Filters
  • Manufacturer Part Number
  • Ihs Manufacturer
  • Part Life Cycle Code
  • Reach Compliance Code
  • Risk Rank
  • Rohs Code
  • Programmable Logic Type
  • JESD-30 Code
  • Number of Terminals
  • Package Body Material
  • Package Code
  • Package Shape

Attribute column

Manufacturer

Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

View Mode:
371 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Lifecycle Status

Mount

Mounting Type

Package / Case

Surface Mount

Number of Pins

Supplier Device Package

Weight

Number of Terminals

Base Product Number

Brand

Clock Frequency-Max

Data RAM Size

Device Logic Gates

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer Part Number

Maximum Clock Frequency

Maximum Operating Frequency

Maximum Operating Supply Voltage

Maximum Operating Temperature

Mfr

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting Styles

MSL

Number of I/Os

Number of Logic Elements

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Total Memory

Tradename

Typical Operating Supply Voltage

Unit Weight

Usage Level

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Frequency

Pin Count

JESD-30 Code

Number of Outputs

Qualification Status

Operating Supply Voltage

Power Supplies

Temperature Grade

Max Supply Voltage

Min Supply Voltage

Operating Supply Current

Speed

RAM Size

Core Processor

Peripherals

Program Memory Size

Propagation Delay

Connectivity

Turn On Delay Time

Data Rate

Architecture

Number of Inputs

Organization

Seated Height-Max

Programmable Logic Type

Number of Logic Elements/Cells

Product Type

Total RAM Bits

Number of Gates

Max Frequency

Number of LABs/CLBs

Screening Level

Number of Logic Blocks (LABs)

Speed Grade

Number of Transceivers

Primary Attributes

Number of Registers

Combinatorial Delay of a CLB-Max

Number of CLBs

Number of Logic Cells

Number of Cores

Number of Equivalent Gates

Flash Size

Product Category

Height

Length

Width

Radiation Hardening

2300
  • 1:$137.498268
  • 10:$129.715347
  • 100:$122.372969
  • 500:$115.446197
  • View all price
-

-

-

-

400-LFBGA

YES

-

400-VFBGA (17x17)

-

400

M2S025

-

-

64 kB

-

-

MICROSEMI CORP

-

-

M2S025T-1VF400

166 MHz

-

1.26 V

-

Microchip Technology

1.14 V

-

-

-

SMD/SMT

-

207

27696 LE

85 °C

-

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.3

-

No

1.26 V

1.14 V

1.2 V

-

-

1.2000 V

-

-

0 to 85 °C

-

SmartFusion®2

e0

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

-

-

BOTTOM

BALL

240

0.8 mm

not_compliant

-

-

S-PBGA-B400

160

Not Qualified

-

1.2 V

OTHER

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

160

-

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

1

-

FPGA - 25K Logic Modules

-

-

-

23988

1 Core

-

256KB

-

-

17 mm

17 mm

-

In Stock

-

-

-

-

-

-

-

-

-

-

-

M2GL060

-

-

-

-

-

MICROSEMI CORP

-

-

M2GL060TS-1VFG400T2

-

-

-

-

Microchip Technology

-

-

-

-

-

-

207

-

-

-

Tray

-

-

,

-

-

-

Active

Active

NOT SPECIFIED

5.8

-

Yes

-

-

-

-

-

1.2000 V

-

-

-40 to 125 °C

-

Automotive, AEC-Q100, IGLOO2

-

Yes

-

-

-

-

-

-

-

1.14V ~ 2.625V

-

-

NOT SPECIFIED

-

compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FIELD PROGRAMMABLE GATE ARRAY

56520

-

1869824

-

-

-

-

-

1

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2115
  • 1:$277.605413
  • 10:$261.891899
  • 100:$247.067829
  • 500:$233.082858
  • View all price
-

-

-

-

896-BGA

YES

-

896-FBGA (31x31)

-

896

M2S050

-

-

64 kB

-

-

MICROSEMI CORP

-

-

M2S050T-1FGG896I

166 MHz

-

1.26 V

-

Microchip Technology

1.14 V

-

-

-

SMD/SMT

-

377

56340 LE

-

-

Tray

PLASTIC/EPOXY

BGA

FBGA-896

BGA896,30X30,40

SQUARE

GRID ARRAY

Active

Active

40

1.54

-

Yes

1.26 V

1.14 V

1.2 V

-

-

1.2000 V

-

-

-40 to 100 °C

-

SmartFusion®2

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

-

BOTTOM

BALL

250

1 mm

compliant

-

896

S-PBGA-B896

377

Not Qualified

-

1.2 V

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

377

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

1

-

FPGA - 50K Logic Modules

-

-

-

56340

1 Core

-

256KB

-

-

31 mm

31 mm

-

2053
  • 1:$172.826223
  • 10:$163.043607
  • 100:$153.814723
  • 500:$145.108229
  • View all price
-

-

-

Surface Mount

484-BGA

YES

-

484-FPBGA (23x23)

-

484

M2GL060

-

-

-

-

-

MICROSEMI CORP

-

-

M2GL060T-FGG484

-

-

-

+ 85 C

Microchip Technology

-

0 C

-

3

SMD/SMT

-

267

56520 LE

85 °C

-

Tray

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Active

Active

30

5.26

-

Yes

1.26 V

1.14 V

1.2 V

-

-

-

-

-

0°C ~ 85°C (TJ)

-

IGLOO2

-

-

-

-

-

-

-

8542.39.00.01

-

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

-

-

S-PBGA-B484

-

-

1.2 V

-

OTHER

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

56520

-

1869824

-

-

-

-

-

-

4 Transceiver

-

-

-

-

-

-

-

-

-

-

23 mm

23 mm

-

2252
  • 1:$449.920609
  • 10:$424.453405
  • 100:$400.427741
  • 500:$377.762019
  • View all price
-

-

-

-

1152-BBGA, FCBGA

YES

-

1152-FCBGA (35x35)

-

1152

M2S150

-

-

64 kB

-

-

MICROSEMI CORP

-

-

M2S150-1FCG1152

166 MHz

-

-

-

Microchip Technology

-

-

-

4

SMD/SMT

-

574

146124 LE

85 °C

-

Tray

PLASTIC/EPOXY

BGA

FBGA-1152

BGA1152,34X34,40

SQUARE

GRID ARRAY

Active

Active

40

5.77

-

Yes

1.26 V

1.14 V

1.2 V

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

-

BOTTOM

BALL

250

1 mm

compliant

-

-

S-PBGA-B1152

574

Not Qualified

-

1.2 V

OTHER

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

574

-

2.9 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

FPGA - 150K Logic Modules

-

-

-

146124

1 Core

-

512KB

-

-

35 mm

35 mm

-

2650
  • 1:$197.855007
  • 10:$186.655667
  • 100:$176.090252
  • 500:$166.122879
  • View all price
-

-

-

-

484-BGA

YES

-

484-FPBGA (23x23)

-

484

M2S050

-

-

64 kB

-

-

MICROSEMI CORP

-

-

M2S050-1FGG484

166 MHz

-

-

-

Microchip Technology

-

-

-

3

SMD/SMT

-

267

56340 LE

85 °C

-

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

40

5.76

-

Yes

1.26 V

1.14 V

1.2 V

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

-

BOTTOM

BALL

250

1 mm

compliant

-

-

S-PBGA-B484

267

Not Qualified

-

1.2 V

OTHER

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

-

-

MCU, FPGA

267

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

56340

1 Core

-

256KB

-

-

23 mm

23 mm

-

2826
  • 1:$155.904588
  • 10:$147.079800
  • 100:$138.754528
  • 500:$130.900498
  • View all price
-

-

-

Surface Mount

325-TFBGA, FCBGA

YES

-

325-FCBGA (11x11)

-

325

M2GL060

-

-

-

-

-

MICROSEMI CORP

-

-

M2GL060T-1FCS325I

-

-

-

+ 100 C

Microchip Technology

-

- 40 C

-

-

SMD/SMT

-

200

56520 LE

-

-

Tray

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Active

Active

20

5.26

-

No

1.26 V

1.14 V

1.2 V

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

IGLOO2

-

-

-

-

-

-

-

8542.39.00.01

-

1.14V ~ 2.625V

BOTTOM

BALL

240

-

compliant

-

-

S-PBGA-B325

-

-

1.2 V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FIELD PROGRAMMABLE GATE ARRAY

56520

-

1869824

-

-

-

-

-

-

2 Transceiver

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

-

-

-

-

-

YES

-

-

-

484

-

-

350 MHz

-

-

-

MICROSEMI CORP

-

-

M1A3P400-1FGG484

-

-

-

-

-

-

-

-

3

-

-

-

-

85 °C

-

-

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Obsolete

-

40

5.25

-

Yes

1.575 V

1.425 V

1.5 V

-

-

-

-

-

-

-

-

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

-

BOTTOM

BALL

250

1 mm

compliant

-

-

S-PBGA-B484

-

Not Qualified

-

-

COMMERCIAL

-

-

-

-

-

-

-

-

-

-

-

-

-

-

9216 CLBS, 400000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

-

9216

-

-

400000

-

-

-

23 mm

23 mm

-

2083
  • 1:$198.993724
  • 10:$187.729928
  • 100:$177.103706
  • 500:$167.078968
  • View all price
-

Production (Last Updated: 2 months ago)

-

Surface Mount

896-BGA

YES

-

896-FBGA (31x31)

-

896

M2GL050

-

-

-

-

-

MICROSEMI CORP

-

-

M2GL050T-FG896

-

-

1.26 V

-

Microchip Technology

1.14 V

-

-

3

-

-

377

-

85 °C

-

Tray

PLASTIC/EPOXY

BGA

BGA, BGA896,30X30,40

BGA896,30X30,40

SQUARE

GRID ARRAY

Active

Active

20

5.3

Non-Compliant

No

1.26 V

1.14 V

1.2 V

-

-

1.2000 V

-

-

0 to 85 °C

-

IGLOO2

-

-

-

-

85 °C

0 °C

-

8542.39.00.01

-

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

-

-

S-PBGA-B896

377

Not Qualified

-

1.2 V

OTHER

-

-

-

-

228.3 kB

-

-

-

-

-

-

-

-

377

-

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

56340

-

1869824

-

-

-

-

-

STD

-

-

-

-

-

56340

-

-

-

-

-

31 mm

31 mm

-

In Stock

-

-

-

Surface Mount

Surface Mount

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

A54SX08

-

280 MHz

-

-

-

MICROSEMI CORP

-

-

A54SX08-1FGG144I

-

-

3.63, 5.5 V

-

Microchip Technology

2.97, 4.5 V

-

-

3

-

-

111

-

85 °C

-40 °C

Tray

PLASTIC/EPOXY

LBGA

1 MM PITCH, ROHS COMPLIANT, FBGA-144

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

Active

40

5.24

Compliant

Yes

3.6 V

3 V

3.3 V

-

-

3.3, 5 V

-

-

-40 to 85 °C

-

SX

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

-

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

280 MHz

-

S-PBGA-B144

111

Not Qualified

5 V

3.3,5 V

INDUSTRIAL

5.5 V

4.5 V

-

-

-

-

-

-

800 ps

-

800 ps

-

-

111

768 CLBS, 8000 GATES

1.55 mm

FIELD PROGRAMMABLE GATE ARRAY

768

-

-

12000

280 MHz

768

-

768

1

-

-

256

0.8 ns

768

768

-

8000

-

-

1.05 mm

13 mm

13 mm

No

2941
  • 1:$198.846815
  • 10:$187.591335
  • 100:$176.972957
  • 500:$166.955620
  • View all price
-

-

-

Surface Mount

484-BGA

YES

-

484-FPBGA (23x23)

-

484

AGL1000

-

108 MHz

-

-

-

MICROSEMI CORP

-

-

AGL1000V5-FGG484

-

-

1.575 V

-

Microchip Technology

1.425 V

-

-

3

-

-

300

-

85 °C

-

Tray

PLASTIC/EPOXY

BGA

BGA,

-

SQUARE

GRID ARRAY

Active

Active

40

1.44

-

Yes

1.575 V

1.425 V

1.5 V

-

-

1.5000 V

-

-

0 to 70 °C

-

IGLOO

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

-

-

S-PBGA-B484

-

Not Qualified

-

-

OTHER

-

-

-

-

-

-

-

-

-

-

-

-

-

-

24576 CLBS, 1000000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

24576

-

147456

1000000

-

-

-

-

STD

-

-

-

-

24576

-

-

1000000

-

-

-

23 mm

23 mm

-

In Stock

-

-

Production (Last Updated: 2 months ago)

Surface Mount

Surface Mount

1152-BGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

AX2000

-

763 MHz

-

-

-

MICROSEMI CORP

-

-

AX2000-1FGG1152M

-

-

-

-

Microchip Technology

-

-

-

3

-

-

684

-

125 °C

-55 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA1152,34X34,40

BGA1152,34X34,40

SQUARE

GRID ARRAY

Active

Active

40

5.29

Compliant

Yes

1.575 V

1.425 V

1.5 V

-

-

-

-

Military grade

-55°C ~ 125°C (TA)

-

Axcelerator

e1

-

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

-

1.425V ~ 1.575V

BOTTOM

BALL

245

1 mm

compliant

-

-

S-PBGA-B1152

684

Not Qualified

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

-

-

36 kB

-

-

-

850 ps

-

-

-

-

684

21504 CLBS, 2000000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

21504

-

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

-

1

-

-

21504

0.84 ns

21504

32256

-

2000000

-

-

1.73 mm

35 mm

35 mm

No

In Stock

-

-

-

-

Surface Mount

289-TFBGA, CSBGA

YES

-

289-CSP (14x14)

-

289

AGLP125

-

250 MHz

-

-

-

MICROSEMI CORP

-

-

AGLP125V5-CS289I

-

-

-

-

Microchip Technology

-

-

-

-

-

-

212

-

85 °C

-40 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA289,17X17,32

BGA289,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Obsolete

NOT SPECIFIED

1.64

-

No

1.575 V

1.425 V

1.5 V

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

IGLOO PLUS

-

-

-

-

-

-

-

8542.39.00.01

-

1.425V ~ 1.575V

BOTTOM

BALL

NOT SPECIFIED

0.8 mm

unknown

-

-

S-PBGA-B289

212

Not Qualified

-

1.5 V

INDUSTRIAL

-

-

-

-

-

-

-

-

-

-

-

-

-

212

3120 CLBS, 125000 GATES

1.2 mm

FIELD PROGRAMMABLE GATE ARRAY

3120

-

36864

125000

-

-

-

-

STD

-

-

-

-

3120

3120

-

125000

-

-

-

14 mm

14 mm

-

In Stock

-

-

-

Surface Mount

Surface Mount

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

A54SX08

-

280 MHz

-

-

-

MICROSEMI CORP

-

-

A54SX08-1FGG144

-

-

3.63, 5.25 V

-

Microchip Technology

2.97, 4.75 V

-

-

3

-

-

111

-

70 °C

-

Tray

PLASTIC/EPOXY

LBGA

1 MM PITCH, ROHS COMPLIANT, FBGA-144

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

Active

40

5.24

Compliant

Yes

3.6 V

3 V

3.3 V

-

-

3.3, 5 V

-

-

0 to 70 °C

-

SX

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

-

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

280 MHz

-

S-PBGA-B144

111

Not Qualified

5 V

3.3,5 V

COMMERCIAL

5.25 V

4.75 V

-

-

-

-

-

-

800 ps

-

800 ps

-

-

111

768 CLBS, 8000 GATES

1.55 mm

FIELD PROGRAMMABLE GATE ARRAY

768

-

-

12000

280 MHz

768

-

768

1

-

-

256

0.8 ns

768

768

-

8000

-

-

1.05 mm

13 mm

13 mm

No

2144
  • 1:$270.754489
  • 10:$255.428763
  • 100:$240.970531
  • 500:$227.330690
  • View all price
-

-

-

Surface Mount

144-LBGA

YES

-

144-FPBGA (13x13)

-

144

A3P1000

-

350 MHz

-

-

-

MICROSEMI CORP

-

-

A3P1000-FGG144T

-

-

-

-

Microchip Technology

-

-

-

3

-

-

97

-

125 °C

-40 °C

Tray

PLASTIC/EPOXY

LBGA

LBGA, BGA144,12X12,40

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

Active

30

5.23

-

Yes

1.575 V

1.425 V

1.5 V

-

-

-

-

Automotive grade

-40°C ~ 125°C (TA)

-

Automotive, AEC-Q100, ProASIC3

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

-

-

S-PBGA-B144

97

Not Qualified

-

1.5/3.3 V

AUTOMOTIVE

-

-

-

-

-

-

-

-

-

-

-

-

-

97

24576 CLBS, 1000000 GATES

1.55 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

147456

1000000

-

-

AEC-Q100

-

STD

-

-

-

-

24576

24576

-

1000000

-

-

-

13 mm

13 mm

-

In Stock

-

-

-

-

-

-

YES

-

-

-

144

-

-

278 MHz

-

-

-

MICROSEMI CORP

-

-

A54SX32A-1FG144

-

-

-

-

-

-

-

-

3

-

-

-

-

70 °C

-

-

PLASTIC/EPOXY

LBGA

1 MM PITCH, FBGA-144

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

-

30

5.32

-

No

2.75 V

2.25 V

2.5 V

-

-

-

-

-

-

-

-

e0

-

-

Tin/Lead/Silver (Sn/Pb/Ag)

-

-

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

-

-

BOTTOM

BALL

225

1 mm

unknown

-

-

S-PBGA-B144

111

Not Qualified

-

2.5,2.5/5 V

COMMERCIAL

-

-

-

-

-

-

-

-

-

-

-

-

-

111

2880 CLBS, 48000 GATES

1.55 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

1.1 ns

2880

2880

-

48000

-

-

-

13 mm

13 mm

-

41

-

-

-

-

Surface Mount

FBGA-144

YES

-

144-FPBGA (13x13)

-

144

A3P250

Microchip Technology / Atmel

350 MHz

-

-

160

MICROSEMI CORP

-

-

A3P250-FGG144I

-

350 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

Yes

3

SMD/SMT

MSL 3 - 168 hours

97 I/O

3000 LE

100 °C

-40 °C

Tray

PLASTIC/EPOXY

LBGA

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

-

SQUARE

GRID ARRAY, LOW PROFILE

Active

Active

40

1.3

Details

Yes

1.575 V

1.425 V

1.5 V

36864 bit

ProASIC3

-

0.108878 oz

-

-40°C ~ 100°C (TJ)

Tray

A3P250

e1

-

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

Programmable Logic ICs

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

-

-

S-PBGA-B144

-

Not Qualified

1.5 V

-

INDUSTRIAL

-

-

30 mA

-

-

-

-

-

-

-

-

-

-

-

6144 CLBS, 250000 GATES

1.55 mm

FIELD PROGRAMMABLE GATE ARRAY

-

FPGA - Field Programmable Gate Array

36Kbit

250000

-

-

-

-

STD

-

-

-

-

6144

-

-

250000

-

FPGA - Field Programmable Gate Array

1.05 mm

13 mm

13 mm

-

In Stock

-

-

-

-

-

-

YES

-

-

-

144

-

-

-

-

-

-

MICROSEMI CORP

-

-

AGL400V2-FG144

-

-

-

-

-

-

-

-

3

-

-

-

-

85 °C

-

-

PLASTIC/EPOXY

LBGA

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

-

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

-

30

5.9

-

No

1.575 V

1.14 V

1.2 V

-

-

-

-

-

-

-

-

e0

-

-

Tin/Lead/Silver (Sn/Pb/Ag)

-

-

-

8542.39.00.01

-

-

BOTTOM

BALL

230

1 mm

unknown

-

-

S-PBGA-B144

-

Not Qualified

-

-

OTHER

-

-

-

-

-

-

-

-

-

-

-

-

-

-

9216 CLBS, 400000 GATES

1.55 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

-

9216

-

-

400000

-

-

-

13 mm

13 mm

-

In Stock

-

-

-

-

-

-

YES

-

-

-

208

-

-

75 MHz

-

-

-

MICROSEMI CORP

-

-

A14V100A-RQ208C

-

-

-

-

-

-

-

-

4

-

-

-

-

70 °C

-

-

PLASTIC/EPOXY

HFQFP

PLASTIC, RQFP-208

-

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Obsolete

-

20

5.88

-

No

3.6 V

3 V

3.3 V

-

-

-

-

-

-

-

-

e0

-

-

TIN LEAD

-

-

MAX 175 I/OS

8542.39.00.01

-

-

QUAD

GULL WING

225

0.5 mm

compliant

-

-

S-PQFP-G208

-

Not Qualified

-

-

COMMERCIAL

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1377 CLBS, 10000 GATES

4.1 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

-

-

-

-

3.9 ns

1377

-

-

10000

-

-

-

28 mm

28 mm

-

6
-

-

-

-

484-BGA

YES

-

484-FPBGA (23x23)

-

484

A2F200

-

80 MHz

-

200000

-

MICROSEMI CORP

-

-

A2F200M3F-FGG484I

-

-

1.575 V

-

Microchip Technology

1.425 V

-

-

3

-

-

MCU - 41, FPGA - 94

-

100 °C

-40 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

1.39

-

Yes

1.575 V

1.425 V

1.5 V

-

-

1.5000 V

-

-

-40 to 100 °C

-

SmartFusion®

e1

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

-

BOTTOM

BALL

250

1 mm

compliant

-

-

S-PBGA-B484

94

Not Qualified

-

1.5,1.8,2.5,3.3 V

INDUSTRIAL

-

-

-

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

-

-

EBI/EMI, Ethernet, I²C, SPI, UART/USART

-

-

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

STD

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

4608

4608

-

200000

256KB

-

-

23 mm

23 mm

-