- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Contents | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Speed - Read | Speed - Write | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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 AGLP060V2-CS201 Microchip | 16 |
| - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP060 | - | 160 MHz | - | - | - | MICROSEMI CORP | - | - | AGLP060V2-CS201 | - | - | 1.575 V | - | - | Microchip Technology | 1.14 V | - | - | - | - | - | 157 | - | 70 °C | - | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 5.26 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | 1.2, 1.5 V | - | 0 to 70 °C | - | IGLOO PLUS | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | - | 201 | S-PBGA-B201 | 157 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 157 | 1584 CLBS, 60000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 1584 | - | 18432 | 60000 | - | - | - | - | STD | - | - | - | - | 1584 | 1584 | - | - | - | 60000 | - | - | - | 8 mm | 8 mm | - | - | ||
A3P1000-FGG256I Microchip | 2198 |
| - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | A3P1000 | Microchip Technology / Atmel | 350 MHz | - | 90 | - | MICROSEMI CORP | - | - | A3P1000-FGG256I | - | 350 MHz | 1.575 V | + 100 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | - | SQUARE | GRID ARRAY | Active | - | Active | 40 | 1.3 | Details | Yes | - | 1.575 V | 1.425 V | 1.5 V | 147456 bit | ProASIC3 | 1.5000 V | 0.210427 oz | -40 to 85 °C | Tray | A3P1000 | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | 75 mA | - | - | - | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | 144Kbit | 1000000 | - | - | - | - | STD | - | - | - | - | 24576 | - | - | - | - | 1000000 | - | FPGA - Field Programmable Gate Array | 1.6 mm | 17 mm | 17 mm | - | - | ||
AFS1500-FGG676I Microchip | 2076 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AFS1500 | - | - | - | - | - | MICROSEMI CORP | - | - | AFS1500-FGG676I | - | - | 1.575 V | - | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | 252 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.3 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | -40 to 85 °C | - | Fusion® | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 1.0989 GHz | - | S-PBGA-B676 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | - | - | 33.8 kB | - | - | - | - | - | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 276480 | 1500000 | 1.0989 GHz | - | - | - | STD | - | - | 38400 | - | 38400 | - | - | - | - | 1500000 | - | - | 1.73 mm | 25 mm | 25 mm | No | - | ||
A3P600L-FGG484 Microchip | 10 | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P600L-FGG484 | - | - | 1.26 V | - | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 235 | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.24 | Compliant | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | 0 to 70 °C | - | ProASIC3L | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | - | - | - | 13.5 kB | - | - | - | - | - | - | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 110592 | 600000 | 781.25 MHz | - | - | - | STD | - | - | 13824 | - | 13824 | 13824 | - | - | - | 600000 | - | - | 1.73 mm | 23 mm | 23 mm | No | Lead Free | ||
AFS090-2FG256 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | - | - | - | - | MICROSEMI CORP | - | - | AFS090-2FG256 | - | - | - | - | - | - | - | - | - | 3 | - | - | 75 | - | 85 °C | - | - | PLASTIC/EPOXY | LBGA | FBGA-256 | - | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | - | 30 | 5.89 | Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | OTHER | 1.575 V | 1.425 V | - | - | - | 3.4 kB | - | - | - | - | - | - | - | - | - | 2304 CLBS, 90000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 90000 | 1.47059 GHz | - | - | - | 2 | - | - | 2304 | - | 2304 | - | - | - | - | 90000 | - | - | 1.2 mm | 17 mm | 17 mm | No | - | ||
AX250-1FG484I Microchip | 2975 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | AX250 | - | 763 MHz | - | - | - | MICROSEMI CORP | - | - | AX250-1FG484I | - | - | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 248 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 1.57 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -40°C ~ 85°C (TA) | - | Axcelerator | - | e0 | - | TIN LEAD | - | - | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B484 | 248 | Not Qualified | - | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 55296 | 250000 | - | 4224 | - | - | 1 | - | - | - | 0.84 ns | 2816 | 4224 | - | - | - | 250000 | - | - | - | 27 mm | 27 mm | - | - | ||
A1020B-1PLG84C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 84 | - | - | 53 MHz | - | - | - | ACTEL CORP | - | - | A1020B-1PLG84C | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Transferred | - | - | 40 | 5.77 | - | Yes | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | e3 | - | MATTE TIN | - | - | MAX 69 I/OS | - | - | - | QUAD | J BEND | 245 | 1.27 mm | compliant | - | - | S-PQCC-J84 | 69 | Not Qualified | - | 5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 69 | 547 CLBS, 2000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 3.8 ns | 547 | 547 | - | - | - | 2000 | - | - | - | 29.21 mm | 29.21 mm | - | - | ||
A1020B-1PL84C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 84 | - | - | 84 | - | - | 53 MHz | - | - | - | ACTEL CORP | - | - | A1020B-1PL84C | - | - | - | - | - | - | - | - | - | 3 | - | - | 69 | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Transferred | - | - | 30 | 5.83 | Compliant | No | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | MAX 69 I/OS | - | - | - | QUAD | J BEND | 225 | 1.27 mm | compliant | 57 MHz | - | S-PQCC-J84 | 69 | Not Qualified | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | - | - | - | - | - | - | - | 3.8 ns | - | 3.8 ns | - | - | 69 | 547 CLBS, 2000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | - | - | 2000 | - | - | - | 547 | 1 | - | - | 273 | 3.8 ns | 547 | 547 | - | - | - | 2000 | - | - | - | 29.21 mm | 29.21 mm | No | - | ||
A1425A-PQ160C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 160 | - | - | 125 MHz | - | - | - | MICROSEMI CORP | - | - | A1425A-PQ160C | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Obsolete | - | - | 30 | 8.78 | - | No | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | e0 | - | TIN LEAD | - | - | MAX 100 I/OS | - | - | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 310 CLBS, 2500 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 3 ns | 310 | - | - | - | - | 2500 | - | - | - | 28 mm | 28 mm | - | - | ||
A1010B-1PL68I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 68 | - | - | 47.7 MHz | - | - | - | MICROSEMI CORP | - | - | A1010B-1PL68I | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | - | 5.84 | - | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 68 | S-PQCC-J68 | 57 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 57 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 547 | 295 | - | - | - | 2000 | - | - | - | 24.2316 mm | 24.2316 mm | - | - | ||
A1010B-VQ80C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 80 | - | - | 80 | - | - | 45 MHz | - | - | - | MICROSEMI CORP | - | - | A1010B-VQ80C | - | - | - | - | - | - | - | - | - | - | - | - | 57 | - | 70 °C | - | - | PLASTIC/EPOXY | TQFP | 1 MM, VQFP-80 | TQFP80,.6SQ | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | - | 8.76 | Non-Compliant | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | - | - | - | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | QUAD | GULL WING | - | 0.65 mm | unknown | 48 MHz | 80 | S-PQFP-G80 | 57 | Not Qualified | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | - | - | - | - | - | - | - | 4.5 ns | - | - | - | - | 57 | 547 CLBS, 2000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 295 | - | - | 1200 | - | - | - | 295 | - | - | - | 147 | 4.5 ns | 547 | 295 | - | - | - | 2000 | - | - | - | 14 mm | 14 mm | No | - | ||
M2GL050TS-FG896I Microchip | 2544 |
| - | - | - | Surface Mount | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M2GL050 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL050TS-FG896I | - | - | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 377 | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | - | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | 1869824 | - | - | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | - | - | 31 mm | 31 mm | - | - | ||
M2S060T-1FG676I Microchip | 2679 |
| - | Production (Last Updated: 2 months ago) | - | - | 676-BGA | YES | - | 676-FBGA (27x27) | - | 676 | M2S060 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S060T-1FG676I | 166 MHz | - | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 387 | 56520 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.88 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B676 | 387 | Not Qualified | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 387 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | - | - | 256KB | - | - | 27 mm | 27 mm | - | - | ||
M1A3P400-FG484I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M1A3P400-FG484I | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.25 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | - | ||
M2GL025-1FCS325 Microchip | 38 |
| - | - | - | Surface Mount | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | - | 325 | M2GL025 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL025-1FCS325 | - | - | - | + 85 C | - | Microchip Technology | - | 0 C | - | - | SMD/SMT | - | 180 | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | - | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | 1130496 | - | - | - | - | - | - | - | - | - | - | - | 27696 | - | - | - | - | - | - | - | - | - | - | - | ||
M1A3P600L-FG256 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | M1A3P600L-FG256 | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.26 | - | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B256 | 177 | Not Qualified | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | - | - | 600000 | - | - | - | 17 mm | 17 mm | - | - | ||
M2GL010-1VF400I Microchip | 38 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | - | 400 | M2GL010 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL010-1VF400I | - | - | - | + 100 C | - | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | 195 | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 20 | 5.3 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | - | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | - | 1.26 V | 1.14 V | - | - | - | 114 kB | - | - | - | - | - | - | - | - | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | 933888 | - | - | - | - | - | 1 | - | - | - | - | - | 12084 | - | - | - | - | - | - | - | 17 mm | 17 mm | - | - | ||
M2S010T-VFG400 Microchip | 50 |
| - | - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2S010 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S010T-VFG400 | 166 MHz | - | - | + 85 C | - | Microchip Technology | - | 0 C | - | 3 | SMD/SMT | - | 195 | 12084 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 40 | 5.25 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | STD | - | FPGA - 10K Logic Modules | - | - | - | 12084 | 1 Core | - | - | - | 256KB | - | - | 17 mm | 17 mm | - | - | ||
SF2060-STARTER-KIT Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | - | FLASH - NAND (MLC) | Swissbit | - | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 85°C | - | U-50 | - | - | USB 3.0 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 32GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Programmer | - | - | - | - | - | - | - | - | - | 175MB/s | 90MB/s | - | - | - | - | - | - | - | - | ||
SF2-484-STARTER-KIT Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |