- Frequency
- Frequency Stability
- Packaging
- Part Status
- RoHS Status
- Series
- Type
- Base Resonator
- Function
- Height Seated (Max)
- Moisture Sensitivity Level (MSL)
- Mounting Type
Attribute column
Manufacturer
Microchip Oscillators
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | ECCN (US) | Frequency Stability (ppm) | Ihs Manufacturer | Load Capacitance (pF) | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Symmetry (%) | Mfr | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Mounting | Operating Frequency-Nom | Operating Temperature-Max | Operating Temperature-Min | Package | Package Description | Package Height | Package Length | Package Width | Part Life Cycle Code | PCB changed | Product Status | Risk Rank | Rohs Code | Standard Frequency (MHz) | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage (V) | Usage Level | Operating Temperature | Packaging | Published | Series | Size / Dimension | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | Capacitance | Voltage - Supply | Supply Voltage | Reach Compliance Code | Frequency | Frequency Stability | Output | Pin Count | Function | Base Resonator | Current - Supply (Max) | Physical Dimension | Operating Frequency | Operating Supply Voltage | Rise Time-Max | Fall Time-Max | Symmetry-Max | Current - Supply (Disable) (Max) | Max Supply Voltage | Min Supply Voltage | Oscillator Type | Load Capacitance | Max Supply Current | Output Load | Frequency Adjustment-Mechanical | Max Duty Cycle | Output Level | Height | Height Seated (Max) | Length | Width | RoHS Status | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 DSC1001DI2-033.3333T Microchip Technology | 29 |
| Datasheet | 9 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tape & Reel (TR) | - | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | - | - | Active | 3 (168 Hours) | - | Solder | XO (Standard) | - | 85°C | -40°C | - | - | 1.8V~3.3V | - | - | 33.3333MHz | ±25ppm | CMOS | - | Standby (Power Down) | MEMS | 7.2mA | - | - | 3.3V | - | - | - | 15μA | 3.6V | 1.7V | - | 15pF | 7.2mA | - | - | 55 % | - | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | ||
 DSC1103CI5-016.0000T Microchip Technology | 28 |
| Datasheet | 12 Weeks | - | Surface Mount | 6-SMD, No Lead | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tape & Reel (TR) | - | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | - | - | Active | 3 (168 Hours) | - | - | XO (Standard) | - | - | - | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | - | 2.25V~3.63V | - | - | 16MHz | ±10ppm | LVDS | - | Standby (Power Down) | MEMS | 95μA | 3.2mm x 2.5mm x 0.85mm | 16MHz | - | - | - | 52/48% | - | - | - | - | - | - | - | - | - | - | - | 0.035 0.90mm | - | - | ROHS3 Compliant | - | ||
 VCC1-B3D-66M0000000 Microchip Technology | 2000 | - | - | - | - | - | - | YES | SURFACE MOUNT | - | EAR99 | ±50 | MICROSEMI CORP | 15 | Microsemi Corporation | VCC1-B3D-66M0000000 | 3.63 | 85 | 55 | Microchip Technology | 2.97 | -40 | Surface Mount | 66 MHz | 85 °C | -40 °C | Tape & Reel (TR) | ROHS COMPLIANT, HERMETIC SEALED, SMALL PACKAGE-4 | 1.6 | 7 | 5 | Active | 4 | Active | 5.68 | Yes | 66 | 3.63 V | 2.97 V | 3.3 V | 3.3 | - | - | Tape and Reel | - | * | - | e4 | - | Active | - | - | - | Crystal Oscillator | Gold (Au) - with Nickel (Ni) barrier | - | - | TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH | - | - | - | compliant | - | 50% | - | 4 | - | - | - | 7.0mm x 5.0mm x 1.6mm | - | - | 3 ns | 3 ns | 45/55 % | - | - | - | CMOS | - | - | 15 pF | NO | - | CMOS | - | - | - | - | RoHS Compliant | - | ||
 MX573BBA156M250 Microchip Technology | 444 | - | Datasheet | 6 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | 6 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tube | - | MX57 | 0.276Lx0.197W 7.00mmx5.00mm | - | - | Active | 3 (168 Hours) | - | SMD/SMT | XO (Standard) | - | 85°C | -40°C | - | - | 2.375V~3.63V | - | - | 156.25MHz | ±50ppm | LVPECL | - | Enable/Disable | Crystal | 120mA | - | - | - | - | - | - | - | 3.63V | 2.375V | - | - | 120mA | - | - | - | - | 1.397mm | 0.055 1.40mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | - | ||
DSC1001CI2-026.8000T Microchip Technology | 45 |
| Datasheet | 12 Weeks | - | Surface Mount | 4-SMD, No Lead | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Automotive grade | -40°C~85°C | Tape & Reel (TR) | - | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | - | - | Active | 3 (168 Hours) | 4 | - | XO (Standard) | - | - | - | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | - | 1.8V~3.3V | 3.3V | - | 26.8MHz | ±25ppm | CMOS | - | Standby (Power Down) | MEMS | 6.3mA | 3.2mm x 2.5mm x 0.9mm | 26.8MHz | - | 2ns | 2ns | 55/45% | - | - | - | - | - | - | - | - | - | - | - | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
 DSC1103BL2-125.0000 Microchip Technology | 7 |
| Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C | Tube | - | DSC1103 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | - | Active | 3 (168 Hours) | - | - | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | 15pF | 2.25V~3.63V | - | - | 125MHz | ±25ppm | LVDS | - | Standby (Power Down) | MEMS | - | 5.0mm x 3.2mm x 0.85mm | 125MHz | - | - | - | 52/48% | 95μA | - | - | - | - | 32mA | - | - | - | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
DSC1102BE2-200.0000T Microchip Technology | 9 |
| Datasheet | 12 Weeks | Standard, Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -20°C~70°C | Tape & Reel (TR) | - | DSC1102 | 0.197Lx0.126W 5.00mmx3.20mm | - | yes | Active | 3 (168 Hours) | - | Solder | XO (Standard) | - | - | - | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | - | 2.25V~3.6V | - | - | 200MHz | ±25ppm | LVPECL | - | Standby (Power Down) | MEMS | - | 5.0mm x 3.2mm x 0.85mm | 200MHz | - | - | - | 52/48% | 95μA | - | - | - | - | 58mA | - | - | 52 % | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | - | ||
 DSC1101CI5-125.0000T Microchip Technology | In Stock | - | Datasheet | - | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tape & Reel (TR) | - | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | - | Active | 3 (168 Hours) | - | - | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | STANDBY; ENABLE/DISABLE FUNCTION; TR | 15pF | 2.25V~3.6V | - | - | 125MHz | ±10ppm | CMOS | - | Standby (Power Down) | MEMS | - | 3.2mm x 2.5mm x 0.85mm | 125MHz | - | 2ns | 2ns | 55/45% | 95μA | - | - | - | - | 35mA | - | - | - | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | - | ||
 DSC1123AI5-100.0000 Microchip Technology | 12 |
| Datasheet | - | Standard, Surface Mount | Surface Mount | 6-SMD, No Lead Exposed Pad | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tube | - | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | - | yes | Active | 3 (168 Hours) | - | SMD/SMT | XO (Standard) | - | - | - | - | - | 2.25V~3.63V | - | - | 100MHz | ±10ppm | LVDS | - | Enable/Disable | MEMS | - | 7.0mm x 5.0mm x 0.9mm | 100MHz | - | - | - | 52/48% | 22mA | - | - | - | 2pF | 32mA | - | - | 52 % | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
DSC1123BI2-125.0000 Microchip Technology | 10 |
| Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | 6 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tube | - | DSC1123 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | - | Active | 1 (Unlimited) | - | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | - | 2.25V~3.63V | - | - | 125MHz | ±25ppm | LVDS | - | Enable/Disable | MEMS | - | 5.0mm x 3.2mm x 0.85mm | 125MHz | - | - | - | 52/48% | 22mA | - | - | - | 2pF | 32mA | - | - | 52 % | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
 DSC6003JI2A-010.0000 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 4-SMD, No Lead | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Industrial grade | -40°C~85°C | Tube | - | DSC60XX | 0.098Lx0.079W 2.50mmx2.00mm | - | - | Active | 1 (Unlimited) | - | - | XO (Standard) | - | - | - | - | - | 1.8V~3.3V | - | - | 10MHz | ±25ppm | CMOS | - | Enable/Disable | MEMS | 1.3mA Typ | 2.5mm x 2.0mm x 0.89mm | 10MHz | - | 3.5ns | 3.5ns | 55/45% | - | - | - | - | - | - | - | - | - | - | - | 0.035 0.89mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
DSC1033DI1-029.4912 Microchip Technology | 36 |
| Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tube | - | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | - | - | Active | 3 (168 Hours) | - | - | XO (Standard) | - | - | - | - | - | 3.3V | 3.3V | - | 29.4912MHz | ±50ppm | CMOS | - | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 29.4912MHz | - | 2ns | 2ns | 55/45% | 1μA | - | - | - | - | 3mA | - | - | - | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | - | ||
 DSC6011ME2A-016.0000 Microchip Technology | 36 |
| Datasheet | 12 Weeks | - | Surface Mount | 4-SMD, No Lead | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -20°C~70°C | Bag | - | DSC60XX | 0.079Lx0.063W 2.00mmx1.60mm | - | - | Active | 1 (Unlimited) | - | - | XO (Standard) | - | - | - | - | - | 1.8V~3.3V | - | - | 16MHz | ±25ppm | CMOS | - | Enable/Disable | MEMS | 1.3mA Typ | 2.0mm x 1.6mm x 0.89mm | 16MHz | - | 2ns | 2ns | 55/45% | - | - | - | - | - | - | - | - | - | - | - | 0.035 0.89mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
 DSC1122NE1-133.3330 Microchip Technology | In Stock | - | Datasheet | - | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -20°C~70°C | Tube | - | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | - | yes | Active | 3 (168 Hours) | - | - | XO (Standard) | - | - | - | - | - | 2.25V~3.6V | - | - | 133.333MHz | ±50ppm | LVPECL | - | Enable/Disable | MEMS | - | - | - | - | - | - | - | 22mA | - | - | - | - | 58mA | - | - | - | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | - | ||
DSC1001DC1-100.0000T Microchip Technology | In Stock | - | Datasheet | - | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C | Tape & Reel (TR) | - | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | - | - | Active | 3 (168 Hours) | - | - | XO (Standard) | - | 70°C | 0°C | - | - | 1.8V~3.3V | - | - | 100MHz | ±50ppm | CMOS | - | Standby (Power Down) | MEMS | 8.7mA | - | - | - | - | - | - | 15μA | - | - | - | - | 8.7mA | - | - | - | - | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | ||
 DSC1001AI2-065.5360T Microchip Technology | 49 |
| Datasheet | - | Surface Mount | Surface Mount | 4-SMD, No Lead Exposed Pad | - | - | 4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tape & Reel (TR) | - | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | - | yes | Active | 3 (168 Hours) | - | SMD/SMT | XO (Standard) | - | - | - | - | - | 1.8V~3.3V | 3.3V | - | 65.536MHz | ±25ppm | CMOS | - | Standby (Power Down) | MEMS | - | 7.0mm x 5.0mm x 0.85mm | 65.536MHz | - | 2ns | 2ns | - | 15μA | - | - | - | 15pF | 7.2mA | - | - | 55 % | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
DSC1001AI5-040.0000T Microchip Technology | 19 |
| Datasheet | - | Surface Mount | Surface Mount | 4-SMD, No Lead Exposed Pad | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tape & Reel (TR) | - | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | - | yes | Active | 3 (168 Hours) | - | Solder | XO (Standard) | - | - | - | - | - | 1.8V~3.3V | 3.3V | - | 40MHz | ±10ppm | CMOS | - | Standby (Power Down) | MEMS | - | 7.0mm x 5.0mm x 0.85mm | 40MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | - | - | - | 15pF | 7.2mA | - | - | 55 % | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
 DSC1001CI2-108.0000T Microchip Technology | In Stock | - | Datasheet | - | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C | Tape & Reel (TR) | - | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | - | yes | Active | 3 (168 Hours) | - | Solder | XO (Standard) | - | - | - | - | - | 1.8V~3.3V | 3.3V | - | 108MHz | ±25ppm | CMOS | - | Standby (Power Down) | MEMS | - | 3.2mm x 2.5mm x 0.85mm | 108MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | - | - | - | 15pF | 8.7mA | - | - | 55 % | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
DSC1001CE1-004.0000 Microchip Technology | 12 |
| Datasheet | - | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | 4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -20°C~70°C | Tube | - | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | Active | 3 (168 Hours) | - | SMD/SMT | XO (Standard) | Matte Tin (Sn) | - | - | - | - | 1.8V~3.3V | 3.3V | - | 4MHz | ±50ppm | CMOS | - | Standby (Power Down) | MEMS | - | 3.2mm x 2.5mm x 0.85mm | 4MHz | - | 2ns | 2ns | - | 15μA | - | - | - | 15pF | 6.3mA | - | - | - | - | 889μm | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 | ||
 DSC6083CI2A-032K800 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 4-SMD, No Lead | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Industrial grade | -40°C~85°C | Tube | 2016 | DSC60XX | 0.126Lx0.098W 3.20mmx2.50mm | - | - | Active | 1 (Unlimited) | - | - | XO (Standard) | - | - | - | - | - | 1.8V~3.3V | - | - | 32.8kHz | ±25ppm | CMOS | - | - | MEMS | 1.3mA Typ | 3.2mm x 2.5mm x 0.85mm | 0.0328MHz | - | 3.5ns | 3.5ns | 55/45% | - | - | - | - | - | - | - | - | - | - | - | 0.035 0.90mm | - | - | ROHS3 Compliant | AEC-Q100 |