- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S050S-1FGG896I Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | M2S050S-1FGG896I | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | - | - | - | - | Active | - | - | 30 | 5.26 | - | Yes | - | - | - | - | - | - | - | - | - | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | - | - | - | 245 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M2GL050S-1FG484I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | - | - | - | 484 | - | - | - | - | MICROSEMI CORP | M2GL050S-1FG484I | - | - | - | - | - | - | - | - | - | 267 | - | - | - | - | PLASTIC/EPOXY | BGA | - | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | - | - | 5.88 | Non-Compliant | No | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | - | - | - | BOTTOM | BALL | - | 1 mm | unknown | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | 228.3 kB | - | - | - | 267 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | - | - | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | - | ||
M2S100T-1FC1152 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 1152 | - | - | - | - | MICROSEMI CORP | M2S100T-1FC1152 | - | - | - | - | - | - | - | - | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | NOT SPECIFIED | 5.86 | - | No | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | e0 | - | TIN LEAD | - | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | - | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 99512 | - | - | - | 35 mm | 35 mm | - | ||
MPF300TLS-FCVG484I Microchip | 696 |
| - | - | - | Surface Mount | 484-BBGA, FCBGA | YES | - | 484-FCBGA (19x19) | - | 484 | MPF300 | - | - | - | MICROSEMI CORP | MPF300TLS-FCVG484I | - | - | + 100 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | 284 | 300000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FBGA | FCBGA-484 | - | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Active | - | 5.79 | - | - | - | - | 1.03 V | 0.97 V | 1 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | PolarFire™ | - | - | - | - | - | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | - | - | 0.97V ~ 1.08V | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B484 | - | - | 1.05 V | - | INDUSTRIAL | - | - | - | - | - | 12.7 Gb/s | - | - | 3.32 mm | FIELD PROGRAMMABLE GATE ARRAY | 300000 | - | 21094400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 19 mm | 19 mm | - | ||
A10V10B-VQG80C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 80 | - | - | 80 | - | - | 50 MHz | - | MICROSEMI CORP | A10V10B-VQG80C | - | - | - | - | - | - | - | 3 | - | 57 | - | 70 °C | - | - | PLASTIC/EPOXY | TQFP | TQFP, TQFP80,.6SQ | TQFP80,.6SQ | SQUARE | FLATPACK, THIN PROFILE | Obsolete | - | - | 40 | 5.28 | Compliant | Yes | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | e3 | - | MATTE TIN | 70 °C | 0 °C | MAX 57 I/OS | - | - | - | QUAD | GULL WING | 260 | 0.65 mm | compliant | - | - | S-PQFP-G80 | 57 | Not Qualified | 3.3 V | 3.3 V | COMMERCIAL | - | - | - | 6.5 ns | - | - | 57 | 295 CLBS, 1200 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1200 | - | - | - | 295 | - | - | 147 | 4.5 ns | 295 | 295 | 1200 | - | - | 14 mm | 14 mm | No | ||
A1280A-1PQ160I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 160 | - | - | 160 | - | - | 75 MHz | - | MICROSEMI CORP | A1280A-1PQ160I | - | - | - | - | - | - | - | 3 | - | 125 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | - | - | 30 | 5.84 | Compliant | No | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e0 | EAR99 | TIN LEAD | 85 °C | -40 °C | MAX 125 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | 90 MHz | - | S-PQFP-G160 | 125 | Not Qualified | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | - | 4.3 ns | 4.3 ns | - | 125 | 1232 CLBS, 8000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1232 | - | - | 8000 | - | - | - | 1232 | 1 | - | 998 | 4.3 ns | 1232 | 1232 | 8000 | - | - | 28 mm | 28 mm | No | ||
A1020B-PLG84M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 84 | - | - | 84 | - | - | - | - | MICROSEMI CORP | A1020B-PLG84M | - | - | - | - | - | - | - | 3 | - | 69 | - | 125 °C | -55 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | - | - | 40 | 5.76 | Compliant | Yes | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e3 | 3A001.A.2.C | MATTE TIN | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | QUAD | J BEND | 245 | 1.27 mm | compliant | 48 MHz | - | S-PQCC-J84 | - | Not Qualified | 5 V | - | MILITARY | 5.5 V | 4.5 V | - | 4.5 ns | - | - | - | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | - | - | 2000 | - | - | - | 547 | - | - | 273 | - | 547 | - | 2000 | - | - | 29.3116 mm | 29.3116 mm | - | ||
AGLN030V5-ZVQG100 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 100 | - | - | - | - | MICROSEMI CORP | AGLN030V5-ZVQG100 | - | - | - | - | - | - | - | - | - | - | - | 70 °C | -20 °C | - | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | - | - | NOT SPECIFIED | 7.8 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e3 | - | TIN | - | - | - | 8542.39.00.01 | - | - | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PQFP-G100 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 768 | - | 30000 | - | - | 14 mm | 14 mm | - | ||
A54SX08-2FGG144 Microchip | In Stock | - | - | - | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | - | 320 MHz | - | MICROSEMI CORP | A54SX08-2FGG144 | - | 3.63, 5.25 V | - | Microchip Technology | 2.97, 4.75 V | - | - | 3 | - | 111 | - | 70 °C | - | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 40 | 5.24 | Compliant | Yes | - | - | 3.6 V | 3 V | 3.3 V | - | 3.3, 5 V | - | - | 0 to 70 °C | - | SX | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | - | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | 320 MHz | - | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | COMMERCIAL | 5.25 V | 4.75 V | - | 700 ps | 700 ps | - | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | - | 12000 | 320 MHz | 768 | - | 768 | 2 | - | 256 | 0.7 ns | 768 | 768 | 8000 | - | 1.05 mm | 13 mm | 13 mm | No | ||
A3P1000-2FG256I Microchip | 2328 | - | - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | A3P1000-2FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.23 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | - | -40 to 85 °C | Tray | A3P1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | 147456 | 1000000 | - | - | - | - | 2 | - | - | - | 24576 | - | 1000000 | FPGA - Field Programmable Gate Array | - | 17 mm | 17 mm | - | ||
AGL400V5-FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | - | - | MICROSEMI CORP | AGL400V5-FGG484 | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | 40 | 8.6 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | 400000 | - | - | 23 mm | 23 mm | - | ||
A3P1000-FG484T Microchip | 2361 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | A3P1000 | - | 350 MHz | - | MICROSEMI CORP | A3P1000-FG484T | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | - | - | 300 | - | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | - | 5.23 | - | No | - | - | 1.575 V | 1.425 V | 1.5 V | - | 1.5000 V | - | Automotive grade | -40°C ~ 125°C (TA) | - | Automotive, AEC-Q100, ProASIC3 | - | 3A001.A.7.A | - | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B484 | 300 | Not Qualified | - | 1.5/3.3 V | AUTOMOTIVE | - | - | - | - | - | - | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 147456 | 1000000 | - | - | AEC-Q100 | - | STD | - | - | - | 24576 | 24576 | 1000000 | - | - | 23 mm | 23 mm | - | ||
AGLE3000V2-FG896 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 896 | - | - | 250 MHz | - | MICROSEMI CORP | AGLE3000V2-FG896 | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.84 | - | No | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B896 | 620 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 75264 | 75264 | 3000000 | - | - | 31 mm | 31 mm | - | ||
AGL600V5-CSG281 Microchip | In Stock | - | - | - | - | Surface Mount | 281-TFBGA, CSBGA | YES | - | 281-CSP (10x10) | - | 281 | AGL600 | - | 108 MHz | - | MICROSEMI CORP | AGL600V5-CSG281 | - | - | - | Microchip Technology | - | - | - | 3 | - | 215 | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 1.46 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | 0°C ~ 70°C (TA) | - | IGLOO | - | - | - | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B281 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | - | 110592 | 600000 | - | - | - | - | STD | - | - | - | 13824 | - | 600000 | - | - | 10 mm | 10 mm | - | ||
AGL125V2-FG144I Microchip | In Stock | - | - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | AGL125 | - | 108 MHz | - | MICROSEMI CORP | AGL125V2-FG144I | - | - | - | Microchip Technology | - | - | - | 3 | - | 97 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 30 | 5.25 | - | No | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 85°C (TA) | - | IGLOO | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | - | 36864 | 125000 | - | - | - | - | STD | - | - | - | 3072 | - | 125000 | - | - | 13 mm | 13 mm | - | ||
AX125-FGG324I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 324 | - | 400.011771 mg | 324 | - | - | 649 MHz | - | MICROSEMI CORP | AX125-FGG324I | - | - | - | - | - | - | - | 3 | - | 168 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 40 | 5.8 | Compliant | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | 649 MHz | - | S-PBGA-B324 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 2.3 kB | 990 ps | 990 ps | - | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | - | - | 125000 | 649 MHz | - | - | 1344 | - | - | 1344 | 0.99 ns | 1344 | 2016 | 125000 | - | 1.25 mm | 19 mm | 19 mm | No | ||
A1240A-PQ144M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 144 | - | - | 144 | - | - | - | - | MICROSEMI CORP | A1240A-PQ144M | - | - | - | - | - | - | - | 3 | - | 104 | - | 125 °C | -55 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | - | - | 30 | 8.69 | Non-Compliant | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | 90 MHz | - | S-PQFP-G144 | - | Not Qualified | 5 V | - | MILITARY | 5.5 V | 4.5 V | - | 5 ns | - | - | - | 684 CLBS, 4000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 684 | - | - | 4000 | - | - | - | 684 | - | - | 568 | - | 684 | - | 4000 | - | - | 28 mm | 28 mm | No | ||
A1460A-PQ160C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 160 | - | - | 100 MHz | - | MICROSEMI CORP | A1460A-PQ160C | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Obsolete | - | - | 30 | 5.85 | - | No | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | e0 | - | TIN LEAD | - | - | MAX 131 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 3 ns | 848 | - | 6000 | - | - | 28 mm | 28 mm | - | ||
AT40K20AL-1DQC Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | - | - | ATMEL CORP | AT40K20AL-1DQC | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | - | 30 | 5.92 | - | No | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | MAXIMUM USABLE GATES 30000 | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | 256 | Not Qualified | - | 3.3 V | COMMERCIAL | - | - | - | - | - | - | 256 | 1024 CLBS, 20000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 2.2 ns | 1024 | 1024 | 20000 | - | - | 28 mm | 28 mm | - | ||
AGLP030V5-CSG201I Microchip | 19 |
| - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP030 | - | 250 MHz | - | MICROSEMI CORP | AGLP030V5-CSG201I | - | - | - | Microchip Technology | - | - | - | 3 | - | 120 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 1.43 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO PLUS | e3 | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B201 | 120 | Not Qualified | - | 1.5 V | INDUSTRIAL | - | - | - | - | - | - | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | - | - | 30000 | - | - | - | - | STD | - | - | - | 792 | 792 | 30000 | - | - | 8 mm | 8 mm | - |