- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Contents | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
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 CORE1553-DEV-KIT-2 Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | CORE1553 | - | - | - | - | Core1553, M1AFS1500 | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Electronic Delivery | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | Fusion® | - | - | FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Power Supply, Programmer | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A1460A-1PQG160I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 160 | - | - | 125 MHz | - | - | - | MICROSEMI CORP | - | - | A1460A-1PQG160I | - | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Obsolete | - | - | 40 | 5.81 | - | Yes | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e3 | - | - | MATTE TIN | - | - | MAX 131 I/OS | 8542.39.00.01 | - | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 2.6 ns | 848 | - | - | 6000 | - | - | - | 28 mm | 28 mm | - | ||
A1020B-1PL84M Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 84 | - | - | - | - | - | - | MICROSEMI CORP | - | - | A1020B-1PL84M | - | - | - | - | - | - | - | - | 3 | - | - | - | 125 °C | -55 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | - | - | 30 | 5.8 | - | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | 3A001.A.2.C | - | TIN LEAD | - | - | - | 8542.39.00.01 | - | QUAD | J BEND | 225 | 1.27 mm | compliant | - | - | S-PQCC-J84 | - | Not Qualified | - | - | MILITARY | - | - | - | - | - | - | - | - | - | - | - | - | - | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 547 | - | - | 2000 | - | - | - | 29.3116 mm | 29.3116 mm | - | ||
APA1000-FGG1152I Microchip | In Stock | - | - | - | - | Surface Mount | 1152-BGA | YES | - | 1152-FPBGA (35x35) | - | 1152 | APA1000 | - | 180 MHz | - | - | - | MICROSEMI CORP | - | - | APA1000-FGG1152I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 712 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.26 | - | Yes | - | 2.7 V | 2.3 V | 2.5 V | - | - | - | -40°C ~ 85°C (TA) | - | ProASICPLUS | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1 mm | compliant | - | - | S-PBGA-B1152 | 712 | Not Qualified | - | 2.5,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 712 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 202752 | 1000000 | - | - | - | - | - | - | - | - | - | 56320 | - | 1000000 | - | - | - | 35 mm | 35 mm | - | ||
AX2000-1FGG1152I Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 1152 | - | 400.011771 mg | 1152 | - | - | 763 MHz | - | - | - | MICROSEMI CORP | - | - | AX2000-1FGG1152I | - | - | - | - | - | - | - | - | 3 | - | 684 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | 40 | 5.29 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | BOTTOM | BALL | 245 | 1 mm | compliant | 763 MHz | - | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | - | 36 kB | - | - | - | 850 ps | - | 850 ps | - | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | - | - | 2e+06 | 763 MHz | - | 21504 | 1 | - | - | 21504 | 0.84 ns | 21504 | 32256 | - | 2000000 | - | - | 1.73 mm | 35 mm | 35 mm | No | ||
A3PE1500-FGG484I Microchip | 2263 | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | Microchip Technology / Atmel | 350 MHz | - | 60 | - | MICROSEMI CORP | - | - | A3PE1500-FGG484I | - | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 280 | 16000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.29 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e1 | 3A001.A.7.A | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | - | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | - | - | - | - | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | 276480 | 1.5e+06 | 231 MHz | - | - | STD | - | - | 38400 | - | 38400 | 38400 | - | 1500000 | - | FPGA - Field Programmable Gate Array | 1.73 mm | 23 mm | 23 mm | No | ||
AGLN060V5-CSG81I Microchip | In Stock | - | - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | 81 | AGLN060 | - | - | - | - | - | MICROSEMI CORP | - | - | AGLN060V5-CSG81I | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 60 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 2.07 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO nano | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | - | 18432 | 60000 | - | - | - | STD | - | - | - | - | 1536 | - | - | 60000 | - | - | - | 5 mm | 5 mm | - | ||
AGLP030V5-CSG201 Microchip | In Stock | - | - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP030 | - | 250 MHz | - | - | - | MICROSEMI CORP | - | - | AGLP030V5-CSG201 | - | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | 120 | - | 70 °C | - | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 0.85 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | 1.5000 V | - | 0 to 70 °C | - | IGLOO PLUS | - | - | - | - | - | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | 201 | S-PBGA-B201 | 120 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | - | - | 30000 | - | - | - | STD | - | - | - | - | 792 | 792 | - | 30000 | - | - | - | 8 mm | 8 mm | - | ||
A1280A-1CQ172M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 172 | - | - | 172 | - | - | 75 MHz | - | - | - | MICROSEMI CORP | - | - | A1280A-1CQ172M | - | - | - | - | - | - | - | - | - | - | 140 | - | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | HGQFF | CERAMIC, CQFP-172 | TPAK172,2.5SQ,25 | SQUARE | FLATPACK, HEAT SINK/SLUG, GUARD RING | Obsolete | - | - | NOT SPECIFIED | 8.79 | Non-Compliant | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | 3A001.A.2.C | - | TIN LEAD | 125 °C | -55 °C | MAX 140 I/OS | 8542.39.00.01 | - | QUAD | FLAT | NOT SPECIFIED | 0.635 mm | compliant | 90 MHz | - | S-CQFP-F172 | 140 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | 4.3 ns | - | 4.3 ns | - | - | 140 | 1232 CLBS, 8000 GATES | 2.9464 mm | FIELD PROGRAMMABLE GATE ARRAY | 1232 | - | - | 8000 | - | - | 1232 | 1 | - | - | 998 | 4.3 ns | 1232 | 1232 | - | 8000 | - | - | - | 29.972 mm | 29.972 mm | No | ||
A1020B-2PL44I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 44 | - | - | 54.1 MHz | - | - | - | MICROSEMI CORP | - | - | A1020B-2PL44I | - | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 30 | 5.88 | - | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | MAX 34 I/OS | 8542.39.00.01 | - | QUAD | J BEND | 225 | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | 69 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 69 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 3.4 ns | 547 | 547 | - | 2000 | - | - | - | 16.5862 mm | 16.5862 mm | - | ||
A10V20B-PL68C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | - | - | - | 68 | - | - | 45 MHz | - | - | - | MICROSEMI CORP | - | - | A10V20B-PL68C | - | - | - | - | - | - | - | - | - | - | 57 | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | - | 5.85 | Non-Compliant | No | - | 3.465 V | 3.135 V | 3.3 V | - | - | - | - | - | - | - | - | - | - | 70 °C | 0 °C | - | - | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 68 | S-PQCC-J68 | 69 | Not Qualified | 3.3 V | 3.3 V | COMMERCIAL | - | - | - | - | - | - | - | 6.5 ns | - | - | - | - | 69 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 2000 | - | - | 547 | - | - | - | 273 | 4.5 ns | 547 | 547 | - | 2000 | - | - | - | 24.2316 mm | 24.2316 mm | No | ||
A1020B-CQ84M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 84 | - | - | 84 | - | - | 37 MHz | - | - | - | MICROSEMI CORP | - | - | A1020B-CQ84M | - | - | - | - | - | - | - | - | - | - | 69 | - | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK84,1.63SQ,25 | TPAK84,1.63SQ,25 | SQUARE | FLATPACK | Obsolete | - | - | 20 | 5.84 | Non-Compliant | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | 3A001.A.2.C | - | TIN LEAD | 125 °C | -55 °C | MAX 69 I/OS | 8542.39.00.01 | - | QUAD | FLAT | 225 | 0.635 mm | compliant | 48 MHz | - | S-CQFP-F84 | 69 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | 4.5 ns | - | 4.5 ns | - | - | 69 | 547 CLBS, 2000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | - | - | 2000 | - | - | 547 | - | - | - | 273 | 5.5 ns | 547 | 547 | - | 2000 | - | - | - | 16.51 mm | 16.51 mm | No | ||
A3P250-QNG132I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 132 | - | - | 132 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | A3P250-QNG132I | - | - | - | - | - | - | - | - | 2 | - | 87 | - | 100 °C | -40 °C | - | UNSPECIFIED | VBCC | VBCC, | - | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | - | - | 30 | 5.24 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | 8542.39.00.01 | - | BOTTOM | BUTT | 260 | 0.5 mm | compliant | - | - | S-XBCC-B132 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | 4.5 kB | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 250000 | - | - | - | - | - | - | 6144 | - | 6144 | - | - | 250000 | - | - | - | 8 mm | 8 mm | No | ||
M1AGLE3000V5-FG896 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 896 | - | 400.011771 mg | 896 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M1AGLE3000V5-FG896 | - | - | - | - | - | - | - | - | 3 | - | 620 | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | FBGA-896 | - | SQUARE | GRID ARRAY | Obsolete | - | - | 20 | 5.88 | Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B896 | - | Not Qualified | 1.5 V | - | COMMERCIAL | 1.575 V | 1.425 V | - | 63 kB | - | - | - | - | - | - | - | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | - | - | 3e+06 | 892.86 MHz | - | - | - | - | - | 75264 | - | 75264 | - | - | 3000000 | - | - | 1.73 mm | 29 mm | 29 mm | No | ||
M2GL090TS-1FG484I Microchip | 2535 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | FBGA-484 | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL090 | Microchip Technology / Atmel | - | - | 60 | - | MICROSEMI CORP | - | - | M2GL090TS-1FG484I | - | - | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86316 | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | 0.627572 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090TS | - | - | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | 323.3 kB | - | - | - | - | - | - | 667 Mb/s | - | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | FPGA - Field Programmable Gate Array | 2648064 | - | - | - | - | - | 4 Transceiver | - | - | - | - | 86316 | - | - | - | FPGA - Field Programmable Gate Array | - | 23 mm | 23 mm | - | ||
M2S010TS-1VF400I Microchip | 6 |
| - | - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2S010 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S010TS-1VF400I | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | SMD/SMT | 195 | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | 5.86 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | - | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1 | - | FPGA - 10K Logic Modules | - | - | - | - | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - | ||
M2GL150TS-FC1152 Microchip | 2079 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | - | 1152 | M2GL150 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL150TS-FC1152 | - | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | - | 574 | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | 5120000 | - | - | - | - | STD | - | - | - | - | - | 146124 | - | - | - | - | - | 35 mm | 35 mm | - | ||
M2S150-1FCSG536 Microchip | 2858 |
| - | - | - | - | 536-LFBGA, CSPBGA | YES | - | 536-CSPBGA (16x16) | - | 536 | M2S150 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S150-1FCSG536 | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | - | 293 | 146124 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.77 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | - | compliant | - | - | S-PBGA-B536 | 293 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 293 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | - | 146124 | 1 Core | - | 512KB | - | - | - | - | - | ||
M2GL025TS-VF400 Microchip | 2378 |
| - | - | - | Surface Mount | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2GL025 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL025TS-VF400 | - | - | - | + 85 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | 207 | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 20 | 5.27 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | - | - | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | 207 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | 1130496 | - | - | - | - | - | 4 Transceiver | - | - | - | - | 27696 | - | - | - | - | - | 17 mm | 17 mm | - | ||
5962-1222501VZC Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | 5962-1222501VZC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | 5.82 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | - | compliant | - | - | - | - | Qualified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |