- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | For Use With | For Use With/Related Products | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tool Is For Evaluation Of | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Note | Max Supply Voltage | Min Supply Voltage | Nominal Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Contents | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Platform | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product | Interconnect System | Suggested Programming Environment | Kit Contents | Product Category | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A54SX16A-1FG144 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 144 | - | - | 263 MHz | - | - | - | MICROSEMI CORP | - | - | A54SX16A-1FG144 | - | - | - | 3 | - | 70 °C | - | - | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | - | Obsolete | - | - | 30 | 5.32 | - | No | - | 2.75 V | 2.25 V | 2.5 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B144 | 111 | Not Qualified | - | 2.5,3.3/5 V | COMMERCIAL | - | - | - | - | - | - | - | 111 | 1452 CLBS, 24000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 ns | - | 1452 | 1452 | 24000 | - | - | - | - | - | - | 13 mm | 13 mm | - | ||
A3P060-CSG121I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 121 | - | - | - | - | - | - | MICROSEMI CORP | - | - | A3P060-CSG121I | - | - | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | Obsolete | - | - | - | 7.61 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | - | 0.5 mm | compliant | - | - | S-PBGA-B121 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1536 | - | 60000 | - | - | - | - | - | - | 6 mm | 6 mm | - | ||
A3P600-1FG484I Microchip | 2224 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | A3P600 | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P600-1FG484I | - | Microchip Technology | - | 3 | 235 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | Active | 30 | 1.51 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | ProASIC3 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | - | - | - | - | - | 1 | - | - | - | 13824 | - | 600000 | - | - | - | - | - | - | 23 mm | 23 mm | - | ||
A3P250-FGG144T Microchip | In Stock | - | - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P250 | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P250-FGG144T | - | Microchip Technology | - | 3 | 97 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | 30 | 5.22 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | Automotive grade | -40°C ~ 125°C (TA) | - | Automotive, AEC-Q100, ProASIC3 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | 97 | Not Qualified | - | 1.5/3.3 V | AUTOMOTIVE | - | - | - | - | - | - | - | 97 | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 36864 | 250000 | - | - | AEC-Q100 | - | - | STD | - | - | - | 6144 | 6144 | 250000 | - | - | - | - | - | - | 13 mm | 13 mm | - | ||
M2S-HELLO-FPGA-KIT Microchip Technology | 2004 | - | - | - | - | - | - | - | - | - | - | - | M2S-HELLO | Microchip Technology | - | 1 | SmartFusion®2 | - | - | - | Microchip | - | - | Microchip Technology | - | - | - | - | - | Bulk | - | - | - | - | - | - | HELLO FPGA KIT | - | - | Active | - | - | Details | - | - | - | - | - | M2S010-1VF256 | - | - | 1 lb | - | - | Bulk | - | - | FPGA | - | - | - | - | - | Development Tools | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Programmable Logic IC Development Tools | FPGA | - | - | - | - | - | Board(s), Cable(s), Accessories | - | - | - | - | Hello FPGA Eval Kit | - | - | - | Development Kits | Arduino R3 Shield, mikroBUS Click | - | FPGA Mainboard w/SmartFusion2 M2S010-1VF256, LI-0V7725-MICRO V1, LCD Brd, USB Cable, QuickStart Card | Programmable Logic IC Development Tools | - | - | - | - | ||
AX1000-FGG896 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 896 | - | 400.011771 mg | 896 | - | - | 649 MHz | - | - | - | MICROSEMI CORP | - | - | AX1000-FGG896 | - | - | - | 3 | 516 | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | - | Obsolete | - | - | 40 | 5.31 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | - | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | - | 1.575 V | 1.425 V | - | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | - | - | - | 1e+06 | 649 MHz | - | - | - | 12096 | - | 12096 | 0.99 ns | - | 12096 | 18144 | 1000000 | - | - | - | - | - | 1.73 mm | 31 mm | 31 mm | No | ||
AX250-FGG256I Microchip | 2849 |
| - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | 256 | AX250 | - | 649 MHz | - | - | - | MICROSEMI CORP | - | - | AX250-FGG256I | 1.575 V | Microchip Technology | 1.425 V | 3 | 138 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | 40 | 1.42 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | - | -40 to 85 °C | - | Axcelerator | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | 248 | Not Qualified | - | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | 248 | 2816 CLBS, 250000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 55296 | 250000 | - | 4224 | - | - | - | STD | - | 0.99 ns | - | 2816 | 4224 | 250000 | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
AFS090-FG256 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | - | - | - | - | MICROSEMI CORP | - | - | AFS090-FG256 | - | - | - | 3 | 75 | 85 °C | - | - | PLASTIC/EPOXY | LBGA | FBGA-256 | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Obsolete | - | - | 30 | 5.89 | Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | OTHER | - | 1.575 V | 1.425 V | - | 3.4 kB | - | - | - | 2304 CLBS, 90000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 90000 | 1.0989 GHz | - | - | - | - | - | 2304 | - | - | 2304 | - | 90000 | - | - | - | - | - | 1.2 mm | 17 mm | 17 mm | No | ||
A1460A-1PQ160C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 160 | - | - | 125 MHz | - | - | - | MICROSEMI CORP | - | - | A1460A-1PQ160C | - | - | - | 3 | - | 70 °C | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | - | SQUARE | FLATPACK | - | Obsolete | - | - | 30 | 5.85 | - | No | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | MAX 131 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 2.6 ns | - | 848 | 848 | 6000 | - | - | - | - | - | - | 28 mm | 28 mm | - | ||
A1425A-1PLG84I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 84 | - | - | 84 | - | - | 150 MHz | - | - | - | MICROSEMI CORP | - | - | A1425A-1PLG84I | - | - | - | 3 | 70 | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-84 | - | SQUARE | CHIP CARRIER | - | Obsolete | - | - | 40 | 5.82 | Compliant | Yes | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | e3 | - | MATTE TIN | 85 °C | -40 °C | MAX 70 I/OS | - | - | - | QUAD | J BEND | 245 | 1.27 mm | compliant | 150 MHz | - | S-PQCC-J84 | - | Not Qualified | 5 V | - | INDUSTRIAL | - | 5.5 V | 4.5 V | - | - | 2.6 ns | - | - | 310 CLBS, 2500 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 310 | - | - | - | 2500 | - | - | - | - | 310 | - | - | 2.6 ns | - | 310 | - | 2500 | - | - | - | - | - | - | 29.3116 mm | 29.3116 mm | - | ||
A1460A-PG207C Microchip | In Stock | - | - | - | - | - | - | NO | - | - | - | 207 | - | - | 100 MHz | - | - | - | MICROSEMI CORP | - | - | A1460A-PG207C | - | - | - | - | - | 70 °C | - | - | CERAMIC, METAL-SEALED COFIRED | HPGA | HPGA, | - | SQUARE | GRID ARRAY, HEAT SINK/SLUG | - | Obsolete | - | - | - | 8.77 | - | No | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | MAX 168 I/OS | 8542.39.00.01 | - | - | PERPENDICULAR | PIN/PEG | - | 2.54 mm | compliant | - | - | S-CPGA-P207 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 9.4234 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 3 ns | - | 848 | - | 6000 | - | - | - | - | - | - | 44.958 mm | 44.958 mm | - | ||
A1010B-PL68C Microchip | 22 | - | - | - | Surface Mount | - | - | YES | 68 | - | - | 68 | - | - | 45 MHz | - | - | - | MICROSEMI CORP | - | - | A1010B-PL68C | - | - | - | 1 | 57 | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | - | Obsolete | LCC | - | NOT SPECIFIED | 5.84 | Compliant | No | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | MAX 57 I/OS | 8542.39.00.01 | - | - | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | unknown | 48 MHz | 68 | S-PQCC-J68 | 57 | Not Qualified | 5 V | 5 V | COMMERCIAL | - | 5.25 V | 4.75 V | 1 mA | - | 4.5 ns | 4.5 ns | 57 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 295 | - | - | - | 1200 | - | - | - | - | 295 | - | 147 | 4.5 ns | - | 547 | 295 | 2000 | - | - | - | - | - | 4.572 mm | 24.2316 mm | 24.2316 mm | No | ||
AGL400V2-FGG144I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 144 | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V2-FGG144I | - | - | - | 3 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Obsolete | - | - | 40 | 8.61 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | 400000 | - | - | - | - | - | - | 13 mm | 13 mm | - | ||
AGL600V5-FG484I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 108 MHz | - | - | - | MICROSEMI CORP | - | - | AGL600V5-FG484I | - | - | - | 3 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | - | SQUARE | GRID ARRAY | - | Obsolete | - | - | 30 | 5.27 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | - | 600000 | - | - | - | - | - | - | 23 mm | 23 mm | - | ||
A3P250L-FG256I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P250L-FG256I | - | - | - | 3 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | - | Obsolete | - | - | 30 | 7.85 | - | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B256 | 157 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | 157 | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 6144 | 6144 | 250000 | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
AFS090-2FGG256 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | - | - | - | - | MICROSEMI CORP | - | - | AFS090-2FGG256 | - | - | - | 3 | 75 | 85 °C | - | - | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Obsolete | - | - | 40 | 5.83 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | OTHER | - | 1.575 V | 1.425 V | - | 3.4 kB | - | - | - | 2304 CLBS, 90000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 90000 | 1.47059 GHz | - | - | - | - | 2 | 2304 | - | - | 2304 | - | 90000 | - | - | - | - | - | 1.2 mm | 17 mm | 17 mm | No | ||
AX1000-BGG729I Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 729-BBGA | YES | 729 | 729-PBGA (35x35) | - | 729 | AX1000 | - | 649 MHz | - | - | - | MICROSEMI CORP | - | - | AX1000-BGG729I | 1.575 V | Microchip Technology | 1.425 V | 3 | 516 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA729,27X27,50 | BGA729,27X27,50 | SQUARE | GRID ARRAY | - | Active | - | Active | 40 | 5.25 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | - | -40 to 85 °C | - | Axcelerator | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1.27 mm | compliant | 649 MHz | 729 | S-PBGA-B729 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | 1.575 V | 1.425 V | - | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | - | - | 165888 | 1e+06 | 649 MHz | 18144 | - | - | 12096 | STD | 12096 | 0.99 ns | - | 12096 | 18144 | 1000000 | - | - | - | - | - | 1.73 mm | 35 mm | 35 mm | No | ||
MPFS-ICICLE-KIT-ES Microchip Technology | 507 | - | - | - | - | - | - | - | - | - | - | - | MPFS-ICICLE | Microchip Technology | - | 1 | PolarFire SoC FPGA | MPFS250T-FCVG484EES | - | CAN, eMMC, I2C, mikroBUS, PCIe, SD Card, SGMII, UART, USB | Microchip | - | - | Microchip Technology | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | MPFS250T-FCVG484EES | Icicle Kit | - | - | - | - | - | - | - | FPGA | - | - | - | - | - | Development Tools | - | - | - | - | - | - | - | - | - | - | - | 12 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Programmable Logic IC Development Tools | FPGA | - | - | - | - | - | Board(s), Cable(s), Power Supply | - | - | - | - | PolarFire SoC FPGA SiFive RISC-V Icicle Kit | - | - | - | Development Kits | mikroBUS Click, Raspberry Pi HAT (40 pin) | Libero SoC | Dev Board MPFS250T-FCVG484EES | Programmable Logic IC Development Tools | - | - | - | - | ||
RTG4-DEV-KIT-CG Microchip | 564 | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | 1 | - | - | - | - | Microchip | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Development Tools | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Programmable Logic IC Development Tools | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Programmable Logic IC Development Tools | - | - | - | - | ||
MPFS-ICICLE-KIT-ES-FP5 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | MPFS250 | - | - | - | - | MPFS250 | - | - | - | - | - | Microchip Technology | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA + MCU/MPU SoC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Power Supply | - | - | - | - | PolarFire SoC FPGA SiFive RISC-V Icicle | - | - | - | - | mikroBUS Click, Raspberry Pi HAT (40 pin) | Libero SoC | - | - | - | - | - | - |