- ECCN Code
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Organization
Attribute column
Manufacturer
Intersil Memory - Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | Memory IC Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 HM1-76161A-5 Intersil Corporation | In Stock | - | Datasheet | NO | 24 | 50 ns | INTERSIL CORP | 2048 words | 2000 | 70 °C | - | CERAMIC | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDIP-T24 | Not Qualified | - | COMMERCIAL | - | ASYNCHRONOUS | 0.18 mA | 2KX8 | 8 | - | 16384 bit | - | PARALLEL | OTP ROM | ||
HM6-6616-8 Intersil Corporation | In Stock | - | Datasheet | NO | 24 | 140 ns | INTERSIL CORP | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC | DIP | - | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | 2.54 mm | not_compliant | R-XDIP-T24 | Not Qualified | - | MILITARY | - | - | 0.046 mA | 2KX8 | 8 | 0.0001 A | 16384 bit | MIL-STD-883 Class B (Modified) | - | OTP ROM | ||
HM1-6641-9 Intersil Corporation | In Stock | - | Datasheet | NO | 24 | - | INTERSIL CORP | 512 words | 512 | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | - | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | 2.54 mm | not_compliant | R-XDIP-T24 | Not Qualified | - | INDUSTRIAL | - | - | - | 512X8 | 8 | - | 4096 bit | - | - | OTP ROM | ||
HM1-7642A-5 Intersil Corporation | In Stock | - | Datasheet | NO | 18 | 150 ns | INTERSIL CORP | 1024 words | 32000 | 70 °C | - | CERAMIC | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDIP-T18 | Not Qualified | - | COMMERCIAL | - | ASYNCHRONOUS | 0.025 mA | 32KX8 | 8 | - | 262144 bit | - | PARALLEL | OTP ROM | ||
HM1-7611-2 Intersil Corporation | In Stock | - | Datasheet | NO | 16 | 85 ns | INTERSIL CORP | 256 words | 4000 | 125 °C | -55 °C | CERAMIC | DIP | - | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDIP-T16 | Not Qualified | - | MILITARY | - | ASYNCHRONOUS | 0.13 mA | 4KX8 | 8 | - | 32768 bit | - | PARALLEL | OTP ROM | ||
HM1-7621-2 Intersil Corporation | In Stock | - | Datasheet | NO | 16 | 200 ns | INTERSIL CORP | 512 words | 64000 | 125 °C | -55 °C | CERAMIC | DIP | - | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDIP-T16 | Not Qualified | - | MILITARY | - | ASYNCHRONOUS | 0.05 mA | 64KX16 | 16 | - | 1048576 bit | - | PARALLEL | OTP ROM | ||
HM1-7610A-8 Intersil Corporation | In Stock | - | Datasheet | NO | 16 | 85 ns | INTERSIL CORP | 256 words | 512 | 125 °C | -55 °C | CERAMIC | DIP | - | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDIP-T16 | Not Qualified | - | MILITARY | - | ASYNCHRONOUS | 0.155 mA | 512X8 | 8 | - | 4096 bit | MIL-STD-883 Class B (Modified) | PARALLEL | OTP ROM | ||
HM1-6617-8 Intersil Corporation | In Stock | - | Datasheet | NO | 24 | 140 ns | HARRIS SEMICONDUCTOR | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | - | , | - | RECTANGULAR | IN-LINE | Obsolete | - | 5 V | - | EAR99 | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | - | unknown | R-GDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | - | 2KX8 | 8 | - | 16384 bit | - | PARALLEL | OTP ROM |