- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 AGL400V5-FG144I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 144 | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V5-FG144I | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | - | 30 | 7.96 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | 400000 | - | - | - | 13 mm | 13 mm | - | - | ||
A3P600L-FGG484I Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P600L-FGG484I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 235 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 1.37 | Compliant | Yes | - | 8542310000/8542310000/8542310000/8542310000/8542310000 | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | - | 1.26 V | 1.14 V | 5 mA | - | 13.5 kB | - | - | - | - | - | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | 781.25 MHz | - | - | - | - | - | 13824 | - | 13824 | 13824 | - | 600000 | - | - | 1.73 mm | 23 mm | 23 mm | No | - | ||
AGL400V2-FG256T Microchip | In Stock | - | - | - | Surface Mount | - | - | - | 256 | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V2-FG256T | - | - | - | - | - | - | - | - | 3 | - | 55296 | - | - | - | - | - | - | - | - | - | - | - | Active | - | - | 20 | 5.82 | Non-Compliant | No | - | - | - | - | - | - | - | - | - | - | - | - | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | - | - | 225 | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | 6.8 kB | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9216 | - | - | - | 400000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A3P600L-FGG484 Microchip | 10 | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P600L-FGG484 | - | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | 235 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.24 | Compliant | Yes | - | - | - | 1.575 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 70 °C | - | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | - | 1.26 V | 1.14 V | - | - | 13.5 kB | - | - | - | - | - | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | 781.25 MHz | - | - | STD | - | - | 13824 | - | 13824 | 13824 | - | 600000 | - | - | 1.73 mm | 23 mm | 23 mm | No | Lead Free | ||
AX250-1FG484I Microchip | 2719 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | AX250 | - | 763 MHz | - | - | - | MICROSEMI CORP | - | - | AX250-1FG484I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 248 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 1.57 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -40°C ~ 85°C (TA) | - | Axcelerator | e0 | TIN LEAD | - | - | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B484 | 248 | Not Qualified | - | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 55296 | 250000 | - | 4224 | - | 1 | - | - | - | 0.84 ns | 2816 | 4224 | - | 250000 | - | - | - | 27 mm | 27 mm | - | - | ||
A1020B-1PLG84C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 84 | - | - | 53 MHz | - | - | - | ACTEL CORP | - | - | A1020B-1PLG84C | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Transferred | - | - | 40 | 5.77 | - | Yes | - | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | e3 | MATTE TIN | - | - | MAX 69 I/OS | - | - | - | QUAD | J BEND | 245 | 1.27 mm | compliant | - | - | S-PQCC-J84 | 69 | Not Qualified | - | 5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 69 | 547 CLBS, 2000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 3.8 ns | 547 | 547 | - | 2000 | - | - | - | 29.21 mm | 29.21 mm | - | - | ||
A1010B-VQ80C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 80 | - | - | 80 | - | - | 45 MHz | - | - | - | MICROSEMI CORP | - | - | A1010B-VQ80C | - | - | - | - | - | - | - | - | - | - | 57 | - | - | 70 °C | - | - | PLASTIC/EPOXY | TQFP | 1 MM, VQFP-80 | TQFP80,.6SQ | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | - | 8.76 | Non-Compliant | No | - | 8542390000/8542390000/8542390000/8542390000/8542390000 | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | - | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | QUAD | GULL WING | - | 0.65 mm | unknown | 48 MHz | 80 | S-PQFP-G80 | 57 | Not Qualified | 5 V | 5 V | COMMERCIAL | - | 5.25 V | 4.75 V | - | - | - | - | - | - | 4.5 ns | - | - | - | 57 | 547 CLBS, 2000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 295 | - | - | - | 1200 | - | - | 295 | - | - | - | 147 | 4.5 ns | 547 | 295 | - | 2000 | - | - | - | 14 mm | 14 mm | No | - | ||
AGL400V2-FGG144T Microchip | In Stock | - | - | - | Surface Mount | - | - | - | 144 | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V2-FGG144T | - | - | - | - | - | - | - | - | 3 | - | 97 | - | - | - | - | - | - | - | - | - | - | - | Active | - | - | 30 | 5.77 | Compliant | Yes | - | - | - | - | - | - | - | - | - | - | - | - | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | - | - | 260 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | 6.8 kB | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9216 | - | - | - | 400000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AGL600V2-FGG484I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 108 MHz | - | - | - | ACTEL CORP | - | - | AGL600V2-FGG484I | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | - | - | 40 | 5.77 | - | Yes | - | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | e1 | TIN SILVER COPPER | - | - | - | - | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | 235 | Not Qualified | - | 1.2/1.5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 23 mm | 23 mm | - | - | ||
A2F500M3G-FG256M Microchip | In Stock | - | - | - | - | - | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | - | 256 | A2F500 | - | - | - | - | - | MICROSEMI CORP | - | - | A2F500M3G-FG256M | - | - | - | - | Microchip Technology | - | - | - | - | - | MCU - 25, FPGA - 66 | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | - | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | - | 5.84 | Non-Compliant | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -55°C ~ 125°C (TJ) | - | SmartFusion® | - | - | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | BOTTOM | BALL | - | 1 mm | unknown | 80 MHz | - | S-PBGA-B256 | 66 | - | - | - | MILITARY | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | ARM | - | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 11520 | 11520 | - | 500000 | 512KB | - | - | 17 mm | 17 mm | - | - | ||
AGLE600V5-FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 250 MHz | - | - | - | ACTEL CORP | - | - | AGLE600V5-FGG484 | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | - | - | 40 | 5.78 | - | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e1 | TIN SILVER COPPER | - | - | - | - | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 270 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 23 mm | 23 mm | - | - | ||
AGL400V2-FG144T Microchip | In Stock | - | - | - | Surface Mount | - | - | - | 144 | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V2-FG144T | - | - | - | - | - | - | - | - | 3 | - | 97 | - | - | - | - | - | - | - | - | - | - | - | Active | - | - | 20 | 5.82 | Non-Compliant | No | - | - | - | - | - | - | - | - | - | - | - | - | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | - | - | 235 | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | 6.8 kB | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9216 | - | - | - | 400000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A3P600-2FG144I Microchip | In Stock | - | - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P600 | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P600-2FG144I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 97 | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 30 | 5.25 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -40°C ~ 100°C (TJ) | - | ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | - | - | - | 2 | - | - | - | - | 13824 | - | - | 600000 | - | - | - | 13 mm | 13 mm | - | - | ||
M2GL150T-1FCG1152I Microchip | 2086 |
| - | - | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | - | 1152 | M2GL150 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL150T-1FCG1152I | - | - | - | - | Microchip Technology | - | - | - | 4 | - | 574 | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.3 | - | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | - | 5120000 | - | - | - | - | 1 | - | - | - | - | - | 146124 | - | - | - | - | - | 35 mm | 35 mm | - | - | ||
M2GL050TS-FG896I Microchip | 2179 |
| - | - | - | Surface Mount | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M2GL050 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL050TS-FG896I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 377 | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | - | No | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | - | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | - | 1869824 | - | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | 31 mm | 31 mm | - | - | ||
M1A3P600L-FG256 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | M1A3P600L-FG256 | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.26 | - | No | - | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B256 | 177 | Not Qualified | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 17 mm | 17 mm | - | - | ||
M1A3P400-FG484I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M1A3P400-FG484I | - | - | - | - | - | - | - | - | 3 | - | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.25 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | - | ||
M2GL090S-1FG484I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | - | - | - | 484 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL090S-1FG484I | - | - | - | - | - | - | - | - | - | - | 267 | - | - | - | - | - | PLASTIC/EPOXY | BGA | - | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | - | - | 5.3 | Non-Compliant | No | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | - | - | - | BOTTOM | BALL | - | 1 mm | unknown | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | 323.3 kB | - | - | - | - | - | - | - | 267 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 86316 | - | - | - | - | - | - | - | - | - | - | - | - | - | 86316 | - | - | - | - | - | - | - | - | - | ||
M2S060-FCSG325I Microchip | 2806 |
| - | Production (Last Updated: 2 months ago) | - | - | 325-TFBGA, FCBGA | YES | 325 | 325-FCBGA (11x11) | - | 325 | M2S060 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S060-FCSG325I | 166 MHz | - | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | - | 3 | - | 200 | - | 56520 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | 40 | 5.79 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | STD | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | 256KB | - | - | 11 mm | 11 mm | - | - | ||
M2GL005-VFG256 Microchip | 24000 | - | - | - | - | Surface Mount | BGA-256 | YES | - | 256-FPBGA (14x14) | - | 256 | M2GL005 | Microchip Technology / Atmel | - | - | 703 kbit | 119 | MICROSEMI CORP | - | - | M2GL005-VFG256 | - | 340 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | 5.27 | Details | Yes | FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | 0.025037 oz | 0°C ~ 85°C (TJ) | Tray | M2GL005 | - | - | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | - | S-PBGA-B256 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | - | 719872 | - | - | - | - | STD | - | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | - | 14 mm | 14 mm | - | - |