MILITARY | 4.5 V | - | - | - | - | 2 | - | ASYNCHRONOUS | - | 0.24 mA | - | 2KX16 | 3-STATE | 4.826 mm | 16 | - | - | 0.004 A | 32768 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | - | - | MULTI-PORT SRAM | 2 V | YES | - | 61.214 mm | 15.24 mm | - | - | - | - | ||
 IDT7164L25TC Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | NO | - | 28 | 25 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 8192 words | 8000 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | 0.300 INCH, THIN, SIDE BRAZED, DIP-28 | DIP28,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | - | - | e0 | No | - | - | - | EAR99 | TIN LEAD | - | - | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | - | 2.54 mm | not_compliant | - | - | 28 | R-CDIP-T28 | Not Qualified | - | 5.5 V | - | COMMERCIAL | 4.5 V | - | - | - | - | 1 | - | ASYNCHRONOUS | - | 0.15 mA | - | 8KX8 | 3-STATE | 5.08 mm | 8 | - | - | 0.00006 A | 65536 bit | - | PARALLEL | COMMON | - | - | STANDARD SRAM | 2 V | YES | - | 35.56 mm | 7.62 mm | - | - | - | - | ||
 IDT7132SA55PG Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | NO | - | 48 | 55 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 2048 words | 2000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP48,.6 | DIP48,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 5 V | - | - | e3 | Yes | - | - | - | EAR99 | MATTE TIN | - | - | AUTOMATIC POWER DOWN | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | - | 2.54 mm | compliant | - | - | 48 | R-PDIP-T48 | Not Qualified | - | 5.5 V | - | COMMERCIAL | 4.5 V | - | - | - | - | 2 | - | ASYNCHRONOUS | - | 0.155 mA | - | 2KX8 | 3-STATE | 5.08 mm | 8 | - | - | 0.015 A | 16384 bit | - | PARALLEL | COMMON | - | - | MULTI-PORT SRAM | 4.5 V | - | - | 61.849 mm | 15.24 mm | - | - | - | - | ||
 IDT71V3576S166PF Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | 100 | 3.5 ns | 166 MHz | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 3 | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | LQFP | 14 X 20 MM, PLASTIC, TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | - | - | e0 | No | - | - | - | 3A991.B.2.A | Tin/Lead (Sn85Pb15) | - | - | ALSO REQUIRES 3.3V I/O SUPPLY | 8542.32.00.41 | QUAD | GULL WING | 225 | 1 | - | 0.65 mm | not_compliant | - | 20 | 100 | R-PQFP-G100 | Not Qualified | - | 3.465 V | - | COMMERCIAL | 3.135 V | - | - | - | - | - | - | SYNCHRONOUS | - | 0.32 mA | - | 128KX36 | 3-STATE | 1.6 mm | 36 | - | - | 0.02 A | 4718592 bit | - | PARALLEL | COMMON | - | - | CACHE SRAM | 3.14 V | - | - | 20 mm | 14 mm | - | - | - | - | ||
IDT6116SA120L32B Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | 32 | 120 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC-32 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | - | - | e0 | - | - | - | - | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | - | - | 8542.32.00.41 | QUAD | NO LEAD | - | 1 | - | 1.27 mm | not_compliant | - | - | 32 | R-CQCC-N32 | Not Qualified | - | 5.5 V | - | MILITARY | 4.5 V | - | - | - | - | 1 | - | ASYNCHRONOUS | - | 0.1 mA | - | 2KX8 | 3-STATE | 3.048 mm | 8 | - | - | 0.01 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | - | - | STANDARD SRAM | 4.5 V | YES | - | 13.97 mm | 11.43 mm | - | - | - | - | ||
 IDT7187L25DB Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | NO | - | 22 | 25 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | 0.300 INCH, CERAMIC, DIP-22 | DIP22,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | - | - | e0 | - | - | - | - | 3A001.A.2.C | TIN LEAD | - | - | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | - | 2.54 mm | not_compliant | - | - | 22 | R-GDIP-T22 | Not Qualified | - | 5.5 V | - | MILITARY | 4.5 V | - | - | - | - | 1 | - | ASYNCHRONOUS | - | 0.11 mA | - | 64KX1 | 3-STATE | 5.08 mm | 1 | - | - | 0.0006 A | 65536 bit | MIL-STD-883 Class B | PARALLEL | SEPARATE | - | - | STANDARD SRAM | 2 V | NO | - | 27.051 mm | 7.62 mm | - | - | - | - | ||
 IDT7164L45L28 Integrated Device Technology Inc | In Stock | - | Datasheet | - | - | - | YES | - | 28 | 45 ns | - | - | INTEGRATED DEVICE TECHNOLOGY INC | - | - | 8192 words | 8000 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC-28 | LCC28,.45SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | - | - | e0 | No | - | - | - | EAR99 | TIN LEAD | - | - | - | 8542.32.00.41 | QUAD | NO LEAD | - | 1 | - | 1.27 mm | not_compliant | - | - | 28 | S-CQCC-N28 | Not Qualified | - | 5.5 V | - | COMMERCIAL | 4.5 V | - | - | - | - | 1 | - | ASYNCHRONOUS | - | 0.12 mA | - | 8KX8 | 3-STATE | 2.54 mm | 8 | - | - | 0.00006 A | 65536 bit | - | PARALLEL | COMMON | - | - | STANDARD SRAM | 2 V | YES | - | 11.43 mm | 11.43 mm | - | - | - | - | ||
 71124S12YG Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | - | - | 32 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2009 | e3 | yes | Active | 3 (168 Hours) | 32 | - | Matte Tin (Sn) - annealed | 70°C | 0°C | - | - | DUAL | J BEND | 260 | 1 | 5V | - | - | - | - | 32 | - | - | 5V | - | 5V | COMMERCIAL | - | Parallel | 5.5V | 4.5V | 128kB | 1 | 160mA | - | - | - | 12 ns | - | 3-STATE | - | - | 17b | 1 Mb | - | - | - | - | COMMON | Asynchronous | 8b | - | - | - | 3.683mm | 20.9mm | 10.2mm | 2.2mm | No | RoHS Compliant | Lead Free | ||
 71V124SA12TYG Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | - | - | 32 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2013 | e3 | yes | Active | 3 (168 Hours) | 32 | - | Matte Tin (Sn) - annealed | 70°C | 0°C | - | - | DUAL | J BEND | 260 | 1 | 3.3V | - | - | - | - | 32 | - | - | 3.3V | - | - | COMMERCIAL | - | Parallel | 3.6V | 3V | 128kB | 1 | 130mA | - | - | - | 12 ns | - | 3-STATE | - | - | 17b | 1 Mb | - | - | - | - | COMMON | Asynchronous | 8b | - | 3V | - | 3.7592mm | 21.95mm | 7.6mm | 2.67mm | No | RoHS Compliant | Lead Free | ||
 71V016SA10PHGI Integrated Device Technology (IDT) | 20 | - | Datasheet | 12 Weeks | Surface Mount | TSOP | - | 44 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2011 | e3 | yes | Active | 3 (168 Hours) | 44 | - | Matte Tin (Sn) - annealed | 85°C | -40°C | - | - | DUAL | GULL WING | 260 | 1 | 3.3V | 0.8mm | - | - | 30 | 44 | - | - | 3.3V | - | - | INDUSTRIAL | - | Parallel | 3.6V | 3.15V | 128kB | 1 | - | - | - | - | 10 ns | - | 3-STATE | - | - | 16b | 1 Mb | - | - | - | - | COMMON | Asynchronous | 16b | - | - | - | - | 18.41mm | 10.16mm | 1mm | No | RoHS Compliant | Lead Free | ||
 71V424L15PHGI Integrated Device Technology (IDT) | In Stock | - | Datasheet | 12 Weeks | Surface Mount | TSOP | - | 44 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2008 | e3 | yes | Active | 3 (168 Hours) | 44 | - | Matte Tin (Sn) - annealed | 85°C | -40°C | - | - | DUAL | GULL WING | 260 | 1 | 3.3V | 0.8mm | - | - | 30 | 44 | - | Not Qualified | 3.3V | - | - | INDUSTRIAL | - | Parallel | 3.6V | 3V | 512kB | 1 | 145mA | - | - | - | 15 ns | - | 3-STATE | - | - | 19b | 4 Mb | - | - | - | - | COMMON | Asynchronous | 8b | - | 3V | - | - | 18.41mm | 10.16mm | 1mm | - | RoHS Compliant | Lead Free | ||
 71256SA15YG Integrated Device Technology (IDT) | In Stock | - | Datasheet | 8 Weeks | Surface Mount | - | - | 28 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2011 | e3 | yes | Active | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) - annealed | 70°C | 0°C | - | - | DUAL | J BEND | 260 | 1 | 5V | - | - | - | - | 28 | - | - | 5V | - | 5V | COMMERCIAL | - | Parallel | 5.5V | 4.5V | 32kB | 1 | 150mA | - | 150mA | - | 15 ns | 32KX8 | 3-STATE | - | - | 15b | 256 kb | - | - | - | - | COMMON | Asynchronous | 8b | - | - | - | 3.556mm | 17.9mm | 7.6mm | 2.67mm | No | RoHS Compliant | Lead Free | ||
 71V424L12PHGI Integrated Device Technology (IDT) | 17 | - | Datasheet | 12 Weeks | Surface Mount | TSOP | - | 44 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2008 | e3 | yes | Active | 3 (168 Hours) | 44 | - | Matte Tin (Sn) - annealed | 85°C | -40°C | - | - | DUAL | GULL WING | 260 | 1 | 3.3V | 0.8mm | - | - | 30 | 44 | - | - | 3.3V | - | - | INDUSTRIAL | - | Parallel | 3.6V | 3V | 512kB | 1 | 155mA | - | - | - | 12 ns | - | 3-STATE | - | - | 19b | 4 Mb | - | - | - | - | COMMON | Asynchronous | 8b | - | 3V | - | - | 18.41mm | 10.16mm | 1mm | No | RoHS Compliant | Lead Free | ||
 71016S12YG Integrated Device Technology (IDT) | 61 | - | Datasheet | 12 Weeks | Surface Mount | - | - | 44 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2013 | e3 | yes | Active | 3 (168 Hours) | 44 | - | Matte Tin (Sn) - annealed | 70°C | 0°C | - | - | DUAL | J BEND | 260 | 1 | 5V | - | - | - | - | 44 | - | - | 5V | - | 5V | COMMERCIAL | - | Parallel | 5.5V | 4.5V | 128kB | 1 | 210mA | - | - | - | 12 ns | - | 3-STATE | - | - | 16b | 1 Mb | - | - | - | - | COMMON | Asynchronous | 16b | - | - | - | 3.683mm | 28.6mm | 10.2mm | 2.9mm | No | RoHS Compliant | Lead Free | ||
 70V27L15PFG Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Surface Mount | TQFP | - | 100 | - | - | - | - | - | RAM, SDR, SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Bulk | 2008 | e3 | yes | Active | 3 (168 Hours) | 100 | - | Matte Tin (Sn) - annealed | 70°C | 0°C | - | - | QUAD | GULL WING | 260 | 1 | 3.3V | 0.5mm | - | - | 30 | 100 | - | - | 3.3V | - | - | COMMERCIAL | - | Parallel | 3.6V | 3V | 64kB | 2 | 225mA | - | - | - | 15 ns | - | 3-STATE | - | - | 30b | 512 kb | 0.003A | - | - | - | COMMON | Asynchronous | 16b | - | 3V | - | - | 14mm | 14mm | 1.4mm | No | RoHS Compliant | Lead Free | ||
 71256SA25YG8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 12 Weeks | Surface Mount | - | - | 28 | - | - | - | - | - | RAM, SDR, SRAM - Asynchronous | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Tape & Reel | 2011 | e3 | yes | Active | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) - annealed | 70°C | 0°C | - | - | DUAL | J BEND | 260 | 1 | 5V | - | - | - | - | 28 | - | - | 5V | - | 5V | COMMERCIAL | - | Parallel | 5.5V | 4.5V | 32kB | 1 | 145mA | - | - | - | 25 ns | 32KX8 | 3-STATE | - | - | 15b | 256 kb | - | - | - | - | COMMON | Asynchronous | 8b | - | - | - | 3.556mm | 17.9mm | 7.6mm | 2.67mm | No | RoHS Compliant | Lead Free | ||
 71V65603S150BQGI Integrated Device Technology (IDT) | In Stock | - | Datasheet | 12 Weeks | Surface Mount | - | - | 165 | - | - | - | 150MHz | - | RAM, SDR, SRAM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2005 | e1 | yes | Active | 3 (168 Hours) | 165 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | PIPELINED ARCHITECTURE | - | BOTTOM | BALL | 260 | 1 | 3.3V | - | - | 150MHz | 30 | 165 | - | - | 3.3V | - | - | INDUSTRIAL | - | Parallel | 3.465V | 3.135V | 1.1MB | 1 | 345mA | - | - | - | 6.7 ns | 256KX36 | 3-STATE | - | - | 18b | 9 Mb | 0.06A | - | - | - | COMMON | Synchronous | 36b | - | - | - | - | 15mm | 13mm | 1.2mm | No | RoHS Compliant | Lead Free |