- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
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![]() M2S025T-1VF400 Microchip | 2300 |
| - | - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2S025 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S025T-1VF400 | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | SMD/SMT | - | 207 | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | - | No | 1.26 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | - | 0 to 85 °C | - | SmartFusion®2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 160 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 1 | - | FPGA - 25K Logic Modules | - | - | - | 23988 | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - | ||
![]() M2GL060TS-1VFG400T2 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | M2GL060 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL060TS-1VFG400T2 | - | - | - | - | Microchip Technology | - | - | - | - | - | - | 207 | - | - | - | Tray | - | - | , | - | - | - | Active | Active | NOT SPECIFIED | 5.8 | - | Yes | - | - | - | - | - | 1.2000 V | - | - | -40 to 125 °C | - | Automotive, AEC-Q100, IGLOO2 | - | Yes | - | - | - | - | - | - | - | 1.14V ~ 2.625V | - | - | NOT SPECIFIED | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 56520 | - | 1869824 | - | - | - | - | - | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S050T-1FGG896I Microchip | 2115 |
| - | - | - | - | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M2S050 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S050T-1FGG896I | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | SMD/SMT | - | 377 | 56340 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.54 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | 896 | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 1 | - | FPGA - 50K Logic Modules | - | - | - | 56340 | 1 Core | - | 256KB | - | - | 31 mm | 31 mm | - | ||
![]() M2GL060T-FGG484 Microchip | 2053 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL060 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL060T-FGG484 | - | - | - | + 85 C | Microchip Technology | - | 0 C | - | 3 | SMD/SMT | - | 267 | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | - | 1869824 | - | - | - | - | - | - | 4 Transceiver | - | - | - | - | - | - | - | - | - | - | 23 mm | 23 mm | - | ||
![]() M2S150-1FCG1152 Microchip | 2252 |
| - | - | - | - | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | - | 1152 | M2S150 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S150-1FCG1152 | 166 MHz | - | - | - | Microchip Technology | - | - | - | 4 | SMD/SMT | - | 574 | 146124 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | - | 146124 | 1 Core | - | 512KB | - | - | 35 mm | 35 mm | - | ||
![]() M2S050-1FGG484 Microchip | 2650 |
| - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S050 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S050-1FGG484 | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | - | 267 | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | - | - | 56340 | 1 Core | - | 256KB | - | - | 23 mm | 23 mm | - | ||
![]() M2GL060T-1FCS325I Microchip | 2826 |
| - | - | - | Surface Mount | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | - | 325 | M2GL060 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL060T-1FCS325I | - | - | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 200 | 56520 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 20 | 5.26 | - | No | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | - | S-PBGA-B325 | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 56520 | - | 1869824 | - | - | - | - | - | - | 2 Transceiver | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M1A3P400-1FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | M1A3P400-1FGG484 | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 40 | 5.25 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | ||
![]() M2GL050T-FG896 Microchip | 2083 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M2GL050 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL050T-FG896 | - | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 377 | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | - | 0 to 85 °C | - | IGLOO2 | - | - | - | - | 85 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | - | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | 228.3 kB | - | - | - | - | - | - | - | - | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | 1869824 | - | - | - | - | - | STD | - | - | - | - | - | 56340 | - | - | - | - | - | 31 mm | 31 mm | - | ||
![]() A54SX08-1FGG144I Microchip | In Stock | - | - | - | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | - | 280 MHz | - | - | - | MICROSEMI CORP | - | - | A54SX08-1FGG144I | - | - | 3.63, 5.5 V | - | Microchip Technology | 2.97, 4.5 V | - | - | 3 | - | - | 111 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, ROHS COMPLIANT, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | - | - | 3.3, 5 V | - | - | -40 to 85 °C | - | SX | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | - | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | 280 MHz | - | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | INDUSTRIAL | 5.5 V | 4.5 V | - | - | - | - | - | - | 800 ps | - | 800 ps | - | - | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | - | 12000 | 280 MHz | 768 | - | 768 | 1 | - | - | 256 | 0.8 ns | 768 | 768 | - | 8000 | - | - | 1.05 mm | 13 mm | 13 mm | No | ||
![]() AGL1000V5-FGG484 Microchip | 2941 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | AGL1000 | - | 108 MHz | - | - | - | MICROSEMI CORP | - | - | AGL1000V5-FGG484 | - | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | 300 | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 1.44 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | - | 0 to 70 °C | - | IGLOO | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | - | 147456 | 1000000 | - | - | - | - | STD | - | - | - | - | 24576 | - | - | 1000000 | - | - | - | 23 mm | 23 mm | - | ||
![]() AX2000-1FGG1152M Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 1152-BGA | YES | 1152 | 1152-FPBGA (35x35) | 400.011771 mg | 1152 | AX2000 | - | 763 MHz | - | - | - | MICROSEMI CORP | - | - | AX2000-1FGG1152M | - | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 684 | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | Military grade | -55°C ~ 125°C (TA) | - | Axcelerator | e1 | - | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1 mm | compliant | - | - | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | - | - | 36 kB | - | - | - | 850 ps | - | - | - | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | - | 294912 | 2000000 | 763 MHz | 32256 | MIL-STD-883 Class B | - | 1 | - | - | 21504 | 0.84 ns | 21504 | 32256 | - | 2000000 | - | - | 1.73 mm | 35 mm | 35 mm | No | ||
![]() AGLP125V5-CS289I Microchip | In Stock | - | - | - | - | Surface Mount | 289-TFBGA, CSBGA | YES | - | 289-CSP (14x14) | - | 289 | AGLP125 | - | 250 MHz | - | - | - | MICROSEMI CORP | - | - | AGLP125V5-CS289I | - | - | - | - | Microchip Technology | - | - | - | - | - | - | 212 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA289,17X17,32 | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 1.64 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO PLUS | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | unknown | - | - | S-PBGA-B289 | 212 | Not Qualified | - | 1.5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 212 | 3120 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3120 | - | 36864 | 125000 | - | - | - | - | STD | - | - | - | - | 3120 | 3120 | - | 125000 | - | - | - | 14 mm | 14 mm | - | ||
![]() A54SX08-1FGG144 Microchip | In Stock | - | - | - | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | - | 280 MHz | - | - | - | MICROSEMI CORP | - | - | A54SX08-1FGG144 | - | - | 3.63, 5.25 V | - | Microchip Technology | 2.97, 4.75 V | - | - | 3 | - | - | 111 | - | 70 °C | - | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, ROHS COMPLIANT, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | - | - | 3.3, 5 V | - | - | 0 to 70 °C | - | SX | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | - | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | 280 MHz | - | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | COMMERCIAL | 5.25 V | 4.75 V | - | - | - | - | - | - | 800 ps | - | 800 ps | - | - | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | - | 12000 | 280 MHz | 768 | - | 768 | 1 | - | - | 256 | 0.8 ns | 768 | 768 | - | 8000 | - | - | 1.05 mm | 13 mm | 13 mm | No | ||
![]() A3P1000-FGG144T Microchip | 2144 |
| - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P1000 | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P1000-FGG144T | - | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 97 | - | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | Automotive grade | -40°C ~ 125°C (TA) | - | Automotive, AEC-Q100, ProASIC3 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | 97 | Not Qualified | - | 1.5/3.3 V | AUTOMOTIVE | - | - | - | - | - | - | - | - | - | - | - | - | - | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 147456 | 1000000 | - | - | AEC-Q100 | - | STD | - | - | - | - | 24576 | 24576 | - | 1000000 | - | - | - | 13 mm | 13 mm | - | ||
![]() A54SX32A-1FG144 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 144 | - | - | 278 MHz | - | - | - | MICROSEMI CORP | - | - | A54SX32A-1FG144 | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 30 | 5.32 | - | No | 2.75 V | 2.25 V | 2.5 V | - | - | - | - | - | - | - | - | e0 | - | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B144 | 111 | Not Qualified | - | 2.5,2.5/5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 111 | 2880 CLBS, 48000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 1.1 ns | 2880 | 2880 | - | 48000 | - | - | - | 13 mm | 13 mm | - | ||
![]() A3P250-FGG144I Microchip | 41 | - | - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | A3P250 | Microchip Technology / Atmel | 350 MHz | - | - | 160 | MICROSEMI CORP | - | - | A3P250-FGG144I | - | 350 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 97 I/O | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.3 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | - | 0.108878 oz | - | -40°C ~ 100°C (TJ) | Tray | A3P250 | e1 | - | 3A001.A.7.B | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | 30 mA | - | - | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | 36Kbit | 250000 | - | - | - | - | STD | - | - | - | - | 6144 | - | - | 250000 | - | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | - | ||
![]() AGL400V2-FG144 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 144 | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V2-FG144 | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 30 | 5.9 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | e0 | - | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B144 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | 400000 | - | - | - | 13 mm | 13 mm | - | ||
![]() A14V100A-RQ208C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | 75 MHz | - | - | - | MICROSEMI CORP | - | - | A14V100A-RQ208C | - | - | - | - | - | - | - | - | 4 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | HFQFP | PLASTIC, RQFP-208 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | - | 20 | 5.88 | - | No | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | - | e0 | - | - | TIN LEAD | - | - | MAX 175 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | - | S-PQFP-G208 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1377 CLBS, 10000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 3.9 ns | 1377 | - | - | 10000 | - | - | - | 28 mm | 28 mm | - | ||
![]() A2F200M3F-FGG484I Microchip | 6 |
| - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | A2F200 | - | 80 MHz | - | 200000 | - | MICROSEMI CORP | - | - | A2F200M3F-FGG484I | - | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | MCU - 41, FPGA - 94 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.39 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | - | -40 to 100 °C | - | SmartFusion® | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 94 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | MCU, FPGA | 94 | 4608 CLBS, 200000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | STD | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | 4608 | 4608 | - | 200000 | 256KB | - | - | 23 mm | 23 mm | - |