- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2GL150TS-FCS536 Microchip | 2228 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 536-LFBGA, CSPBGA | YES | - | 536-CSPBGA (16x16) | - | 536 | M2GL150 | - | - | - | - | MICROSEMI CORP | - | - | M2GL150TS-FCS536 | - | - | - | - | Microchip Technology | - | - | - | - | - | 293 | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | - | S-PBGA-B536 | - | - | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | - | 5120000 | - | - | STD | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M2GL050T-FG484I Microchip | 2189 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL050 | - | - | - | - | MICROSEMI CORP | - | - | M2GL050T-FG484I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 267 | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | - | 1869824 | - | - | STD | - | - | - | - | 56340 | - | - | - | - | - | 23 mm | 23 mm | - | ||
M2S050-1FG484 Microchip | 2123 |
| - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S050 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S050-1FG484 | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | 267 | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.84 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | 1 | - | FPGA - 50K Logic Modules | - | - | 48672 | 1 Core | - | 256KB | - | - | 23 mm | 23 mm | - | ||
M2S050-FG896 Microchip | 2999 |
| - | - | - | - | 896-BGA | YES | - | 896-FBGA (31x31) | - | 896 | M2S050 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S050-FG896 | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | SMD/SMT | 377 | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.3 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | - | SmartFusion®2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | 896 | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | OTHER | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | STD | - | FPGA - 50K Logic Modules | - | - | 48672 | 1 Core | - | 256KB | - | - | 31 mm | 31 mm | - | ||
M2S010S-1FG484I Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2S010S-1FG484I | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | 20 | 5.85 | - | No | - | - | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | 225 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AGLN060V5-ZCSG81I Microchip | In Stock | - | - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | 81 | AGLN060 | - | - | - | - | MICROSEMI CORP | - | - | AGLN060V5-ZCSG81I | - | - | - | - | Microchip Technology | - | - | - | - | - | 60 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81 | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | - | Obsolete | NOT SPECIFIED | 5.81 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO nano | - | - | - | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | - | - | 18432 | 60000 | - | - | - | - | - | 1536 | - | - | 60000 | - | - | - | 5 mm | 5 mm | - | ||
AGL1000V2-CSG281 Microchip | In Stock | - | - | - | - | Surface Mount | 281-TFBGA, CSBGA | YES | - | 281-CSP (10x10) | - | 281 | AGL1000 | - | 108 MHz | - | - | MICROSEMI CORP | - | - | AGL1000V2-CSG281 | - | - | 1.575 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | 215 | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 0.86 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | 1.2, 1.5 V | - | 0 to 70 °C | - | IGLOO | - | 3A001.A.7.A | - | - | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | 281 | S-PBGA-B281 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | - | - | 147456 | 1000000 | - | STD | - | - | - | 24576 | - | - | 1000000 | - | - | - | 10 mm | 10 mm | - | ||
A3PE3000L-FG484I Microchip | 523 | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | Microchip Technology / Atmel | 250 MHz | - | 60 | MICROSEMI CORP | - | - | A3PE3000L-FG484I | - | 350 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.3 | N | No | FPGA ProASICu00ae3EL Family 3M Gates 781.25MHz 130nm Technology 1.2V 484-Pin FBGA Tray | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000L | e0 | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B484 | 341 | Not Qualified | 1.425 V to 1.575 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | - | 1.26 V | 1.14 V | - | 63 kB | - | - | - | - | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | - | 516096 | 3000000 | 781.25 MHz | STD | - | - | 75264 | 75264 | 75264 | - | 3000000 | - | FPGA - Field Programmable Gate Array | 1.73 mm | 23 mm | 23 mm | No | ||
AGL1000V2-FG484I Microchip | In Stock | - | - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | AGL1000 | - | 108 MHz | - | - | MICROSEMI CORP | - | - | AGL1000V2-FG484I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 300 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.26 | - | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 85°C (TA) | - | IGLOO | e0 | - | Tin/Lead (Sn/Pb) | - | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | - | - | 147456 | 1000000 | - | STD | - | - | - | 24576 | - | - | 1000000 | - | - | - | 23 mm | 23 mm | - | ||
A3PE3000L-FG896M Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | - | 250 MHz | - | - | MICROSEMI CORP | - | - | A3PE3000L-FG896M | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 620 | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.29 | Compliant | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | -55°C ~ 125°C (TJ) | - | ProASIC3L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | - | 1.575 V | 1.14 V | - | 63 kB | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 516096 | 3e+06 | - | - | - | - | 75264 | 75264 | 75264 | - | 3000000 | - | - | - | 31 mm | 31 mm | No | ||
A3PE600-FGG256I Microchip | In Stock | - | - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | 256 | A3PE600 | - | 350 MHz | - | - | MICROSEMI CORP | - | - | A3PE600-FGG256I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 165 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 1.6 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -40°C ~ 100°C (TJ) | - | ProASIC3E | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | 165 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | - | STD | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 17 mm | 17 mm | - | ||
AGLP060V2-CS201 Microchip | 6 |
| - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP060 | - | 160 MHz | - | - | MICROSEMI CORP | - | - | AGLP060V2-CS201 | - | - | 1.575 V | - | Microchip Technology | 1.14 V | - | - | - | - | 157 | - | 70 °C | - | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 5.26 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | 1.2, 1.5 V | - | 0 to 70 °C | - | IGLOO PLUS | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | - | 201 | S-PBGA-B201 | 157 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 157 | 1584 CLBS, 60000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 1584 | - | - | 18432 | 60000 | - | STD | - | - | - | 1584 | 1584 | - | 60000 | - | - | - | 8 mm | 8 mm | - | ||
A1010B-1PL68I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 68 | - | - | 47.7 MHz | - | - | MICROSEMI CORP | - | - | A1010B-1PL68I | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | - | 5.84 | - | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 68 | S-PQCC-J68 | 57 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 57 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 547 | 295 | - | 2000 | - | - | - | 24.2316 mm | 24.2316 mm | - | ||
M1AFS250-QNG180I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 180 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | - | M1AFS250-QNG180I | - | - | - | - | - | - | - | - | 2 | - | - | - | 85 °C | -40 °C | - | UNSPECIFIED | VBCC | VBCC, LGA180,20X20,20 | LGA180,20X20,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | - | - | NOT SPECIFIED | 5.31 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BUTT | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-XBCC-B180 | 65 | Not Qualified | - | 1.5,3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 65 | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 6144 | 6144 | - | 250000 | - | - | - | 10 mm | 10 mm | - | ||
AGL400V2-FGG144T Microchip | In Stock | - | - | - | Surface Mount | - | - | - | 144 | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V2-FGG144T | - | - | - | - | - | - | - | - | 3 | - | 97 | - | - | - | - | - | - | - | - | - | - | Active | - | - | 30 | 5.77 | Compliant | Yes | - | - | - | - | - | - | - | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | - | - | - | 260 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | 6.8 kB | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9216 | - | - | - | 400000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AGL600V2-FGG484I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 108 MHz | - | - | ACTEL CORP | - | - | AGL600V2-FGG484I | - | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | - | - | 40 | 5.77 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B484 | 235 | Not Qualified | - | 1.2/1.5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 23 mm | 23 mm | - | ||
A2F500M3G-FG256M Microchip | In Stock | - | - | - | - | - | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | - | 256 | A2F500 | - | - | - | - | MICROSEMI CORP | - | - | A2F500M3G-FG256M | - | - | - | - | Microchip Technology | - | - | - | - | - | MCU - 25, FPGA - 66 | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | - | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | - | 5.84 | Non-Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -55°C ~ 125°C (TJ) | - | SmartFusion® | - | - | - | 125 °C | -55 °C | 8542.39.00.01 | - | BOTTOM | BALL | - | 1 mm | unknown | 80 MHz | - | S-PBGA-B256 | 66 | - | - | - | MILITARY | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | ARM | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 11520 | 11520 | - | 500000 | 512KB | - | - | 17 mm | 17 mm | - | ||
AGLE600V5-FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 250 MHz | - | - | ACTEL CORP | - | - | AGLE600V5-FGG484 | - | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | - | - | 40 | 5.78 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | - | - | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 270 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 23 mm | 23 mm | - | ||
AGL400V2-FG144T Microchip | In Stock | - | - | - | Surface Mount | - | - | - | 144 | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | AGL400V2-FG144T | - | - | - | - | - | - | - | - | 3 | - | 97 | - | - | - | - | - | - | - | - | - | - | Active | - | - | 20 | 5.82 | Non-Compliant | No | - | - | - | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | - | - | - | 235 | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | 6.8 kB | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 9216 | - | - | - | 400000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A3P600-2FG144I Microchip | In Stock | - | - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P600 | - | 350 MHz | - | - | MICROSEMI CORP | - | - | A3P600-2FG144I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 97 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 30 | 5.25 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -40°C ~ 100°C (TJ) | - | ProASIC3 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | - | 2 | - | - | - | 13824 | - | - | 600000 | - | - | - | 13 mm | 13 mm | - |