- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Contents | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Speed - Read | Speed - Write | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
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 SF2060-STARTER-KIT Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | - | FLASH - NAND (MLC) | Swissbit | - | - | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 85°C | - | U-50 | - | - | - | USB 3.0 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 32GB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Programmer | - | - | - | - | - | - | - | - | - | 175MB/s | 90MB/s | - | - | - | - | - | - | - | ||
A1415A-VQG100I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 100 | - | - | 100 | - | - | 125 MHz | - | - | - | - | MICROSEMI CORP | - | - | A1415A-VQG100I | - | - | - | - | - | - | - | - | - | - | - | - | 80 | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | TFQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | - | - | 5.84 | Compliant | Yes | - | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | QUAD | GULL WING | - | 0.5 mm | compliant | 125 MHz | - | S-PQFP-G100 | - | - | 5 V | - | INDUSTRIAL | 5.5 V | 4.5 V | - | - | - | - | - | - | 3 ns | - | 3 ns | - | - | - | 200 CLBS, 1500 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 200 | - | - | 1500 | - | - | - | 200 | - | - | - | 264 | 3 ns | 200 | - | - | - | - | 1500 | - | - | - | 14 mm | 14 mm | No | ||
AT94S10AL-25DGU Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | AT94S10AL-25DGU | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | - | 5.3 | - | Yes | - | - | - | - | - | 3.3 V | - | - | - | - | - | - | - | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | - | 3.3 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A54SX08-1FG144I Microchip | In Stock | - | - | - | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | - | 280 MHz | - | - | - | - | MICROSEMI CORP | - | - | A54SX08-1FG144I | - | - | 3.63, 5.5 V | - | - | Microchip Technology | 2.97, 4.5 V | - | - | 3 | - | - | 111 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | Compliant | No | - | - | - | 3.6 V | 3 V | 3.3 V | - | 3.3, 5 V | - | -40 to 85 °C | - | SX | - | e0 | - | - | TIN LEAD SILVER | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | - | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | compliant | 280 MHz | - | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | INDUSTRIAL | 5.5 V | 4.5 V | - | - | - | - | - | - | 800 ps | - | 800 ps | - | - | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | - | 12000 | 280 MHz | 768 | - | 768 | 1 | - | - | 256 | 0.8 ns | 768 | 768 | - | - | - | 8000 | - | - | 1.05 mm | 13 mm | 13 mm | No | ||
AFS1500-1FG676 Microchip | 2078 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AFS1500 | - | - | - | - | - | - | MICROSEMI CORP | - | - | AFS1500-1FG676 | - | - | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 252 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | 0°C ~ 85°C (TJ) | - | Fusion® | - | e0 | - | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B676 | - | Not Qualified | 1.5 V | - | OTHER | 1.575 V | 1.425 V | - | - | 33.8 kB | - | - | - | - | - | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 276480 | 1.5e+06 | 1.28205 GHz | - | - | - | 1 | - | - | 38400 | - | 38400 | - | - | - | - | 1500000 | - | - | 1.73 mm | 25 mm | 25 mm | No | ||
AX125-FGG256I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | 649 MHz | - | - | - | - | MICROSEMI CORP | - | - | AX125-FGG256I | - | - | - | - | - | - | - | - | - | 3 | - | - | 138 | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 30 | 5.82 | Compliant | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e1 | - | - | TIN SILVER COPPER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | - | S-PBGA-B256 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | - | - | 2.3 kB | - | - | - | 990 ps | - | 990 ps | - | - | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | - | - | 125000 | 649 MHz | - | - | 1344 | - | - | - | 1344 | 0.99 ns | 1344 | 2016 | - | - | - | 125000 | - | - | 1.2 mm | 17 mm | 17 mm | No | ||
AX125-1FGG256 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | 763 MHz | - | - | - | - | MICROSEMI CORP | - | - | AX125-1FGG256 | - | - | - | - | - | - | - | - | - | 3 | - | - | 138 | - | - | 70 °C | - | - | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 40 | 5.8 | Compliant | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e1 | - | - | TIN SILVER COPPER | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | 763 MHz | - | S-PBGA-B256 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | - | - | 2.3 kB | - | - | - | 850 ps | - | 850 ps | - | - | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | - | - | 125000 | 763 MHz | - | - | 1344 | 1 | - | - | 1344 | 0.84 ns | 1344 | 2016 | - | - | - | 125000 | - | - | 1.2 mm | 17 mm | 17 mm | No | ||
A3P400-FG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 350 MHz | - | - | - | - | MICROSEMI CORP | - | - | A3P400-FG484 | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 30 | 7.76 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | ||
AX250-FG484I Microchip | 2712 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | AX250 | - | 649 MHz | - | - | - | - | MICROSEMI CORP | - | - | AX250-FG484I | - | - | 1.575 V | - | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | 248 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.64 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | 1.5000 V | - | -40 to 85 °C | - | Axcelerator | - | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B484 | 248 | Not Qualified | - | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 55296 | 250000 | - | 4224 | - | - | STD | - | - | - | 0.99 ns | 2816 | 4224 | - | - | - | 250000 | - | - | - | 27 mm | 27 mm | - | ||
A14V60A-PQ208C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 208 | - | - | 208 | - | - | 75 MHz | - | - | - | - | MICROSEMI CORP | - | - | A14V60A-PQ208C | - | - | - | - | - | - | - | - | - | 3 | - | - | 167 | - | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-208 | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | 30 | 5.88 | Compliant | No | - | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | e0 | - | - | TIN LEAD | 70 °C | 0 °C | MAX 167 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | 75 MHz | - | S-PQFP-G208 | - | Not Qualified | 3.3 V | - | COMMERCIAL | 3.6 V | 3 V | - | - | - | - | - | - | 3.9 ns | - | 3.9 ns | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 848 | - | - | 6000 | - | - | - | 848 | - | - | - | 768 | 3.9 ns | 848 | - | - | - | - | 6000 | - | - | - | 28 mm | 28 mm | No | ||
A14100A-CQ256M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 256 | - | - | 256 | - | - | 100 MHz | - | - | - | - | MICROSEMI CORP | - | - | A14100A-CQ256M | - | - | - | - | - | - | - | - | - | - | - | - | 228 | - | - | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | GQFF | HERMETIC SEALED, CERAMIC, QFP-256 | TPAK256,3SQ,20 | SQUARE | FLATPACK, GUARD RING | Obsolete | - | - | 8.42 | Compliant | - | - | 8542390000/8542390000/8542390000/8542390000/8542390000 | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | 3A001.A.2.C | - | - | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | QUAD | FLAT | - | 0.5 mm | compliant | 100 MHz | - | S-CQFP-F256 | 228 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | - | 3 ns | - | 3 ns | - | - | 228 | 1377 CLBS, 10000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 1377 | - | - | 10000 | - | - | - | 1377 | - | - | - | 1153 | 3 ns | 1377 | 1377 | - | - | - | 10000 | - | - | - | 36 mm | 36 mm | No | ||
A1415A-VQ100C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 100 | - | - | 125 MHz | - | - | - | - | MICROSEMI CORP | - | - | A1415A-VQ100C | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | - | 30 | 5.91 | - | No | - | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | MAX 80 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | - | S-PQFP-G100 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200 CLBS, 1500 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 3 ns | 200 | - | - | - | - | 1500 | - | - | - | 14 mm | 14 mm | - | ||
A1280A-PL84C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 84 | - | - | 50 MHz | - | - | - | - | MICROSEMI CORP | - | - | A1280A-PL84C | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | - | SQUARE | CHIP CARRIER | Obsolete | - | 30 | 8.78 | - | No | - | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | - | e0 | EAR99 | - | Tin/Lead (Sn/Pb) | - | - | MAX 72 I/OS | 8542.39.00.01 | - | - | QUAD | J BEND | 225 | 1.27 mm | unknown | - | - | S-PQCC-J84 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1232 CLBS, 8000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 5 ns | 1232 | 1232 | - | - | - | 8000 | - | - | - | 29.21 mm | 29.21 mm | - | ||
M1A3P400-FG484I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | M1A3P400-FG484I | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.25 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | ||
SF2-DEV-KIT-PP-1 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | - | Box | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SmartFusion®2 | - | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Power Supply, Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M2S060-FCSG325I Microchip | 2806 |
| - | Production (Last Updated: 2 months ago) | - | - | 325-TFBGA, FCBGA | YES | 325 | 325-FCBGA (11x11) | - | 325 | M2S060 | - | - | 64 kB | - | - | - | MICROSEMI CORP | - | - | M2S060-FCSG325I | 166 MHz | - | 1.26 V | + 100 C | - | Microchip Technology | 1.14 V | - 40 C | - | 3 | - | - | 200 | - | 56520 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.79 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | - | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | STD | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | - | - | 256KB | - | - | 11 mm | 11 mm | - | ||
M2GL005-VFG256 Microchip | 24000 | - | - | - | - | Surface Mount | BGA-256 | YES | - | 256-FPBGA (14x14) | - | 256 | M2GL005 | Microchip Technology / Atmel | - | - | 703 kbit | 119 | - | MICROSEMI CORP | - | - | M2GL005-VFG256 | - | 340 MHz | - | + 85 C | - | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | - | 161 I/O | 505 LAB | 6060 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | Details | Yes | FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | 0.025037 oz | 0°C ~ 85°C (TJ) | Tray | M2GL005 | - | - | - | - | - | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | - | S-PBGA-B256 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | 719872 | - | - | - | - | - | STD | - | - | - | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | - | 14 mm | 14 mm | - | ||
M2S010-VFG400I Microchip | 2746 | - | - | - | - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | - | 400 | M2S010 | Microchip Technology / Atmel | - | 64 kB | - | 90 | - | MICROSEMI CORP | - | - | M2S010-VFG400I | 166 MHz | - | - | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 195 | 1007 LAB | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.73 | Details | Yes | - | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 2.5, 3.3 V | 0.236569 oz | -40 to 100 °C | Tray | SmartFusion2 | - | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | S-PBGA-B400 | 195 | Not Qualified | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | SoC FPGA | 400Kbit | - | - | - | - | - | STD | - | FPGA - 10K Logic Modules | - | - | - | 12084 | 1 Core | - | - | - | 256KB | SoC FPGA | - | 17 mm | 17 mm | - | ||
M1A3PE3000L-FG896I Microchip | In Stock | - | - | - | - | Surface Mount | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M1A3PE3000 | - | 350 MHz | - | - | - | - | MICROSEMI CORP | - | - | M1A3PE3000L-FG896I | - | - | 1.26 V | - | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 620 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | - | No | - | - | - | 1.575 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | - | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | 896 | S-PBGA-B896 | 620 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 516096 | 3000000 | - | - | - | - | STD | - | - | - | - | 75264 | 75264 | - | - | - | 3000000 | - | - | - | 31 mm | 31 mm | - | ||
M1A3P1000L-FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 350 MHz | - | - | - | - | MICROSEMI CORP | - | - | M1A3P1000L-FGG484 | - | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | - | 40 | 5.27 | - | Yes | - | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | e1 | - | - | TIN SILVER COPPER | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 300 | Not Qualified | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 24576 | 24576 | - | - | - | 1000000 | - | - | - | 23 mm | 23 mm | - |