Filters
  • Attachment Method
  • Diameter
  • Height Off Base (Height of Fin)
  • Length
  • Material
  • Material Finish
  • Package Cooled
  • Part Status
  • Power Dissipation @ Temperature Rise
  • Series
  • Shape
  • Thermal Resistance @ Forced Air Flow

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Lapp Solder

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Product

Inventory

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Quantity

Datasheet

RoHS

Material

Shape

Package Cooled

Material Finish

Series

Part Status

Type

Attachment Method

Height Off Base (Height of Fin)

Thermal Resistance @ Forced Air Flow

Thermal Resistance @ Natural

Power Dissipation @ Temperature Rise

Diameter

Length

Width

27612
27612

Lapp

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Aluminum

Square, Fins

Assorted (BGA, LGA, CPU, ASIC...)

Blue Anodized

pushPIN™

Active

Top Mount

Push Pin

0.790 (20.00mm)

7.28°C/W @ 100 LFM

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1.181 (30.00mm)

1.181 (30.00mm)

In Stock

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