- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
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 A1280A-1CQ172M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 172 | - | - | 172 | - | - | 75 MHz | - | - | - | MICROSEMI CORP | - | - | A1280A-1CQ172M | - | - | - | - | - | - | - | - | - | - | 140 | - | - | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | HGQFF | CERAMIC, CQFP-172 | TPAK172,2.5SQ,25 | SQUARE | FLATPACK, HEAT SINK/SLUG, GUARD RING | Obsolete | - | - | NOT SPECIFIED | 8.79 | Non-Compliant | No | - | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | MAX 140 I/OS | 8542.39.00.01 | - | - | QUAD | FLAT | NOT SPECIFIED | 0.635 mm | compliant | 90 MHz | - | S-CQFP-F172 | 140 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | 4.3 ns | - | 4.3 ns | - | - | 140 | 1232 CLBS, 8000 GATES | 2.9464 mm | FIELD PROGRAMMABLE GATE ARRAY | 1232 | - | - | 8000 | - | 1232 | 1 | - | - | 998 | 4.3 ns | 1232 | 1232 | - | 8000 | - | - | - | 29.972 mm | 29.972 mm | No | ||
A1020B-2PL44I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 44 | - | - | 54.1 MHz | - | - | - | MICROSEMI CORP | - | - | A1020B-2PL44I | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 30 | 5.88 | - | No | - | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | MAX 34 I/OS | 8542.39.00.01 | - | - | QUAD | J BEND | 225 | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | 69 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 69 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 3.4 ns | 547 | 547 | - | 2000 | - | - | - | 16.5862 mm | 16.5862 mm | - | ||
A1240A-PQ144M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 144 | - | - | 144 | - | - | - | - | - | - | MICROSEMI CORP | - | - | A1240A-PQ144M | - | - | - | - | - | - | - | - | 3 | - | 104 | - | - | 125 °C | -55 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | - | - | 30 | 8.69 | Non-Compliant | No | - | 8542390000/8542390000/8542390000/8542390000/8542390000 | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | 90 MHz | - | S-PQFP-G144 | - | Not Qualified | 5 V | - | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | 5 ns | - | - | - | - | - | 684 CLBS, 4000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 684 | - | - | 4000 | - | 684 | - | - | - | 568 | - | 684 | - | - | 4000 | - | - | - | 28 mm | 28 mm | No | ||
A10V20B-PL68C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | - | - | - | 68 | - | - | 45 MHz | - | - | - | MICROSEMI CORP | - | - | A10V20B-PL68C | - | - | - | - | - | - | - | - | - | - | 57 | - | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | - | 5.85 | Non-Compliant | No | - | - | - | 3.465 V | 3.135 V | 3.3 V | - | - | - | - | - | - | - | - | - | 70 °C | 0 °C | - | - | - | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 68 | S-PQCC-J68 | 69 | Not Qualified | 3.3 V | 3.3 V | COMMERCIAL | - | - | - | - | - | - | - | 6.5 ns | - | - | - | - | 69 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 2000 | - | 547 | - | - | - | 273 | 4.5 ns | 547 | 547 | - | 2000 | - | - | - | 24.2316 mm | 24.2316 mm | No | ||
A1020B-CQ84M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 84 | - | - | 84 | - | - | 37 MHz | - | - | - | MICROSEMI CORP | - | - | A1020B-CQ84M | - | - | - | - | - | - | - | - | - | - | 69 | - | - | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK84,1.63SQ,25 | TPAK84,1.63SQ,25 | SQUARE | FLATPACK | Obsolete | - | - | 20 | 5.84 | Non-Compliant | No | - | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | MAX 69 I/OS | 8542.39.00.01 | - | - | QUAD | FLAT | 225 | 0.635 mm | compliant | 48 MHz | - | S-CQFP-F84 | 69 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | 4.5 ns | - | 4.5 ns | - | - | 69 | 547 CLBS, 2000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | - | - | 2000 | - | 547 | - | - | - | 273 | 5.5 ns | 547 | 547 | - | 2000 | - | - | - | 16.51 mm | 16.51 mm | No | ||
A3P250-QNG132I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 132 | - | - | 132 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P250-QNG132I | - | - | - | - | - | - | - | - | 2 | - | 87 | - | - | 100 °C | -40 °C | - | UNSPECIFIED | VBCC | VBCC, | - | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | - | - | 30 | 5.24 | Compliant | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | 8542.39.00.01 | - | - | BOTTOM | BUTT | 260 | 0.5 mm | compliant | - | - | S-XBCC-B132 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | 4.5 kB | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 250000 | - | - | - | - | - | 6144 | - | 6144 | - | - | 250000 | - | - | - | 8 mm | 8 mm | No | ||
A1460A-PQ160C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 160 | - | - | 100 MHz | - | - | - | MICROSEMI CORP | - | - | A1460A-PQ160C | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Obsolete | - | - | 30 | 5.85 | - | No | - | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | e0 | - | TIN LEAD | - | - | MAX 131 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 3 ns | 848 | - | - | 6000 | - | - | - | 28 mm | 28 mm | - | ||
AT40K20AL-1DQC Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | - | - | - | - | ATMEL CORP | - | - | AT40K20AL-1DQC | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | - | 30 | 5.92 | - | No | - | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | MAXIMUM USABLE GATES 30000 | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | 256 | Not Qualified | - | 3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | 256 | 1024 CLBS, 20000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 2.2 ns | 1024 | 1024 | - | 20000 | - | - | - | 28 mm | 28 mm | - | ||
M2GL090S-1FG484I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | - | - | - | 484 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL090S-1FG484I | - | - | - | - | - | - | - | - | - | - | 267 | - | - | - | - | - | PLASTIC/EPOXY | BGA | - | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | - | - | 5.3 | Non-Compliant | No | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | - | - | - | BOTTOM | BALL | - | 1 mm | unknown | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | 323.3 kB | - | - | - | - | - | - | - | - | 267 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 86316 | - | - | - | - | - | - | - | - | - | - | - | 86316 | - | - | - | - | - | - | - | - | ||
M2S010S-1FG484I Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2S010S-1FG484I | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | 20 | 5.85 | - | No | - | - | - | - | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | - | - | 225 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M2S090TS-1FGG484I Microchip | 2092 | - | - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S090 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S090TS-1FGG484I | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | 267 | - | 86316 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.8 | - | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | 1 | - | FPGA - 90K Logic Modules | - | - | - | 86316 | 1 Core | - | 512KB | - | - | 23 mm | 23 mm | - | ||
M2GL005-1FGG484 Microchip | 41 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL005 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL005-1FGG484 | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 209 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.3 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | 85 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | 209 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 87.9 kB | - | - | - | - | - | - | - | - | 209 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | - | 719872 | - | - | - | - | - | - | - | - | - | 6060 | - | - | - | - | - | 23 mm | 23 mm | - | ||
M2GL090-1FGG676 Microchip | 2553 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 676-BGA | YES | - | 676-FBGA (27x27) | - | 676 | M2GL090 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL090-1FGG676 | - | - | - | + 85 C | Microchip Technology | - | 0 C | - | 3 | SMD/SMT | 425 | - | 86184 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.27 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | 85 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | 323.3 kB | - | - | - | - | - | - | - | - | 425 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | - | 2648064 | - | - | - | - | - | - | - | - | - | 86316 | - | - | - | - | - | 27 mm | 27 mm | - | ||
M2S150T-FCVG484 Microchip | 855 |
| - | - | - | - | 484-BFBGA | YES | - | 484-FBGA (19x19) | - | 484 | M2S150 | - | - | - | - | - | MICROSEMI CORP | - | - | M2S150T-FCVG484 | - | - | - | - | Microchip Technology | - | - | - | 4 | - | 273 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Active | 40 | 5.77 | - | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B484 | 273 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 273 | - | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | - | 146124 | - | - | 512KB | - | - | 19 mm | 19 mm | - | ||
M2S060-FCSG325I Microchip | 2062 |
| - | Production (Last Updated: 2 months ago) | - | - | 325-TFBGA, FCBGA | YES | 325 | 325-FCBGA (11x11) | - | 325 | M2S060 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S060-FCSG325I | 166 MHz | - | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | - | 3 | - | 200 | - | 56520 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | 40 | 5.79 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | STD | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | 256KB | - | - | 11 mm | 11 mm | - | ||
M2GL050-1FGG484 Microchip | 2517 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL050 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL050-1FGG484 | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 267 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.3 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | 85 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 228.3 kB | - | - | - | - | - | - | - | - | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | 1869824 | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | 23 mm | 23 mm | - | ||
M1AGLE3000V5-FG896I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 896 | - | 400.011771 mg | 896 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M1AGLE3000V5-FG896I | - | - | - | - | - | - | - | - | 3 | - | 620 | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FBGA-896 | - | SQUARE | GRID ARRAY | Obsolete | - | - | 20 | 5.88 | Compliant | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B896 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | 63 kB | - | - | - | - | - | - | - | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | - | - | 3e+06 | 892.86 MHz | - | - | - | - | 75264 | - | 75264 | - | - | 3000000 | - | - | 1.73 mm | 29 mm | 29 mm | No | ||
M2S060T-FGG676 Microchip | 2681 |
| - | Production (Last Updated: 2 months ago) | - | - | 676-BGA | YES | - | 676-FBGA (27x27) | - | 676 | M2S060 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S060T-FGG676 | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | - | 387 | - | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.81 | Non-Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B676 | 387 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 387 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | 256KB | - | - | 27 mm | 27 mm | - | ||
M2GL005-VFG256 Microchip | 1720 | - | - | - | - | Surface Mount | BGA-256 | YES | - | 256-FPBGA (14x14) | - | 256 | M2GL005 | Microchip Technology / Atmel | - | - | 703 kbit | 119 | MICROSEMI CORP | - | - | M2GL005-VFG256 | - | 340 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | 5.27 | Details | Yes | FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | 0.025037 oz | 0°C ~ 85°C (TJ) | Tray | M2GL005 | - | - | - | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | - | S-PBGA-B256 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | 719872 | - | - | - | STD | - | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | - | 14 mm | 14 mm | - | ||
M2GL025-VFG256 Microchip | 14 | - | - | - | - | Surface Mount | 256-LFBGA | YES | - | 256-FPBGA (14x14) | - | 256 | M2GL025 | Microchip Technology / Atmel | - | - | - | 119 | MICROSEMI CORP | - | - | M2GL025-VFG256 | - | - | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 138 | - | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | 14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | 5.26 | Details | Yes | IC FPGA 138 I/O 256FBGA | - | - | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | - | 0°C ~ 85°C (TJ) | Tray | IGLOO2 | - | - | - | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | - | S-PBGA-B256 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | 667 Mb/s | - | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | FPGA - Field Programmable Gate Array | 1130496 | - | - | - | STD | 2 Transceiver | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | - | 14 mm | 14 mm | - |