- Ihs Manufacturer
- JESD-30 Code
- Manufacturer Part Number
- Memory Density
- Memory IC Type
- Memory Width
- Number of Functions
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Mode
- Operating Temperature-Max
Attribute column
Manufacturer
Microchip Memory Connectors - Accessories
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Manufacturer Part Number | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Organization | Memory Width | Memory Density | Memory IC Type | Access Mode | Self Refresh |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 WEDPN16M64V-133B2I Microchip | In Stock | - | - | YES | 219 | 5.5 ns | WHITE ELECTRONIC DESIGNS CORP | WEDPN16M64V-133B2I | 16777216 words | 16000000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | - | NOT SPECIFIED | 5.66 | - | No | 3.3 V | - | - | - | - | AUTO/SELF REFRESH | - | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | unknown | - | S-PBGA-B219 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | 1 | SYNCHRONOUS | 16MX64 | 64 | 1073741824 bit | SYNCHRONOUS DRAM | MULTI BANK PAGE BURST | YES | ||
W3E32M64S-266SBM Microchip | In Stock | - | - | YES | 208 | 0.75 ns | MICROSEMI CORP | W3E32M64S-266SBM | 33554432 words | 32000000 | 125 °C | -55 °C | - | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Transferred | BGA | NOT SPECIFIED | 5.22 | - | No | 2.5 V | e0 | No | EAR99 | TIN LEAD | AUTO REFRESH | 8542.32.00.36 | BOTTOM | BALL | NOT SPECIFIED | 1 | - | compliant | 208 | R-PBGA-B208 | Not Qualified | 2.7 V | MILITARY | 2.3 V | 1 | SYNCHRONOUS | 32MX64 | 64 | 2147483648 bit | DDR DRAM | FOUR BANK PAGE BURST | - | ||
AT88SC3216C-SU-T Microchip | In Stock | - | - | YES | 8 | - | MICROCHIP TECHNOLOGY INC | AT88SC3216C-SU-T | 32768 words | 32000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Not Recommended | - | - | 5.2 | - | - | - | - | - | - | - | - | 8542.32.00.71 | DUAL | GULL WING | - | 1 | - | compliant | - | R-PDSO-G8 | - | 5.5 V | INDUSTRIAL | 2.7 V | - | SYNCHRONOUS | 32KX1 | 1 | 32768 bit | MEMORY CIRCUIT | - | - | ||
SD01A-01220 SHENZHEN ATOM TECH | In Stock | - | - | - | - | - | - | - | - | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | - | - | - | true | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |