- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tool Is For Evaluation Of | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Note | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Evaluation Kit | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Contents | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Platform | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Product | Interconnect System | Suggested Programming Environment | Product Category | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 ATF15XX-DK3 Microchip Technology | 1 |
| Datasheet | 16 Weeks | - | - | - | - | - | 44 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Box | 1997 | - | - | Discontinued | 1 (Unlimited) | - | CPLD | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5V | - | - | - | Parallel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Yes | - | - | - | - | Board(s), Cable(s) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Lead Free | ||
 MPFS250-VIDEO-KIT Microchip Technology | 762 | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | 1 | MPFS250 | - | Microchip | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | MPFS250TS-1FCG1152I | - | - | - | - | - | - | - | - | - | - | - | FPGA | - | - | - | - | - | Development Tools | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Programmable Logic IC Development Tools | - | - | - | - | - | Board(s) | - | - | - | - | - | - | - | - | - | - | - | Evaluation Kits | - | - | Programmable Logic IC Development Tools | - | - | - | - | - | - | ||
AGLP030V5-CSG201I Microchip | 35 |
| - | - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP030 | - | 250 MHz | - | - | MICROSEMI CORP | - | AGLP030V5-CSG201I | - | - | - | Microchip Technology | - | - | - | 3 | - | 120 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.43 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | - | IGLOO PLUS | e3 | - | - | - | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B201 | 120 | Not Qualified | - | 1.5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | - | - | - | - | 30000 | - | - | - | STD | - | - | - | - | - | 792 | 792 | 30000 | - | - | - | - | - | - | 8 mm | 8 mm | - | - | - | ||
AGLE3000V5-FGG896 Microchip | In Stock | - | - | - | - | - | - | - | YES | - | - | - | 896 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | AGLE3000V5-FGG896 | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | - | 40 | 5.8 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e1 | - | - | - | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B896 | 620 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 75264 | 75264 | 3000000 | - | - | - | - | - | - | 31 mm | 31 mm | - | - | - | ||
APA1000-FGG1152I Microchip | In Stock | - | - | - | - | - | Surface Mount | 1152-BGA | YES | - | 1152-FPBGA (35x35) | - | 1152 | APA1000 | - | 180 MHz | - | - | MICROSEMI CORP | - | APA1000-FGG1152I | - | - | - | Microchip Technology | - | - | - | 3 | - | 712 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | - | Yes | 2.7 V | 2.3 V | 2.5 V | - | - | - | - | -40°C ~ 85°C (TA) | - | - | ProASICPLUS | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1 mm | compliant | - | - | S-PBGA-B1152 | 712 | Not Qualified | - | 2.5,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 712 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 202752 | 1000000 | - | - | - | - | - | - | - | - | - | - | 56320 | 1000000 | - | - | - | - | - | - | 35 mm | 35 mm | - | - | - | ||
AGL400V2-FGG144T Microchip | In Stock | - | - | - | - | Surface Mount | - | - | - | 144 | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | AGL400V2-FGG144T | - | - | - | - | - | - | - | 3 | - | 97 | - | - | - | - | - | - | - | - | - | - | Active | - | 30 | 5.77 | Compliant | Yes | - | - | - | - | - | - | - | - | - | - | - | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | - | - | 260 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | 6.8 kB | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9216 | - | - | - | - | 400000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AX2000-1FGG1152I Microchip | In Stock | - | - | - | Production (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 1152 | - | 400.011771 mg | 1152 | - | - | 763 MHz | - | - | MICROSEMI CORP | - | AX2000-1FGG1152I | - | - | - | - | - | - | - | 3 | - | 684 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 245 | 1 mm | compliant | 763 MHz | - | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | - | 1.575 V | 1.425 V | - | 36 kB | - | - | 850 ps | - | 850 ps | - | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | - | - | - | - | 2e+06 | 763 MHz | - | 21504 | 1 | - | - | 21504 | 0.84 ns | - | 21504 | 32256 | 2000000 | - | - | - | - | - | 1.73 mm | 35 mm | 35 mm | No | - | - | ||
AGL600V2-FGG484I Microchip | In Stock | - | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 108 MHz | - | - | ACTEL CORP | - | AGL600V2-FGG484I | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | - | 40 | 5.77 | - | Yes | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | e1 | - | - | - | - | TIN SILVER COPPER | - | - | - | - | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | 235 | Not Qualified | - | 1.2/1.5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | 600000 | - | - | - | - | - | - | 23 mm | 23 mm | - | - | - | ||
AGLE600V2-FGG484 Microchip | In Stock | - | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | AGLE600V2-FGG484 | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | - | 40 | 8.58 | - | Yes | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | e1 | - | - | - | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 270 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | 600000 | - | - | - | - | - | - | 23 mm | 23 mm | - | - | - | ||
A3PE1500-FGG484I Microchip | 2442 | - | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | Microchip Technology / Atmel | 350 MHz | 60 | - | MICROSEMI CORP | - | A3PE1500-FGG484I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 280 | 16000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | - | A3PE1500 | e1 | - | - | 3A001.A.7.A | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | - | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | - | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | - | - | - | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | - | - | 276480 | 1.5e+06 | 231 MHz | - | - | STD | - | - | 38400 | - | - | 38400 | 38400 | 1500000 | - | - | - | - | FPGA - Field Programmable Gate Array | 1.73 mm | 23 mm | 23 mm | No | - | - | ||
AGLN060V5-CSG81I Microchip | In Stock | - | - | - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | 81 | AGLN060 | - | - | - | - | MICROSEMI CORP | - | AGLN060V5-CSG81I | - | - | - | Microchip Technology | - | - | - | 3 | - | 60 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 2.07 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | - | IGLOO nano | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | - | - | - | 18432 | 60000 | - | - | - | STD | - | - | - | - | - | 1536 | - | 60000 | - | - | - | - | - | - | 5 mm | 5 mm | - | - | - | ||
A2F500M3G-FG256M Microchip | In Stock | - | - | - | - | - | - | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | - | 256 | A2F500 | - | - | - | - | MICROSEMI CORP | - | A2F500M3G-FG256M | - | - | - | Microchip Technology | - | - | - | - | - | MCU - 25, FPGA - 66 | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | - | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | - | 5.84 | Non-Compliant | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -55°C ~ 125°C (TJ) | - | - | SmartFusion® | - | - | - | - | - | - | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | BOTTOM | BALL | - | 1 mm | unknown | 80 MHz | - | S-PBGA-B256 | 66 | - | - | - | MILITARY | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | ARM | - | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | - | 11520 | 11520 | 500000 | 512KB | - | - | - | - | - | 17 mm | 17 mm | - | - | - | ||
AGLE3000V2-FG896 Microchip | In Stock | - | - | - | - | - | - | - | YES | - | - | - | 896 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | AGLE3000V2-FG896 | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.84 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B896 | 620 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 75264 | 75264 | 3000000 | - | - | - | - | - | - | 31 mm | 31 mm | - | - | - | ||
AGLP030V5-CSG201 Microchip | In Stock | - | - | - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP030 | - | 250 MHz | - | - | MICROSEMI CORP | - | AGLP030V5-CSG201 | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | 120 | - | 70 °C | - | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 0.85 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | 0 to 70 °C | - | - | IGLOO PLUS | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | 201 | S-PBGA-B201 | 120 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | - | - | - | - | 30000 | - | - | - | STD | - | - | - | - | - | 792 | 792 | 30000 | - | - | - | - | - | - | 8 mm | 8 mm | - | - | - | ||
AGLE600V5-FGG484 Microchip | In Stock | - | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 250 MHz | - | - | ACTEL CORP | - | AGLE600V5-FGG484 | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | - | 40 | 5.78 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e1 | - | - | - | - | TIN SILVER COPPER | - | - | - | - | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 270 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | 600000 | - | - | - | - | - | - | 23 mm | 23 mm | - | - | - | ||
AGL400V2-FG144T Microchip | In Stock | - | - | - | - | Surface Mount | - | - | - | 144 | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | AGL400V2-FG144T | - | - | - | - | - | - | - | 3 | - | 97 | - | - | - | - | - | - | - | - | - | - | Active | - | 20 | 5.82 | Non-Compliant | No | - | - | - | - | - | - | - | - | - | - | - | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | - | - | 235 | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | 6.8 kB | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9216 | - | - | - | - | 400000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AGL600V5-CSG281 Microchip | In Stock | - | - | - | - | - | Surface Mount | 281-TFBGA, CSBGA | YES | - | 281-CSP (10x10) | - | 281 | AGL600 | - | 108 MHz | - | - | MICROSEMI CORP | - | AGL600V5-CSG281 | - | - | - | Microchip Technology | - | - | - | 3 | - | 215 | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.46 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | 0°C ~ 70°C (TA) | - | - | IGLOO | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B281 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | - | - | - | 110592 | 600000 | - | - | - | STD | - | - | - | - | - | 13824 | - | 600000 | - | - | - | - | - | - | 10 mm | 10 mm | - | - | - | ||
AGL125V2-FG144I Microchip | In Stock | - | - | - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | AGL125 | - | 108 MHz | - | - | MICROSEMI CORP | - | AGL125V2-FG144I | - | - | - | Microchip Technology | - | - | - | 3 | - | 97 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 85°C (TA) | - | - | IGLOO | e0 | - | - | - | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | - | - | - | 36864 | 125000 | - | - | - | STD | - | - | - | - | - | 3072 | - | 125000 | - | - | - | - | - | - | 13 mm | 13 mm | - | - | - | ||
A3P600-2FG144I Microchip | In Stock | - | - | - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P600 | - | 350 MHz | - | - | MICROSEMI CORP | - | A3P600-2FG144I | - | - | - | Microchip Technology | - | - | - | 3 | - | 97 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | - | ProASIC3 | e0 | - | - | - | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 110592 | 600000 | - | - | - | 2 | - | - | - | - | - | 13824 | - | 600000 | - | - | - | - | - | - | 13 mm | 13 mm | - | - | - | ||
AX125-FGG324I Microchip | In Stock | - | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 324 | - | 400.011771 mg | 324 | - | - | 649 MHz | - | - | MICROSEMI CORP | - | AX125-FGG324I | - | - | - | - | - | - | - | 3 | - | 168 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Obsolete | - | 40 | 5.8 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e1 | - | - | - | - | TIN SILVER COPPER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | 649 MHz | - | S-PBGA-B324 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | - | 1.575 V | 1.425 V | - | 2.3 kB | - | - | 990 ps | - | 990 ps | - | - | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | - | - | - | - | 125000 | 649 MHz | - | 1344 | - | - | - | 1344 | 0.99 ns | - | 1344 | 2016 | 125000 | - | - | - | - | - | 1.25 mm | 19 mm | 19 mm | No | - | - |