Product
Brand
Articles
Tools- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Organization
- Package Body Material
- Package Description
- Package Shape
Attribute column
Manufacturer
Intel Memory - Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Maximum Operating Temperature | Memory Types | Minimum Operating Temperature | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Tradename | Unit Weight | Packaging | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Product | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 NMB1XXD512GPSU4 Intel | In Stock | - | - | - | - | - | 4 | - | + 85 C | DDR | 0 C | - | - | - | - | - | - | - | - | - | - | 999HH2 | - | - | Details | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PMEM Modules | - | - | ||
NMB1XXD256GPSUF Intel | In Stock | - | - | - | - | - | 50 | - | + 85 C | DDR | 0 C | - | - | - | - | - | - | - | - | - | - | 999HH1 | - | - | Details | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PMEM Modules | - | - | ||
NMA1XXD128GPSU4 Intel | 684 | - | - | - | - | - | 4 | - | + 85 C | DDR | - | - | - | - | - | - | - | - | - | - | - | 999AVV | - | - | Details | - | - | Optane | - | Bulk | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 128 GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Memory Modules | - | - | ||
NMA1XXD256GPSU4 Intel | 693 | - | - | - | - | - | 4 | - | + 85 C | DDR | - | - | - | - | - | - | - | - | - | - | - | 999AVX | - | - | Details | - | - | Optane | 4.823714 oz | Bulk | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Memory Modules | - | - | ||
NMB1XXD128GPSU4 Intel | In Stock | - | - | - | - | - | 4 | - | + 85 C | DDR | 0 C | - | - | - | - | - | - | - | - | - | - | 999HGR | - | - | Details | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 128 GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PMEM Modules | - | - | ||
NMB1XXD512GPSUF Intel | In Stock | - | - | - | - | - | 50 | - | + 85 C | DDR | 0 C | - | - | - | - | - | - | - | - | - | - | 999HH3 | - | - | Details | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PMEM Modules | - | - | ||
 N28F020-120 Intel Corporation | In Stock | - | Datasheet | YES | 32 | 120 ns | - | INTEL CORP | - | - | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | QCCJ | 0.450 X 0.550 INCH, PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | - | Obsolete | QFJ | - | No | 5 V | - | - | - | e0 | - | EAR99 | NOR TYPE | TIN LEAD | 100000 ERASE/PROGRAM CYCLES | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | ASYNCHRONOUS | 0.03 mA | 256KX8 | - | 3.55 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | - | FLASH | 12 V | 100000 Write/Erase Cycles | - | NO | NO | YES | - | - | - | - | - | - | - | 13.97 mm | 11.43 mm | ||
TE28F128P30T85 Intel Corporation | In Stock | - | Datasheet | YES | 56 | 85 ns | - | INTEL CORP | - | - | - | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP56,.8,20 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | Transferred | TSOP | - | No | 1.8 V | - | - | - | e0 | - | EAR99 | NOR TYPE | TIN LEAD | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 0.5 mm | compliant | - | 56 | R-PDSO-G56 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | - | ASYNCHRONOUS | 0.051 mA | 8MX16 | - | 1.2 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | - | FLASH | 1.8 V | - | - | NO | NO | YES | 4,127 | 16K,64K | 4 words | - | TOP | YES | - | 18.4 mm | 14 mm | ||
E28F016XS-15 Intel Corporation | In Stock | - | Datasheet | YES | 56 | 20 ns | - | INTEL CORP | - | - | - | 2097152 words | 2000000 | 70 °C | - | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP56,.8,20 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | - | Obsolete | TSOP1 | - | No | 5 V | - | - | - | e0 | - | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | ALSO CAN BE CONFIGURED AS 1M X 16 | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 0.5 mm | unknown | - | 56 | R-PDSO-G56 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | - | SYNCHRONOUS | 0.175 mA | 2MX8 | 3-STATE | 1.2 mm | 8 | 0.000005 A | 16777216 bit | PARALLEL | - | FLASH | 5 V | - | 8 | NO | NO | YES | 16 | 128K | - | YES | - | - | - | 18.4 mm | 14 mm | ||
 TE28F016C3TA110 Intel Corporation | In Stock | - | Datasheet | YES | 40 | 110 ns | - | INTEL CORP | - | - | - | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 10 X 20 MM, TSOP-40 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | - | Transferred | TSOP | - | No | - | - | - | - | e0 | - | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | MINIMUM 100,000 BLOCK ERASE CYCLES; TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 0.5 mm | unknown | - | 40 | R-PDSO-G40 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | - | ASYNCHRONOUS | 0.055 mA | 2MX8 | - | 1.2 mm | 8 | 0.000005 A | 16777216 bit | PARALLEL | - | FLASH | 3 V | - | - | NO | NO | YES | 8,31 | 8K,64K | - | - | TOP | YES | - | 18.4 mm | 10 mm | ||
 TE28F160B3B90 Intel Corporation | In Stock | - | Datasheet | YES | 48 | 90 ns | - | INTEL CORP | - | - | - | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | - | Obsolete | TSOP | - | - | 3 V | - | - | - | - | - | EAR99 | NOR TYPE | - | USER-SELECTABLE 12V VPP; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 0.5 mm | unknown | - | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | - | ASYNCHRONOUS | 0.035 mA | 1MX16 | - | 1.2 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | - | FLASH | 2.7 V | - | - | NO | NO | YES | 8,31 | 4K,32K | - | - | BOTTOM | - | - | 18.4 mm | 12 mm | ||
TE28F016B3TA110 Intel Corporation | In Stock | - | Datasheet | YES | 40 | 110 ns | - | INTEL CORP | - | - | - | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 12 X 20 MM, TSOP-40 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE | - | Obsolete | TSOP | - | No | 3 V | - | - | - | e0 | - | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 0.5 mm | unknown | - | 40 | R-PDSO-G40 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | - | ASYNCHRONOUS | 0.055 mA | 1MX16 | - | 1.2 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | - | FLASH | 2.7 V | - | - | NO | NO | YES | 8,31 | 8K,64K | - | - | TOP | - | - | 18.4 mm | 12 mm | ||
TN87C64 Intel Corporation | In Stock | - | Datasheet | YES | 32 | 250 ns | - | INTEL CORP | - | - | - | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | - | Obsolete | - | - | No | 5 V | - | - | - | e0 | - | EAR99 | - | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | - | R-PQCC-J32 | Not Qualified | - | INDUSTRIAL | - | - | ASYNCHRONOUS | 0.02 mA | 8KX8 | 3-STATE | - | 8 | - | 65536 bit | PARALLEL | COMMON | OTP ROM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 RC28F640C3TC80 Intel Corporation | In Stock | - | Datasheet | YES | 64 | 80 ns | - | INTEL CORP | - | - | - | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | - | Obsolete | BGA | - | No | 3 V | - | - | - | e0 | - | EAR99 | NOR TYPE | TIN LEAD | USER-SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | - | 1 | 1 mm | compliant | - | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | - | ASYNCHRONOUS | 0.055 mA | 4MX16 | - | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | - | FLASH | 3 V | - | - | NO | NO | YES | 8,127 | 4K,32K | - | - | TOP | YES | - | 13 mm | 10 mm | ||
PA28F800BVT70 Intel Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
P27256 Intel Corporation | In Stock | - | Datasheet | NO | 28 | 250 ns | - | INTEL CORP | - | - | - | 32768 words | 32000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP-28 | DIP28,.6 | RECTANGULAR | IN-LINE | - | Obsolete | - | - | No | 5 V | - | - | - | e0 | - | EAR99 | - | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | - | 2.54 mm | unknown | - | - | R-PDIP-T28 | Not Qualified | - | COMMERCIAL | - | - | - | 0.1 mA | 32KX8 | 3-STATE | - | 8 | - | 262144 bit | - | COMMON | OTP ROM | 12.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 JZ48F4000L0YBQ0A Intel Corporation | In Stock | - | Datasheet | YES | 88 | 85 ns | - | INTEL CORP | - | - | - | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 8 X 11 MM, 1 MM HEIGHT, LEAD FREE, BGA-88 | - | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | Obsolete | BGA | - | - | 1.8 V | - | - | - | - | Yes | EAR99 | NOR TYPE | - | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | unknown | NOT SPECIFIED | 88 | R-PBGA-B88 | Not Qualified | 2 V | OTHER | 1.7 V | - | ASYNCHRONOUS | - | 16MX16 | - | 1 mm | 16 | - | 268435456 bit | PARALLEL | - | FLASH | 1.8 V | - | 8 | - | - | - | - | - | - | - | BOTTOM | - | - | 11 mm | 8 mm | ||
PC48F4400P0VT00 Intel Corporation | In Stock | - | Datasheet | YES | 64 | 88 ns | - | INTEL CORP | - | - | - | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA64,8X8,40 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | - | Transferred | BGA | - | Yes | 1.8 V | - | - | - | e1 | - | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | - | 1 | 1 mm | compliant | - | 64 | R-PBGA-B64 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | - | ASYNCHRONOUS | 0.051 mA | 32MX16 | - | 1.3 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | - | FLASH | 1.8 V | - | - | NO | NO | YES | 8, 510 | 16K,64K | 4 words | - | TOP | YES | - | 13 mm | 10 mm | ||
PF48F2000P0ZTQ0 Intel Corporation | In Stock | - | Datasheet | YES | 88 | 85 ns | - | INTEL CORP | - | - | - | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-88 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | - | Transferred | BGA | - | Yes | 1.8 V | - | - | - | - | - | EAR99 | NOR TYPE | - | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 40 | 88 | R-PBGA-B88 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | - | ASYNCHRONOUS | 0.051 mA | 4MX16 | - | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | - | FLASH | 1.8 V | - | - | NO | NO | YES | 4,63 | 16K,64K | 4 words | - | TOP | YES | - | 10 mm | 8 mm | ||
 PA28F400BVT80 Intel Corporation | In Stock | - | Datasheet | YES | 44 | 150 ns | - | INTEL CORP | - | - | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | SOP | 1.110 X 0.525 INCH, PLASTIC, SOP-44 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | - | Obsolete | SOIC | - | No | 3.3 V | - | - | - | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO OPERATES WITH 4.5V-5.5V SUPPLY, TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | - | SYNCHRONOUS | 0.065 mA | 256KX16 | - | - | 16 | 0.000008 A | 4194304 bit | PARALLEL | - | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | NO | NO | YES | 1,2,1,3 | 16K,8K,96K,128K | - | - | TOP | - | - | - | - |