- Available Frequency Range
- Base Resonator
- Frequency Stability
- Function
- Height Seated (Max)
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Output
- Package / Case
- Packaging
- Part Status
Attribute column
Manufacturer
Microchip Programmable Oscillators
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Number of Pins | Operating Frequency (Max) | Usage Level | Operating Temperature | Packaging | Published | Series | Size / Dimension | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Type | Terminal Finish | Additional Feature | Voltage - Supply | Supply Voltage | Frequency | Frequency Stability | Output | Function | Base Resonator | Current - Supply (Max) | Physical Dimension | Operating Supply Voltage | Rise Time-Max | Fall Time-Max | Symmetry-Max | Current - Supply (Disable) (Max) | Programmable Type | Available Frequency Range | Load Capacitance | Max Supply Current | Frequency Adjustment-Mechanical | Max Duty Cycle | Operating Frequency-Min | Height | Height Seated (Max) | RoHS Status | Lead Free | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 DSC8121BI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | - | -40°C~85°C | Tube | 2009 | DSC8121 | 0.197Lx0.126W 5.00mmx3.20mm | - | - | Active | 1 (Unlimited) | Solder | XO (Standard) | - | - | 2.25V~3.6V | - | 170MHz | 25 ppm | CMOS | Enable/Disable | MEMS | - | 5.0mm x 3.2mm x 0.85mm | 3.3V | 2ns | 2ns | 55/45% | - | Blank (User Must Program) | 10MHz~170MHz | 15pF | 35mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | - | ||
 DSC8001BI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | 4 | - | - | -40°C~85°C | Tube | - | DSC8001 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | - | Active | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | - | 5.0mm x 3.2mm x 0.85mm | 3.3V | 3ns | 3ns | - | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC8124BI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | 4 | - | - | -40°C~85°C | Tube | 2013 | DSC8124 | 0.197Lx0.126W 5.00mmx3.20mm | - | - | Active | 1 (Unlimited) | - | XO (Standard) | - | - | 2.25V~3.6V | - | - | ±25ppm | HCSL | Enable/Disable | MEMS | - | 5.0mm x 3.2mm x 0.85mm | - | - | - | - | - | Blank (User Must Program) | 10MHz~460MHz | - | 42mA | NO | - | 10MHz | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC8121AI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | - | -40°C~85°C | Tube | 2009 | DSC8121 | 0.276Lx0.197W 7.00mmx5.00mm | - | - | Active | 1 (Unlimited) | Solder | XO (Standard) | - | - | 2.25V~3.6V | - | 170MHz | 25 ppm | CMOS | Enable/Disable | MEMS | - | 7.0mm x 5.0mm x 0.85mm | 3.3V | 2ns | 2ns | 55/45% | - | Blank (User Must Program) | 10MHz~170MHz | 15pF | 35mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | - | ||
 DSC8001CI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | -40°C~85°C | Tube | - | DSC8001 | 0.126Lx0.098W 3.20mmx2.50mm | - | - | Active | 1 (Unlimited) | Solder | XO (Standard) | - | - | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | - | 3.2mm x 2.5mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC8001AI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | -40°C~85°C | Tube | 2010 | DSC8001 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | - | Active | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | - | 7.0mm x 5.0mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC8121CI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | 6 | - | - | -40°C~85°C | Tube | 2009 | DSC8121 | 0.126Lx0.098W 3.20mmx2.50mm | - | - | Active | 1 (Unlimited) | Solder | XO (Standard) | - | - | 2.25V~3.6V | - | 170MHz | 25 ppm | CMOS | Enable/Disable | MEMS | - | 3.2mm x 2.5mm x 0.85mm | 3.3V | 2ns | 2ns | 55/45% | - | Blank (User Must Program) | 10MHz~170MHz | 15pF | 35mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | Lead Free | - | ||
 DSC8123BI2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | - | - | - | -40°C~85°C | Tube | 2013 | DSC8123 | 0.197Lx0.126W 5.00mmx3.20mm | - | - | Active | 1 (Unlimited) | Solder | XO (Standard) | - | - | 2.25V~3.6V | - | 460MHz | ±25ppm | LVDS | Enable/Disable | MEMS | - | 5.0mm x 3.2mm x 0.85mm | - | 0.2ns | 0.2ns | 52/48% | - | Blank (User Must Program) | 10MHz~460MHz | 2pF | 32mA | - | 52 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
DSC8001CI5 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | -40°C~85°C | Tube | - | DSC8001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | - | Active | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 1.8V~3.3V | 1.8V | 150MHz | 10 ppm | CMOS | Standby | MEMS | - | 3.2mm x 2.5mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC8101BL2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | 170MHz | - | -40°C~105°C | Tube | 2013 | DSC8101 | 0.197Lx0.126W 5.00mmx3.20mm | - | - | Active | 1 (Unlimited) | - | XO (Standard) | - | - | 2.25V~3.6V | - | - | ±25ppm | CMOS | Standby | MEMS | - | 5.0mm x 3.2mm x 0.85mm | - | 2ns | 2ns | 55/45% | 95μA | Blank (User Must Program) | 10MHz~170MHz | - | 35mA | NO | - | 10MHz | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | - | ||
 DSC8001DL5 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | 4 | - | - | -40°C~105°C | Tube | 2009 | DSC8001 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | - | Active | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 1.8V~3.3V | 1.8V | 150MHz | 10 ppm | CMOS | Standby | MEMS | - | 2.5mm x 2.0mm x 0.85mm | 3.3V | 3ns | 3ns | - | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC6101JE2A-000.0000 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 4-SMD, No Lead | - | - | Commercial grade | -20°C~70°C | Bulk | - | DSC61XX | 0.098Lx0.079W 2.50mmx2.00mm | - | yes | Active | 1 (Unlimited) | - | XO (Standard) | - | - | 1.71V~3.63V | - | - | ±25ppm | CMOS | Enable/Disable | MEMS | 3mA Typ | - | - | - | - | - | - | Blank (User Must Program) | 1MHz~100MHz | - | - | - | - | - | - | 0.035 0.89mm | ROHS3 Compliant | - | AEC-Q100 | ||
DSC8001BL5 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | -40°C~105°C | Tube | - | DSC8001 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | - | Active | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 1.8V~3.3V | 1.8V | 150MHz | 10 ppm | CMOS | Standby | MEMS | - | 5.0mm x 3.2mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
DSC8001BI2T Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | -40°C~85°C | Tape & Reel (TR) | 2009 | DSC8001 | 0.197Lx0.126W 5.00mmx3.20mm | - | - | Active | 3 (168 Hours) | Solder | XO (Standard) | - | STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TAPE AND REEL | 1.8V~3.3V | 1.8V | 150MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | - | 5.0mm x 3.2mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
DSC8001AI1 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | - | - | - | -40°C~85°C | Tube | 2014 | DSC8001 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | - | Active | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 1.8V~3.3V | 1.8V | 150MHz | 50 ppm | CMOS | Standby | MEMS | - | 7.0mm x 5.0mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC8103CI5 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | 4 | - | - | -40°C~85°C | Tube | 2013 | DSC8103 | 0.126Lx0.098W 3.20mmx2.50mm | - | - | Active | 1 (Unlimited) | Solder | XO (Standard) | - | - | 2.25V~3.6V | - | 460MHz | 10 ppm | LVDS | Standby | MEMS | - | 3.2mm x 2.5mm x 0.85mm | - | 0.2ns | 0.2ns | - | - | Blank (User Must Program) | 10MHz~460MHz | 2pF | 32mA | - | 52 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC8123CI5 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 6-SMD, No Lead | - | 460MHz | - | -40°C~85°C | Tube | 2013 | DSC8123 | 0.126Lx0.098W 3.20mmx2.50mm | - | - | Active | 1 (Unlimited) | - | XO (Standard) | - | - | 2.25V~3.6V | - | - | ±10ppm | LVDS | Enable/Disable | MEMS | - | 3.2mm x 2.5mm x 0.85mm | - | 0.2ns | 0.2ns | 52/48% | 22mA | Blank (User Must Program) | 10MHz~460MHz | - | 32mA | NO | - | 10MHz | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | - | ||
DSC6102JE1A-000.0000 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 4-SMD, No Lead | - | - | Commercial grade | -20°C~70°C | Bulk | - | DSC61XX | 0.098Lx0.079W 2.50mmx2.00mm | - | yes | Active | 1 (Unlimited) | - | XO (Standard) | - | - | 1.71V~3.63V | - | - | ±50ppm | CMOS | Enable/Disable | MEMS | 3mA Typ | - | - | - | - | - | - | Blank (User Must Program) | 1MHz~100MHz | - | - | - | - | - | - | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
DSC8001CL2 Microchip Technology | In Stock | - | Datasheet | 12 Weeks | Surface Mount | Surface Mount | 4-SMD, No Lead | 4 | - | - | -40°C~105°C | Tube | - | DSC8001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | - | Active | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | - | 3.2mm x 2.5mm x 0.85mm | 3.3V | 3ns | 3ns | - | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | - | 55 % | - | 889μm | 0.035 0.90mm | ROHS3 Compliant | - | AEC-Q100 | ||
 DSC6001ME1A-000.0000T Microchip Technology | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 4-SMD, No Lead | - | - | - | -20°C~70°C | Tape & Reel (TR) | - | DSC60XX | 0.079Lx0.063W 2.00mmx1.60mm | - | yes | Active | 1 (Unlimited) | - | XO (Standard) | - | - | 1.71V~3.63V | - | - | ±50ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | - | - | - | - | - | 12μA | Blank (User Must Program) | 1MHz~80MHz | - | - | - | - | - | - | 0.035 0.89mm | ROHS3 Compliant | - | AEC-Q100 |