- Part Status
- Length
- Published
- RoHS Status
- Width
- Number of Pins
- JESD-609 Code
- Terminal Finish
- HTS Code
- Lead Free
- Thickness
- Terminal Form
Attribute column
Manufacturer
IDT Specialized ICs
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Frequency(Max) | Operating Temperature (Max.) | Operating Temperature (Min.) | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Element Configuration | Nominal Supply Current | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Access Time | Direction | Organization | Density | Standby Current-Max | Memory Density | Access Time (Max) | Parallel/Serial | Telecom IC Type | Sync/Async | Word Size | Memory IC Type | Bus Directional | Retransmit Capability | FWFT Support | Programmable Flags Support | Output Enable | Cycle Time | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 72T6360L6BB Integrated Device Technology (IDT) | In Stock | - | Datasheet | - | - | Surface Mount | BGA | - | 324 | - | - | - | Bulk | 2009 | - | - | Discontinued | - | - | - | - | 70°C | 0°C | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V | - | - | - | - | 2.625V | 2.375V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 19mm | 19mm | 1.76mm | - | Non-RoHS Compliant | Contains Lead | ||
TSI574-10GCLV Integrated Device Technology (IDT) | In Stock | - | Datasheet | 4 Weeks | - | Surface Mount | BGA | - | 399 | - | 70°C | - | - | 2011 | e1 | yes | Active | 3 (168 Hours) | 399 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.2V | - | - | - | - | 399 | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | 21mm | 21mm | 1.81mm | No | RoHS Compliant | Lead Free | ||
80HCPS1848CBR Integrated Device Technology (IDT) | In Stock | - | Datasheet | 20 Weeks | - | - | FCBGA | YES | 784 | - | 70°C | - | - | 2011 | e1 | no | Active | 4 (72 Hours) | 784 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 | 1V | 1mm | - | - | - | 784 | - | - | - | 12.5/3.3V | COMMERCIAL | - | - | - | - | - | - | 7940mA | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 3.44mm | 29mm | 29mm | 3.5mm | No | RoHS Compliant | Contains Lead | ||
TSI572-10GILV Integrated Device Technology (IDT) | In Stock | - | Datasheet | 10 Weeks | - | Surface Mount | BGA | - | 399 | - | 85°C | -40°C | - | 2004 | e1 | yes | Active | 3 (168 Hours) | 399 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.2V | - | - | - | NOT SPECIFIED | 399 | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 2mm | 21mm | 21mm | 1.81mm | - | RoHS Compliant | Lead Free | ||
88P8342BHGI Integrated Device Technology (IDT) | In Stock | - | Datasheet | - | - | - | - | YES | 820 | - | - | - | - | 2006 | e3 | yes | - | - | 820 | EAR99 | MATTE TIN | 85°C | -40°C | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 1.8V | 1mm | - | - | 30 | 820 | - | - | 1.96V | 1.83.3V | INDUSTRIAL | 1.68V | - | - | - | - | MICROPROCESSOR CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.44mm | 35mm | 35mm | - | No | RoHS Compliant | - | ||
80HCPS1848HMI Integrated Device Technology (IDT) | In Stock | - | Datasheet | - | - | - | FCBGA | YES | 784 | - | - | - | - | 2011 | e0 | no | Active | 4 (72 Hours) | 784 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | - | 1mm | - | - | NOT SPECIFIED | 784 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 2.83mm | 29mm | 29mm | 2.75mm | - | Non-RoHS Compliant | Contains Lead | ||
TSI564A-10GIL Integrated Device Technology (IDT) | In Stock | - | Datasheet | - | - | Surface Mount | FCBGA | - | 399 | - | 85°C | -40°C | - | 2011 | e0 | no | - | 4 (72 Hours) | 399 | EAR99 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 3.3V | - | not_compliant | - | NOT SPECIFIED | 399 | Not Qualified | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 2.66mm | 21mm | 21mm | 2.3mm | - | Non-RoHS Compliant | Contains Lead | ||
72V51456L6BB Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Lead, Tin | Surface Mount | BGA | - | 256 | 166MHz | - | - | Bulk | 2005 | - | - | Active | - | - | - | - | 70°C | 0°C | - | - | - | - | - | - | - | - | - | 166MHz | - | - | - | 3.3V | - | - | - | - | 3.6V | 3.15V | Dual | 100mA | - | - | 3.7 ns | Unidirectional | - | 2 Mb | - | - | - | - | - | Synchronous | 36b | - | Unidirectional | No | Yes | Yes | - | - | - | - | 17mm | 17mm | 1.76mm | - | RoHS Compliant | Contains Lead | ||
80HCPS1848CHMI Integrated Device Technology (IDT) | In Stock | - | Datasheet | 19 Weeks | Lead, Tin | Surface Mount | FCBGA | - | 784 | - | - | - | - | 2011 | e0 | no | Active | 4 (72 Hours) | 784 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | - | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1V | 1mm | not_compliant | - | NOT SPECIFIED | 784 | Not Qualified | - | - | 12.5/3.3V | INDUSTRIAL | - | - | - | - | - | - | 7940mA | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 2.83mm | 29mm | 29mm | 2.75mm | - | Non-RoHS Compliant | Contains Lead | ||
72V51456L7-5BB8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Lead, Tin | Surface Mount | - | - | 256 | 133MHz | - | - | Tape & Reel | 2005 | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 3.3V | - | - | - | - | 256 | - | 3.3V | - | - | COMMERCIAL | - | 3.6V | 3.15V | Dual | - | - | - | - | - | 64KX36 | - | - | 2359296 bit | 4 ns | PARALLEL | - | - | - | - | Unidirectional | No | Yes | - | YES | 7.5 ns | - | - | 17mm | 17mm | 1.76mm | - | RoHS Compliant | Contains Lead | ||
72V51446L7-5BB8 Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Lead, Tin | Surface Mount | BGA | - | 256 | 133MHz | - | - | Tape & Reel | 2005 | - | - | Active | - | - | - | - | 70°C | 0°C | - | - | - | - | - | - | - | - | - | 133MHz | - | - | - | 3.3V | - | - | - | - | 3.6V | 3.15V | Dual | 100mA | - | - | 4 ns | Unidirectional | - | 1.1 Mb | - | - | - | - | - | Synchronous | 36b | - | Unidirectional | No | Yes | Yes | - | - | - | - | 17mm | 17mm | 1.76mm | - | RoHS Compliant | Contains Lead | ||
80HCPS1616CRM Integrated Device Technology (IDT) | In Stock | - | Datasheet | 18 Weeks | Copper, Silver, Tin | Surface Mount | FCBGA | - | 400 | - | - | - | - | 2011 | e1 | no | Active | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 | 1V | - | - | - | - | 400 | - | - | - | 12.5/3.3V | COMMERCIAL | - | - | - | - | - | - | 4730mA | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | 2.75mm | - | 21mm | 21mm | 2.75mm | No | RoHS Compliant | Contains Lead | ||
80KSW0003ARI Integrated Device Technology (IDT) | In Stock | - | Datasheet | - | Copper, Silver, Tin | Surface Mount | FCBGA | - | 324 | - | 85°C | -40°C | - | 1999 | e1 | no | - | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.2V | 1mm | - | - | NOT SPECIFIED | 324 | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 3.42mm | 19mm | 19mm | 3.27mm | - | RoHS Compliant | Contains Lead | ||
72V51443L7-5BB Integrated Device Technology (IDT) | In Stock | - | Datasheet | 7 Weeks | Lead, Tin | Surface Mount | BGA | - | 256 | 133MHz | - | - | - | 2005 | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALTERNATIVE MEMORY WIDTH:9-BIT | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 3.3V | 1mm | - | 133MHz | - | 256 | - | 3.3V | - | - | COMMERCIAL | - | 3.6V | 3.15V | Dual | 100mA | - | - | 4 ns | - | 64KX18 | 1.1 Mb | 0.01A | - | - | PARALLEL | - | Synchronous | 18b | OTHER FIFO | Unidirectional | No | Yes | - | YES | 7.5 ns | - | - | 17mm | 17mm | 1.76mm | - | RoHS Compliant | Contains Lead | ||
TSI574-10GCL Integrated Device Technology (IDT) | In Stock | - | Datasheet | 4 Weeks | - | Surface Mount | BGA | - | 399 | - | 70°C | - | - | 2011 | e0 | no | Active | 3 (168 Hours) | 399 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1.2V | - | not_compliant | - | NOT SPECIFIED | 399 | Not Qualified | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | 1.81mm | - | 21mm | 21mm | 1.81mm | - | Non-RoHS Compliant | Contains Lead | ||
TSI572-10GCL Integrated Device Technology (IDT) | In Stock | - | Datasheet | - | - | Surface Mount | BGA | - | 399 | - | 70°C | - | - | 2011 | e0 | no | Active | 3 (168 Hours) | 399 | EAR99 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1.2V | - | - | - | - | 399 | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | 1.81mm | - | 21mm | 21mm | 1.81mm | No | Non-RoHS Compliant | Contains Lead | ||
TSI578-10GCL Integrated Device Technology (IDT) | In Stock | - | Datasheet | 5 Weeks | - | Surface Mount | FCBGA | - | 675 | - | 70°C | - | - | 2011 | e0 | no | Active | 3 (168 Hours) | 675 | EAR99 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 3.3V | - | not_compliant | - | NOT SPECIFIED | 675 | Not Qualified | - | - | 1.23.3V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | 2.41mm | - | Non-RoHS Compliant | Contains Lead | ||
TSI564A-10GCL Integrated Device Technology (IDT) | In Stock | - | Datasheet | - | - | Surface Mount | FCBGA | - | 399 | - | 70°C | - | - | 2011 | e0 | no | - | 4 (72 Hours) | 399 | EAR99 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 3.3V | - | not_compliant | - | NOT SPECIFIED | 399 | Not Qualified | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 2.66mm | 21mm | 21mm | 2.3mm | - | Non-RoHS Compliant | Contains Lead | ||
80HSPS1616CHMG Integrated Device Technology (IDT) | In Stock | - | Datasheet | 12 Weeks | - | - | - | YES | 400 | - | 70°C | - | - | 2016 | e1 | yes | Active | 4 (72 Hours) | 400 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | - | 1V | - | - | - | NOT SPECIFIED | 400 | - | - | 1.05V | - | COMMERCIAL | 0.95V | - | - | - | - | MICROPROCESSOR CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.83mm | 21mm | 21mm | 2.75mm | - | Non-RoHS Compliant | Lead Free | ||
TSI568A-10GILY Integrated Device Technology (IDT) | In Stock | - | Datasheet | 8 Weeks | - | Surface Mount | FCBGA | - | 675 | - | 85°C | -40°C | - | 2011 | e1 | no | - | 3 (168 Hours) | 675 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.2V | - | - | - | NOT SPECIFIED | 675 | Not Qualified | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | - | - | - | - | - | - | 2.66mm | 27mm | 27mm | 2.41mm | - | RoHS Compliant | Contains Lead |