- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Clock Frequency-Max (fCLK) | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | Tool Is For Evaluation Of | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Number of Terminations | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Composition | Power (Watts) | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Failure Rate | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Note | Speed | RAM Size | Operating Mode | Core Processor | Peripherals | Program Memory Size | Connectivity | Supply Current-Max | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Memory Width | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Evaluation Kit | Standby Current-Max | Memory Density | Total RAM Bits | Number of Gates | Contents | Parallel/Serial | Memory IC Type | Speed Grade | Number of Transceivers | Endurance | Primary Attributes | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Platform | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product | Features | Interconnect System | Suggested Programming Environment | Product Category | Height Seated (Max) | Length | Width | Ratings |
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 SF2-STARTER-KIT-ES-2 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AT17N002-10CI Microchip | In Stock | - | - | - | - | - | YES | - | 8 | - | - | - | 10 MHz | - | - | - | ATMEL CORP | - | - | - | AT17N002-10CI | - | - | - | - | - | - | - | 3 | - | - | - | - | 2097152 words | 2000000 | 85 °C | -40 °C | - | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | - | 30 | 5.91 | - | No | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | e0 | - | - | EAR99 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.32.00.51 | - | - | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | - | Not Qualified | - | - | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | - | - | - | SYNCHRONOUS | - | - | - | - | 0.005 mA | - | - | - | 2MX1 | 1.14 mm | 1 | - | - | - | - | 0.00015 A | 2097152 bit | - | - | - | SERIAL | CONFIGURATION MEMORY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.99 mm | 5.99 mm | - | ||
AT17N010-10CI Microchip | In Stock | - | - | - | - | - | YES | - | 8 | - | - | - | 10 MHz | - | - | - | ATMEL CORP | - | - | - | AT17N010-10CI | - | - | - | - | - | - | - | 3 | - | - | - | - | 1048576 words | 1000000 | 85 °C | -40 °C | - | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | - | 30 | 5.91 | - | No | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | e0 | - | - | EAR99 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.32.00.51 | - | - | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | - | Not Qualified | - | - | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | - | - | - | SYNCHRONOUS | - | - | - | - | 0.005 mA | - | - | - | 1MX1 | 1.14 mm | 1 | - | - | - | - | 0.0001 A | 1048576 bit | - | - | - | SERIAL | CONFIGURATION MEMORY | - | - | 10 Write/Erase Cycles | - | - | 20 | - | - | - | - | - | - | - | - | - | - | - | - | 5.99 mm | 5.99 mm | - | ||
AT17F080-30CC Microchip | In Stock | - | - | - | - | - | YES | - | 8 | - | - | - | 33 MHz | - | - | - | ATMEL CORP | - | - | - | AT17F080-30CC | - | - | - | - | - | - | - | 3 | - | - | - | - | 8388608 words | 8000000 | 70 °C | - | - | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | - | 30 | 5.71 | - | No | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | e0 | - | - | EAR99 | - | NOR TYPE | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.32.00.51 | - | - | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | - | Not Qualified | - | - | 3.63 V | 3/3.3 V | COMMERCIAL | 2.97 V | - | - | - | SYNCHRONOUS | - | - | - | - | 0.02 mA | - | - | - | 8MX1 | 1.14 mm | 1 | - | - | - | - | 0.001 A | 8388608 bit | - | - | - | SERIAL | CONFIGURATION MEMORY | - | - | - | - | 0.03 ms | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.99 mm | 5.99 mm | - | ||
AT17N010-10CC Microchip | In Stock | - | - | - | - | - | YES | - | 8 | - | - | - | 15 MHz | - | - | - | ATMEL CORP | - | - | - | AT17N010-10CC | - | - | - | - | - | - | - | 3 | - | - | - | - | 1048576 words | 1000000 | 70 °C | - | - | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | - | 30 | 5.91 | - | No | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | e0 | - | - | EAR99 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.32.00.51 | - | - | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | - | Not Qualified | - | - | 3.6 V | 3.3 V | COMMERCIAL | 3 V | - | - | - | SYNCHRONOUS | - | - | - | - | 0.005 mA | - | - | - | 1MX1 | 1.14 mm | 1 | - | - | - | - | 0.0001 A | 1048576 bit | - | - | - | SERIAL | CONFIGURATION MEMORY | - | - | 10 Write/Erase Cycles | - | - | 20 | - | - | - | - | - | - | - | - | - | - | - | - | 5.99 mm | 5.99 mm | - | ||
AT17N512-10CI Microchip | In Stock | - | - | - | - | - | YES | - | 8 | - | - | - | 10 MHz | - | - | - | ATMEL CORP | - | - | - | AT17N512-10CI | - | - | - | - | - | - | - | 3 | - | - | - | - | 524288 words | 512000 | 85 °C | -40 °C | - | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | - | 30 | 5.92 | - | No | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | e0 | - | - | EAR99 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.32.00.51 | - | - | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | - | Not Qualified | - | - | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | - | - | - | SYNCHRONOUS | - | - | - | - | 0.005 mA | - | - | - | 512KX1 | 1.14 mm | 1 | - | - | - | - | 0.0001 A | 524288 bit | - | - | - | SERIAL | CONFIGURATION MEMORY | - | - | 10 Write/Erase Cycles | - | - | 20 | - | - | - | - | - | - | - | - | - | - | - | - | 5.99 mm | 5.99 mm | - | ||
MPFS250-VIDEO-KIT-ES Microchip | In Stock | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | 1 | MPFS250 | - | - | - | Microchip | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA | - | - | - | - | - | - | Development Tools | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Video IC Development Tools | - | - | - | - | - | Board(s) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Video IC Development Tools | - | - | - | - | ||
SF2-DEV-KIT Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | Miscellaneous | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | - | - | Box | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Power Supply, Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
CORE429-DEV-KIT-3 Microchip | In Stock | - | - | Production (Last Updated: 1 month ago) | - | - | - | - | - | CORE429 | - | - | - | - | - | Core429, M1AFS1500 | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | - | - | Electronic Delivery | - | - | - | - | - | - | - | - | Active | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | Fusion® | - | - | - | - | - | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Yes | - | - | - | - | Board(s), Cable(s), Power Supply, Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M2S010TS-VFG256 Microchip | 6 |
| - | Production (Last Updated: 2 months ago) | - | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | M2S010TS-VFG256 | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | - | 138 | - | 12084 LE | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 40 | 5.8 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | - | - | e1 | - | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | - | 0.8 mm | compliant | - | S-PBGA-B256 | 138 | Not Qualified | - | - | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 138 | - | 1.56 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | STD | - | - | FPGA - 10K Logic Modules | - | - | - | - | 12084 | 1 Core | - | 256KB | - | - | - | - | - | - | 14 mm | 14 mm | - | ||
A3PE-STARTER-KIT-WO-FP4 Microchip | 621 |
| - | - | - | - | - | - | - | A3PE1500 | - | - | - | - | - | A3PE1500 | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | - | - | Box | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | A3PE1500-PQ208 | - | - | - | - | - | ProASIC3E | - | - | - | - | - | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s) | - | - | - | - | - | - | - | - | ProASIC3E FPGA | - | - | - | - | - | Starter Kits | - | - | - | - | - | - | - | - | ||
RTPF-DEV-KIT-CB Microchip | 819 | - | - | - | - | 0805 (2012 Metric) | - | 0805 | - | RN73R2A | - | - | - | - | - | RTPF500T | - | - | - | - | - | - | - | - | KOA Speer Electronics, Inc. | - | - | - | - | - | - | - | - | - | - | - | - | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | -55°C ~ 155°C | - | RN73R | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.25% | - | - | 2 | - | ±10ppm/°C | FPGA + MCU/MPU SoC | 1.54 kOhms | - | Thin Film | 0.125W, 1/8W | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Power Supply, Accessories | - | - | - | - | - | - | - | - | Radiation-Tolerant PolarFire SoC FPGA | - | - | - | - | - | Development Kits | Automotive AEC-Q200, Moisture Resistant | FMC, Pmod | Libero SoC | - | 0.024 (0.60mm) | - | - | AEC-Q200 | ||
M2GL025TS-1VFG400T2 Microchip | In Stock | - | - | - | - | - | - | - | - | M2GL025 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL025TS-1VFG400T2 | - | - | - | Microchip Technology | - | - | - | - | - | 207 | - | - | - | - | - | - | Tray | - | - | , | - | - | - | Active | - | Active | NOT SPECIFIED | 5.82 | - | Yes | - | - | - | - | - | - | 1.2000 V | - | -40 to 125 °C | - | Automotive, AEC-Q100, IGLOO2 | - | - | - | Yes | - | - | - | - | - | - | - | - | - | - | - | 1.14V ~ 2.625V | - | - | NOT SPECIFIED | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | - | - | - | 1130496 | - | - | - | - | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A1010B-VQG80I Microchip | In Stock | - | - | - | - | - | YES | - | 80 | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | A1010B-VQG80I | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | - | - | 40 | 5.78 | - | Yes | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | - | - | e3 | - | - | - | - | - | - | MATTE TIN | - | - | - | - | - | - | QUAD | GULL WING | 260 | - | 0.65 mm | compliant | - | S-PQFP-G80 | - | Not Qualified | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 295 CLBS, 1200 GATES | 1.2 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 295 | - | - | 1200 | - | - | - | - | - | - | - | 14 mm | 14 mm | - | ||
M2GL150-FCVG484 Microchip | 2699 |
| - | - | Surface Mount | 484-BFBGA | YES | 484-BGA | 484 | M2GL150 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL150-FCVG484 | - | - | - | Microchip Technology | - | - | - | 4 | - | 248 | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | FBGA | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484 | - | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Active | 30 | 5.27 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | - | 0.8 mm | compliant | - | S-PBGA-B484 | - | - | - | - | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.15 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | - | - | - | 5120000 | - | - | - | - | STD | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 19 mm | 19 mm | - | ||
M2S150T-FCG1152 Microchip | 2994 |
| - | - | - | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | M2S150T-FCG1152 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 4 | - | 574 | - | 146124 LE | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.77 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | - | - | e1 | - | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | - | 1 mm | compliant | 1152 | S-PBGA-B1152 | 574 | Not Qualified | - | - | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 574 | - | 2.9 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | STD | - | - | FPGA - 150K Logic Modules | - | - | - | - | 146124 | 1 Core | - | 512KB | - | - | - | - | - | - | 35 mm | 35 mm | - | ||
M2GL005-1VFG256 Microchip | 11 |
| - | - | Surface Mount | VFBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL005 | Microchip Technology / Atmel | - | - | - | 119 | - | MICROSEMI CORP | - | - | - | M2GL005-1VFG256 | - | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 161 I/O | - | 6060 LE | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | 5.28 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | IGLOO2 | - | - | 0°C ~ 85°C (TJ) | Tray | M2GL005 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | - | 0.8 mm | compliant | - | S-PBGA-B256 | - | - | 1.2 V | - | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.56 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | - | - | - | 719872 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | - | 14 mm | 14 mm | - | ||
M2GL060-VFG400I Microchip | 280 | - | - | - | Surface Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2GL060 | Microchip Technology / Atmel | - | - | - | 90 | - | MICROSEMI CORP | - | - | - | M2GL060-VFG400I | - | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 207 | - | 56520 LE | - | - | - | - | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | 5.25 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | IGLOO2 | - | 0.299386 oz | -40°C ~ 100°C (TJ) | Tray | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | - | 0.8 mm | compliant | - | S-PBGA-B400 | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 667 Mb/s | - | - | - | 1.51 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 56520 | FPGA - Field Programmable Gate Array | - | - | - | 1869824 | - | - | - | - | STD | 4 Transceiver | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | - | 17 mm | 17 mm | - | ||
M1A3P1000L-FG256I Microchip | 2263 |
| - | - | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | - | 350 MHz | - | - | - | - | MICROSEMI CORP | - | - | - | M1A3P1000L-FG256I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | 177 | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.24 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | - | 1 mm | compliant | - | S-PBGA-B256 | 177 | Not Qualified | - | - | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 147456 | 1000000 | - | - | - | STD | - | - | - | - | - | - | 24576 | 24576 | - | 1000000 | - | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
M2S090TS-1FG676I Microchip | 2853 |
| - | - | - | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | Microchip Technology / Atmel | - | - | 64 kB | 40 | - | MICROSEMI CORP | - | - | - | M2S090TS-1FG676I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.29 | N | No | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 1.071118 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | e0 | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | - | 1 mm | not_compliant | - | S-PBGA-B676 | 425 | Not Qualified | - | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 425 | - | 2.44 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | SoC FPGA | - | - | - | - | - | - | - | - | - | - | - | FPGA - 90K Logic Modules | - | - | - | - | 86316 | 1 Core | - | 512KB | - | - | - | - | SoC FPGA | - | 27 mm | 27 mm | - |