- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M1AFS600-FG256K Microchip | In Stock | - | - | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | - | 256 | M1AFS600 | - | - | MICROSEMI CORP | - | - | M1AFS600-FG256K | - | - | - | Microchip Technology | - | - | 3 | - | 119 | - | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.3 | Non-Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | -55°C ~ 100°C (TJ) | Fusion® | e0 | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | - | - | OTHER | - | - | - | - | 13.5 kB | - | - | - | - | - | - | - | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | - | - | - | - | - | - | - | - | 600000 | - | - | 17 mm | 17 mm | - | ||
M2S060TS-1FG484 Microchip | 2916 |
| - | Production (Last Updated: 2 months ago) | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S060 | - | 64 kB | MICROSEMI CORP | - | - | M2S060TS-1FG484 | 166 MHz | - | - | Microchip Technology | - | - | 3 | - | 267 | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | 256KB | - | 23 mm | 23 mm | - | ||
M2GL060T-FG676I Microchip | 2395 |
| - | - | - | Surface Mount | 676-BGA | YES | - | 676-FBGA (27x27) | - | 676 | M2GL060 | - | - | MICROSEMI CORP | - | - | M2GL060T-FG676I | - | - | + 100 C | Microchip Technology | - | - 40 C | 3 | SMD/SMT | 387 | 56520 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 20 | 5.26 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | S-PBGA-B676 | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | - | - | - | - | - | 4 Transceiver | - | - | - | - | - | - | - | - | - | 27 mm | 27 mm | - | ||
M2GL150-FC1152I Microchip | 2522 |
| - | - | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | - | 1152 | M2GL150 | - | - | MICROSEMI CORP | - | - | M2GL150-FC1152I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | 574 | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | - | No | FPGA - Field Programmable Gate Array IGLOO 2 | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | - | - | - | - | STD | - | - | - | - | - | 146124 | - | - | - | - | 35 mm | 35 mm | - | ||
M2S005-1FG484I Microchip | 48 |
| - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S005 | - | 64 kB | MICROSEMI CORP | - | - | M2S005-1FG484I | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | 3 | SMD/SMT | 209 | 6060 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.86 | - | No | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B484 | 217 | Not Qualified | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 217 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | 1 | - | FPGA - 5K Logic Modules | - | - | - | 4956 | 1 Core | - | 128KB | - | 23 mm | 23 mm | - | ||
M2GL090TS-FCS325 Microchip | 2729 |
| - | - | - | Surface Mount | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | - | 325 | M2GL090 | - | - | MICROSEMI CORP | - | - | M2GL090TS-FCS325 | - | - | - | Microchip Technology | - | - | - | - | 180 | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | 0°C ~ 85°C (TJ) | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | - | - | - | - | - | - | - | - | - | - | 86316 | - | - | - | - | - | - | - | ||
M2S150-1FCS536I Microchip | In Stock | - | - | - | - | - | 536-LFBGA, CSPBGA | YES | - | 536-CSPBGA (16x16) | - | 536 | M2S150 | - | 64 kB | MICROSEMI CORP | - | - | M2S150-1FCS536I | 166 MHz | - | - | Microchip Technology | - | - | - | - | 293 | 146124 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA536,30X30,20 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | - | No | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | - | not_compliant | - | S-PBGA-B536 | 293 | Not Qualified | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | 1 | - | FPGA - 150K Logic Modules | - | - | - | 146124 | 1 Core | - | 512KB | - | - | - | - | ||
M2GL060TS-VF400 Microchip | 2576 |
| - | - | - | Surface Mount | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2GL060 | - | - | MICROSEMI CORP | - | - | M2GL060TS-VF400 | - | - | + 85 C | Microchip Technology | - | 0 C | - | SMD/SMT | 207 | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.26 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | 0°C ~ 85°C (TJ) | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | - | S-PBGA-B400 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | - | - | - | - | - | 4 Transceiver | - | - | - | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
M2GL150S-1FCG1152I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 1152 | - | - | - | MICROSEMI CORP | - | - | M2GL150S-1FCG1152I | - | - | - | - | - | - | 4 | - | - | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | 5.82 | - | Yes | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 146124 | - | - | - | - | - | - | - | ||
M2GL050S-1FGG484I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | - | - | - | 484 | - | - | - | MICROSEMI CORP | - | - | M2GL050S-1FGG484I | - | - | - | - | - | - | 3 | - | 267 | - | - | - | - | PLASTIC/EPOXY | BGA | - | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | - | 5.82 | Compliant | Yes | - | - | - | 1.2 V | - | - | - | - | - | 100 °C | -40 °C | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | - | 228.3 kB | - | - | - | - | - | - | 267 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | - | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | - | - | ||
M2GL025S-1VFG400I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 400 | - | - | 400 | - | - | - | MICROSEMI CORP | - | - | M2GL025S-1VFG400I | - | - | - | - | - | - | 3 | - | 207 | - | - | - | - | PLASTIC/EPOXY | FBGA | - | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | 5.82 | Compliant | Yes | - | - | - | 1.2 V | - | - | - | - | - | 100 °C | -40 °C | - | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | - | - | - | - | - | 138 kB | - | - | - | - | - | - | 207 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | - | - | - | - | - | - | - | - | - | - | 27696 | - | - | - | - | - | - | - | ||
A54SX72A-1FG484I Microchip | 2540 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (27X27) | - | 484 | A54SX72 | 250 MHz | - | MICROSEMI CORP | - | - | A54SX72A-1FG484I | - | 2.75 V | - | Microchip Technology | 2.25 V | - | 3 | - | 360 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | - | No | - | 2.75 V | 2.25 V | 2.5 V | 2.5000 V | -40 to 85 °C | SX-A | e0 | Tin/Lead (Sn/Pb) | - | - | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | - | S-PBGA-B484 | 360 | Not Qualified | - | 2.5,3.3/5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 360 | 6036 CLBS, 108000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 108000 | - | 6036 | - | 1 | - | - | - | 1.3 ns | 6036 | 6036 | - | 108000 | - | - | 27 mm | 27 mm | - | ||
M2S100T-1FC1152I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 1152 | - | - | - | MICROSEMI CORP | - | - | M2S100T-1FC1152I | - | - | - | - | - | - | - | - | - | - | - | - | - | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | NOT SPECIFIED | 5.86 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | e0 | TIN LEAD | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 99512 | - | - | - | - | 35 mm | 35 mm | - | ||
M2GL100T-FCG1152 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 1152 | - | - | - | MICROSEMI CORP | - | - | M2GL100T-FCG1152 | - | - | - | - | - | - | - | - | - | - | - | - | - | PLASTIC | BGA | - | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 5.82 | - | Yes | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | - | 1 mm | unknown | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 99512 | - | - | - | - | - | - | - | ||
M2S100-1FCG1152I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 1152 | - | - | - | MICROSEMI CORP | - | - | M2S100-1FCG1152I | - | - | - | - | - | - | 4 | - | - | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | NOT SPECIFIED | 5.8 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 99512 | - | - | - | - | 35 mm | 35 mm | - | ||
A1225A-1PLG84C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 84 | - | - | 84 | - | 90 MHz | - | MICROSEMI CORP | - | - | A1225A-1PLG84C | - | - | - | - | - | - | 3 | - | 72 | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | - | 40 | 5.8 | Compliant | Yes | - | 5.25 V | 4.75 V | 5 V | - | - | - | e3 | MATTE TIN | 70 °C | 0 °C | MAX 72 I/OS | - | - | QUAD | J BEND | 245 | 1.27 mm | compliant | 120 MHz | S-PQCC-J84 | 83 | Not Qualified | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | - | - | - | - | - | - | 4.3 ns | - | - | 83 | 451 CLBS, 2500 GATES | 4.57 mm | FIELD PROGRAMMABLE GATE ARRAY | 451 | - | 2500 | - | - | 451 | - | - | - | - | 4.3 ns | 451 | 451 | - | 2500 | - | - | 29.3116 mm | 29.3116 mm | - | ||
AGL030V2-QNG132 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 132 | - | 108 MHz | - | ACTEL CORP | - | - | AGL030V2-QNG132 | - | - | - | - | - | - | - | - | - | - | 70 °C | - | - | UNSPECIFIED | HVBCC | 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, QFN-132 | LGA132(UNSPEC) | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | NOT SPECIFIED | 5.77 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | e3 | - | - | - | - | - | - | BOTTOM | BUTT | NOT SPECIFIED | 0.5 mm | compliant | - | S-XBCC-B132 | 81 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 81 | 768 CLBS, 30000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 768 | 768 | - | 30000 | - | - | 8 mm | 8 mm | - | ||
AGLN030V2-ZCSG81I Microchip | In Stock | - | - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | 81 | AGLN030 | - | - | MICROSEMI CORP | - | - | AGLN030V2-ZCSG81I | - | - | - | Microchip Technology | - | - | 3 | - | 66 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Not Recommended | Active | NOT SPECIFIED | 5.25 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | IGLOO nano | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 768 CLBS, 30000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | 30000 | - | - | - | STD | - | - | - | - | 768 | - | - | 30000 | - | - | 5 mm | 5 mm | - | ||
A3P600L-1FGG484I Microchip | 2623 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | - | MICROSEMI CORP | - | - | A3P600L-1FGG484I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | 3 | - | 235 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.37 | Compliant | Yes | - | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | - | 13.5 kB | - | - | - | - | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | 892.86 MHz | - | - | 1 | - | - | 13824 | - | 13824 | 13824 | - | 600000 | - | 1.73 mm | 23 mm | 23 mm | No | ||
AGL400V2-FGG256I Microchip | 19 |
| - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | 256 | AGL400 | - | - | MICROSEMI CORP | - | - | AGL400V2-FGG256I | - | - | - | Microchip Technology | - | - | 3 | - | 178 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 0.9 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | -40°C ~ 85°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | - | - | - | STD | - | - | - | - | 9216 | - | - | 400000 | - | - | 17 mm | 17 mm | - |