- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Contents | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Speed - Read | Speed - Write | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
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 A1415A-VQG100I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 100 | - | - | 100 | - | - | 125 MHz | - | - | - | MICROSEMI CORP | - | - | - | A1415A-VQG100I | - | - | - | - | - | - | - | - | - | - | - | 80 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | TFQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | - | - | 5.84 | Compliant | Yes | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | QUAD | GULL WING | - | 0.5 mm | compliant | 125 MHz | - | S-PQFP-G100 | - | - | 5 V | - | INDUSTRIAL | - | 5.5 V | 4.5 V | - | - | - | - | - | - | 3 ns | - | 3 ns | - | - | - | 200 CLBS, 1500 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 200 | - | - | - | 1500 | - | - | 200 | - | - | - | 264 | 3 ns | 200 | - | - | - | - | 1500 | - | - | - | 14 mm | 14 mm | No | ||
AT94S10AL-25DGU Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | AT94S10AL-25DGU | - | - | - | - | - | - | - | - | - | - | - | - | - | 80 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | - | 5.3 | - | Yes | - | - | - | 3.3 V | - | - | - | - | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | - | 3.3 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M2S050-1FG484 Microchip | 2560 |
| - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S050 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | M2S050-1FG484 | 166 MHz | - | - | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | 267 | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | 1 | - | FPGA - 50K Logic Modules | - | - | - | 48672 | 1 Core | - | - | - | 256KB | - | - | 23 mm | 23 mm | - | ||
M2S050-FG896 Microchip | 2423 |
| - | - | - | - | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M2S050 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | M2S050-FG896 | 166 MHz | - | 1.26 V | - | - | Microchip Technology | 1.14 V | - | - | 3 | SMD/SMT | 377 | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | 896 | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | STD | - | FPGA - 50K Logic Modules | - | - | - | 48672 | 1 Core | - | - | - | 256KB | - | - | 31 mm | 31 mm | - | ||
SF2060-STARTER-KIT Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | FLASH - NAND (MLC) | Swissbit | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 85°C | - | U-50 | - | - | USB 3.0 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 32GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Programmer | - | - | - | - | - | - | - | - | - | 175MB/s | 90MB/s | - | - | - | - | - | - | - | ||
CORE1553-DEV-KIT-2 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | CORE1553 | - | - | - | - | Core1553, M1AFS1500 | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Electronic Delivery | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | Fusion® | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Power Supply, Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
CORE429-SA Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | CORE429 | Microchip Technology | - | - | 1 | Core429 | - | - | - | Microchip | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | - | Actel | - | - | - | - | Fusion® | - | - | FPGA | - | - | - | - | - | Embedded Solutions | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Development Software | - | - | - | - | Board(s) | - | - | - | - | - | - | - | - | - | - | - | - | - | Development Software | - | - | - | - | ||
SF2-484-STARTER-KIT Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MPF300-VIDEO-KIT Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPF300 | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | PolarFire™ | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MPF300-SPLASH-KIT-ES Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPF300 | - | - | - | West Control Solutions | P4701Z2111002 | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | PolarFire™ | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A3PE1500-2FGG676I Microchip | 2427 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | Microchip Technology / Atmel | - | - | 40 | - | MICROSEMI CORP | - | - | - | A3PE1500-2FGG676I | - | 310 MHz | 1.575 V | + 100 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 444 | 16000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B676 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | 1.575 V | 1.425 V | - | - | 33.8 kB | - | - | - | - | - | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | - | 276480 | 1.5e+06 | 310 MHz | - | - | 2 | - | - | 38400 | - | 38400 | - | - | - | - | 1500000 | - | FPGA - Field Programmable Gate Array | 1.73 mm | 27 mm | 27 mm | No | ||
A54SX16A-2FGG256I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | - | 294 MHz | - | - | - | MICROSEMI CORP | - | - | - | A54SX16A-2FGG256I | - | - | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | 40 | 5.31 | - | Yes | - | 2.75 V | 2.25 V | 2.5 V | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | 180 | Not Qualified | - | 2.5,3.3/5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | 1452 CLBS, 24000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 1 ns | 1452 | 1452 | - | - | - | 24000 | - | - | - | 17 mm | 17 mm | - | ||
A54SX32A-1FGG144I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 144 | - | - | 278 MHz | - | - | - | MICROSEMI CORP | - | - | - | A54SX32A-1FGG144I | - | - | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 40 | 5.32 | - | Yes | - | 2.75 V | 2.25 V | 2.5 V | - | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | 111 | Not Qualified | - | 2.5,2.5/5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 111 | 2880 CLBS, 48000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 1.1 ns | 2880 | 2880 | - | - | - | 48000 | - | - | - | 13 mm | 13 mm | - | ||
AGLN060V2-ZCSG81I Microchip | In Stock | - | - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | 81 | AGLN060 | - | - | - | - | - | MICROSEMI CORP | - | - | - | AGLN060V2-ZCSG81I | - | - | - | - | - | Microchip Technology | - | - | - | - | - | 60 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81 | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | Obsolete | NOT SPECIFIED | 5.81 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO nano | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | - | - | 18432 | 60000 | - | - | - | - | - | - | - | - | 1536 | - | - | - | - | 60000 | - | - | - | 5 mm | 5 mm | - | ||
AGLN250V2-ZCSG81 Microchip | In Stock | - | - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | 81 | AGLN250 | - | - | - | - | - | MICROSEMI CORP | - | - | - | AGLN250V2-ZCSG81 | - | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 60 | - | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Not Recommended | Active | NOT SPECIFIED | 5.59 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | -20°C ~ 85°C (TJ) | - | IGLOO nano | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B81 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | - | - | 36864 | 250000 | - | - | - | STD | - | - | - | - | 6144 | - | - | - | - | 250000 | - | - | - | 5 mm | 5 mm | - | ||
A54SX32-1BG313 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 313 | - | - | 280 MHz | - | - | - | MICROSEMI CORP | - | - | - | A54SX32-1BG313 | - | - | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA313,25X25,50 | BGA313,25X25,50 | SQUARE | GRID ARRAY | Active | - | 30 | 5.24 | - | No | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | e0 | - | TIN LEAD | - | - | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1.27 mm | unknown | - | - | S-PBGA-B313 | 249 | Not Qualified | - | 3.3,5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 249 | 2880 CLBS, 32000 GATES | 2.52 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 0.8 ns | 2880 | 2880 | - | - | - | 32000 | - | - | - | 35 mm | 35 mm | - | ||
A3PN125-Z1VQG100 Microchip | In Stock | - | - | - | - | Surface Mount | 100-TQFP | YES | - | 100-VQFP (14x14) | - | 100 | A3PN125 | - | - | - | - | - | MICROSEMI CORP | - | - | - | A3PN125-Z1VQG100 | - | - | - | - | - | Microchip Technology | - | - | - | - | - | 71 | - | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | Obsolete | 40 | 5.83 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -20°C ~ 85°C (TJ) | - | ProASIC3 nano | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | S-PQFP-G100 | 71 | Not Qualified | - | 1.5,1.5/3.3 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 71 | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 36864 | 125000 | - | - | - | - | - | - | - | - | 3072 | 3072 | - | - | - | 125000 | - | - | - | 14 mm | 14 mm | - | ||
A10V10B-VQG80C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 80 | - | - | 80 | - | - | 50 MHz | - | - | - | MICROSEMI CORP | - | - | - | A10V10B-VQG80C | - | - | - | - | - | - | - | - | - | 3 | - | 57 | - | 70 °C | - | - | PLASTIC/EPOXY | TQFP | TQFP, TQFP80,.6SQ | TQFP80,.6SQ | SQUARE | FLATPACK, THIN PROFILE | Obsolete | - | 40 | 5.28 | Compliant | Yes | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | e3 | - | MATTE TIN | 70 °C | 0 °C | MAX 57 I/OS | - | - | - | QUAD | GULL WING | 260 | 0.65 mm | compliant | - | - | S-PQFP-G80 | 57 | Not Qualified | 3.3 V | 3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | 6.5 ns | - | - | - | - | 57 | 295 CLBS, 1200 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 1200 | - | - | 295 | - | - | - | 147 | 4.5 ns | 295 | 295 | - | - | - | 1200 | - | - | - | 14 mm | 14 mm | No | ||
AGLN020V2-UCG81I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 81 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | AGLN020V2-UCG81I | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | - | NOT SPECIFIED | 8.05 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | - | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 520 CLBS, 20000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 520 | - | - | - | - | 20000 | - | - | - | 4 mm | 4 mm | - | ||
A2F060M3E-FG256M Microchip | In Stock | - | - | - | - | - | - | - | 256 | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | A2F060M3E-FG256M | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Obsolete | - | - | 5.85 | Non-Compliant | No | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | - | - | - | - | unknown | 80 MHz | - | - | - | - | - | - | - | EBI/EMI, I2C, SPI, UART, USART | - | - | - | - | - | - | DMA, POR, WDT | - | - | - | - | - | - | - | - | - | - | - | - | ARM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |