- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
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![]() M2S010-VFG400I Microchip | 2746 | - | - | - | - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | - | 400 | M2S010 | Microchip Technology / Atmel | - | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010-VFG400I | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 195 | 1007 LAB | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 40 | 5.73 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0.236569 oz | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B400 | 195 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | SoC FPGA | 400Kbit | - | - | - | STD | FPGA - 10K Logic Modules | - | - | - | 12084 | 1 Core | - | 256KB | SoC FPGA | - | 17 mm | 17 mm | - | ||
![]() M1A3PE3000L-FG896I Microchip | In Stock | - | - | - | - | Surface Mount | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M1A3PE3000 | - | 350 MHz | - | - | MICROSEMI CORP | - | - | M1A3PE3000L-FG896I | - | 1.26 V | Microchip Technology | 1.14 V | - | 3 | - | - | 620 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.3 | - | No | - | - | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | 896 | S-PBGA-B896 | 620 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 516096 | 3000000 | - | - | STD | - | - | - | 75264 | 75264 | - | 3000000 | - | - | - | 31 mm | 31 mm | - | ||
![]() M1A3P1000L-FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | - | M1A3P1000L-FGG484 | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 40 | 5.27 | - | Yes | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 300 | Not Qualified | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 24576 | 24576 | - | 1000000 | - | - | - | 23 mm | 23 mm | - | ||
![]() M2GL150TS-FCS536 Microchip | 2228 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 536-LFBGA, CSPBGA | YES | - | 536-CSPBGA (16x16) | - | 536 | M2GL150 | - | - | - | - | MICROSEMI CORP | - | - | M2GL150TS-FCS536 | - | - | Microchip Technology | - | - | - | - | - | 293 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | Non-Compliant | No | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | - | S-PBGA-B536 | - | - | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | 5120000 | - | - | - | STD | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2GL050T-FG484I Microchip | 2189 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL050 | - | - | - | - | MICROSEMI CORP | - | - | M2GL050T-FG484I | - | - | Microchip Technology | - | - | 3 | - | - | 267 | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | - | No | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | 1869824 | - | - | - | STD | - | - | - | - | 56340 | - | - | - | - | - | 23 mm | 23 mm | - | ||
![]() M2S050-1FG484 Microchip | 2123 |
| - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S050 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S050-1FG484 | 166 MHz | - | Microchip Technology | - | - | 3 | SMD/SMT | - | 267 | - | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.84 | - | No | - | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | 1 | FPGA - 50K Logic Modules | - | - | - | 48672 | 1 Core | - | 256KB | - | - | 23 mm | 23 mm | - | ||
![]() M2S050-FG896 Microchip | 2999 |
| - | - | - | - | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M2S050 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S050-FG896 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | - | 3 | SMD/SMT | - | 377 | - | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.3 | - | No | - | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | 896 | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | STD | FPGA - 50K Logic Modules | - | - | - | 48672 | 1 Core | - | 256KB | - | - | 31 mm | 31 mm | - | ||
![]() M2S010S-1FG484I Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2S010S-1FG484I | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | 20 | 5.85 | - | No | - | - | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | - | 225 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M1AFS250-QNG180I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 180 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | - | M1AFS250-QNG180I | - | - | - | - | - | 2 | - | - | - | - | - | 85 °C | -40 °C | - | UNSPECIFIED | VBCC | VBCC, LGA180,20X20,20 | LGA180,20X20,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | - | - | NOT SPECIFIED | 5.31 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BUTT | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-XBCC-B180 | 65 | Not Qualified | - | 1.5,3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 65 | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 6144 | 6144 | - | 250000 | - | - | - | 10 mm | 10 mm | - | ||
![]() AGLE3000V2-FG896 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 896 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | - | AGLE3000V2-FG896 | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.84 | - | No | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B896 | 620 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 75264 | 75264 | - | 3000000 | - | - | - | 31 mm | 31 mm | - | ||
![]() AGL600V5-CSG281 Microchip | In Stock | - | - | - | - | Surface Mount | 281-TFBGA, CSBGA | YES | - | 281-CSP (10x10) | - | 281 | AGL600 | - | 108 MHz | - | - | MICROSEMI CORP | - | - | AGL600V5-CSG281 | - | - | Microchip Technology | - | - | 3 | - | - | 215 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 1.46 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | 0°C ~ 70°C (TA) | - | IGLOO | - | - | - | - | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B281 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | - | 110592 | 600000 | - | - | STD | - | - | - | 13824 | - | - | 600000 | - | - | - | 10 mm | 10 mm | - | ||
![]() AGL125V2-FG144I Microchip | In Stock | - | - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | AGL125 | - | 108 MHz | - | - | MICROSEMI CORP | - | - | AGL125V2-FG144I | - | - | Microchip Technology | - | - | 3 | - | - | 97 | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 30 | 5.25 | - | No | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | -40°C ~ 85°C (TA) | - | IGLOO | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | - | 36864 | 125000 | - | - | STD | - | - | - | 3072 | - | - | 125000 | - | - | - | 13 mm | 13 mm | - | ||
![]() AX125-FGG324I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 324 | - | 400.011771 mg | 324 | - | - | 649 MHz | - | - | MICROSEMI CORP | - | - | AX125-FGG324I | - | - | - | - | - | 3 | - | - | 168 | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 40 | 5.8 | Compliant | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e1 | - | TIN SILVER COPPER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | BOTTOM | BALL | 260 | 1 mm | compliant | 649 MHz | - | S-PBGA-B324 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | - | 2.3 kB | - | - | - | 990 ps | - | 990 ps | - | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | - | - | 125000 | 649 MHz | 1344 | - | - | 1344 | 0.99 ns | 1344 | 2016 | - | 125000 | - | - | 1.25 mm | 19 mm | 19 mm | No | ||
![]() A1240A-PQ144M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 144 | - | - | 144 | - | - | - | - | - | MICROSEMI CORP | - | - | A1240A-PQ144M | - | - | - | - | - | 3 | - | - | 104 | - | - | 125 °C | -55 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | - | - | 30 | 8.69 | Non-Compliant | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | - | 8542.39.00.01 | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | 90 MHz | - | S-PQFP-G144 | - | Not Qualified | 5 V | - | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | 5 ns | - | - | - | - | 684 CLBS, 4000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 684 | - | - | 4000 | - | 684 | - | - | 568 | - | 684 | - | - | 4000 | - | - | - | 28 mm | 28 mm | No | ||
![]() A1460A-PQ160C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 160 | - | - | 100 MHz | - | - | MICROSEMI CORP | - | - | A1460A-PQ160C | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Obsolete | - | - | 30 | 5.85 | - | No | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | e0 | - | TIN LEAD | - | - | MAX 131 I/OS | 8542.39.00.01 | - | QUAD | GULL WING | 225 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | 3 ns | 848 | - | - | 6000 | - | - | - | 28 mm | 28 mm | - | ||
![]() AT40K20AL-1DQC Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | - | - | - | ATMEL CORP | - | - | AT40K20AL-1DQC | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | - | 30 | 5.92 | - | No | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | MAXIMUM USABLE GATES 30000 | 8542.39.00.01 | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | 256 | Not Qualified | - | 3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 256 | 1024 CLBS, 20000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | 2.2 ns | 1024 | 1024 | - | 20000 | - | - | - | 28 mm | 28 mm | - | ||
![]() AGLP030V5-CSG201I Microchip | 19 |
| - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP030 | - | 250 MHz | - | - | MICROSEMI CORP | - | - | AGLP030V5-CSG201I | - | - | Microchip Technology | - | - | 3 | - | - | 120 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 1.43 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | -40°C ~ 100°C (TJ) | - | IGLOO PLUS | e3 | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B201 | 120 | Not Qualified | - | 1.5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | - | - | 30000 | - | - | STD | - | - | - | 792 | 792 | - | 30000 | - | - | - | 8 mm | 8 mm | - | ||
![]() AGLE3000V5-FGG896 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 896 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | - | AGLE3000V5-FGG896 | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 40 | 5.8 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B896 | 620 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 75264 | 75264 | - | 3000000 | - | - | - | 31 mm | 31 mm | - | ||
![]() AGLE600V2-FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | - | AGLE600V2-FGG484 | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 40 | 8.58 | - | Yes | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 270 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 23 mm | 23 mm | - | ||
![]() A3PE3000L-1FGG896 Microchip | 840 | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | - | 250 MHz | - | - | MICROSEMI CORP | - | - | A3PE3000L-1FGG896 | - | 1.26 V | Microchip Technology | 1.14 V | - | 3 | - | - | 620 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.29 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | - | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | - | 0 to 70 °C | - | ProASIC3L | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | - | 63 kB | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 516096 | 3000000 | 892.86 MHz | - | 1 | - | 75264 | - | 75264 | 75264 | - | 3000000 | - | - | 1.73 mm | 31 mm | 31 mm | No |