- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 AT94S10AL-25DGU Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | AT94S10AL-25DGU | - | - | - | - | - | - | - | - | - | - | - | 80 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | - | 5.3 | - | Yes | - | - | - | - | - | 3.3 V | - | - | - | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | - | 3.3 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A54SX08-1FG144I Microchip | In Stock | - | - | - | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | - | 280 MHz | - | - | MICROSEMI CORP | - | - | A54SX08-1FG144I | - | 3.63, 5.5 V | - | Microchip Technology | 2.97, 4.5 V | - | - | 3 | - | 111 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | Compliant | No | - | - | - | 3.6 V | 3 V | 3.3 V | - | 3.3, 5 V | - | -40 to 85 °C | - | SX | e0 | - | TIN LEAD SILVER | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | - | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | compliant | 280 MHz | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | INDUSTRIAL | 5.5 V | 4.5 V | - | - | - | - | - | 800 ps | - | 800 ps | - | - | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | - | 12000 | 280 MHz | 768 | 768 | 1 | - | - | 256 | 0.8 ns | 768 | 768 | - | 8000 | - | - | 1.05 mm | 13 mm | 13 mm | No | ||
AFS1500-1FG676 Microchip | 2078 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AFS1500 | - | - | - | - | MICROSEMI CORP | - | - | AFS1500-1FG676 | - | - | - | Microchip Technology | - | - | - | 3 | - | 252 | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | 0°C ~ 85°C (TJ) | - | Fusion® | e0 | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | S-PBGA-B676 | - | Not Qualified | 1.5 V | - | OTHER | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | - | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 276480 | 1.5e+06 | 1.28205 GHz | - | - | 1 | - | - | 38400 | - | 38400 | - | - | 1500000 | - | - | 1.73 mm | 25 mm | 25 mm | No | ||
AX125-FGG256I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | 649 MHz | - | - | MICROSEMI CORP | - | - | AX125-FGG256I | - | - | - | - | - | - | - | 3 | - | 138 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 30 | 5.82 | Compliant | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B256 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | - | 2.3 kB | - | - | - | 990 ps | - | 990 ps | - | - | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | - | - | 125000 | 649 MHz | - | 1344 | - | - | - | 1344 | 0.99 ns | 1344 | 2016 | - | 125000 | - | - | 1.2 mm | 17 mm | 17 mm | No | ||
AX125-1FGG256 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | 763 MHz | - | - | MICROSEMI CORP | - | - | AX125-1FGG256 | - | - | - | - | - | - | - | 3 | - | 138 | - | 70 °C | - | - | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 40 | 5.8 | Compliant | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e1 | - | TIN SILVER COPPER | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | 763 MHz | S-PBGA-B256 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | - | 2.3 kB | - | - | - | 850 ps | - | 850 ps | - | - | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | - | - | 125000 | 763 MHz | - | 1344 | 1 | - | - | 1344 | 0.84 ns | 1344 | 2016 | - | 125000 | - | - | 1.2 mm | 17 mm | 17 mm | No | ||
A3P400-FG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | - | A3P400-FG484 | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 30 | 7.76 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B484 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | ||
AX250-FG484I Microchip | 2712 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | AX250 | - | 649 MHz | - | - | MICROSEMI CORP | - | - | AX250-FG484I | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | 248 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.64 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | 1.5000 V | - | -40 to 85 °C | - | Axcelerator | e0 | - | Tin/Lead (Sn/Pb) | - | - | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | S-PBGA-B484 | 248 | Not Qualified | - | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 55296 | 250000 | - | 4224 | - | STD | - | - | - | 0.99 ns | 2816 | 4224 | - | 250000 | - | - | - | 27 mm | 27 mm | - | ||
A14V60A-PQ208C Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 208 | - | - | 208 | - | - | 75 MHz | - | - | MICROSEMI CORP | - | - | A14V60A-PQ208C | - | - | - | - | - | - | - | 3 | - | 167 | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-208 | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | 30 | 5.88 | Compliant | No | - | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | e0 | - | TIN LEAD | 70 °C | 0 °C | MAX 167 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | 75 MHz | S-PQFP-G208 | - | Not Qualified | 3.3 V | - | COMMERCIAL | 3.6 V | 3 V | - | - | - | - | - | 3.9 ns | - | 3.9 ns | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 848 | - | - | 6000 | - | - | 848 | - | - | - | 768 | 3.9 ns | 848 | - | - | 6000 | - | - | - | 28 mm | 28 mm | No | ||
A14100A-CQ256M Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 256 | - | - | 256 | - | - | 100 MHz | - | - | MICROSEMI CORP | - | - | A14100A-CQ256M | - | - | - | - | - | - | - | - | - | 228 | - | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | GQFF | HERMETIC SEALED, CERAMIC, QFP-256 | TPAK256,3SQ,20 | SQUARE | FLATPACK, GUARD RING | Obsolete | - | - | 8.42 | Compliant | - | - | 8542390000/8542390000/8542390000/8542390000/8542390000 | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | 3A001.A.2.C | - | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | QUAD | FLAT | - | 0.5 mm | compliant | 100 MHz | S-CQFP-F256 | 228 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | - | - | - | - | - | 3 ns | - | 3 ns | - | - | 228 | 1377 CLBS, 10000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 1377 | - | - | 10000 | - | - | 1377 | - | - | - | 1153 | 3 ns | 1377 | 1377 | - | 10000 | - | - | - | 36 mm | 36 mm | No | ||
A1415A-VQ100C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 100 | - | - | 125 MHz | - | - | MICROSEMI CORP | - | - | A1415A-VQ100C | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | - | 30 | 5.91 | - | No | - | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | MAX 80 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | S-PQFP-G100 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 200 CLBS, 1500 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 3 ns | 200 | - | - | 1500 | - | - | - | 14 mm | 14 mm | - | ||
A1280A-PL84C Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 84 | - | - | 50 MHz | - | - | MICROSEMI CORP | - | - | A1280A-PL84C | - | - | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | - | SQUARE | CHIP CARRIER | Obsolete | - | 30 | 8.78 | - | No | - | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | - | e0 | EAR99 | Tin/Lead (Sn/Pb) | - | - | MAX 72 I/OS | 8542.39.00.01 | - | - | QUAD | J BEND | 225 | 1.27 mm | unknown | - | S-PQCC-J84 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 1232 CLBS, 8000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 5 ns | 1232 | 1232 | - | 8000 | - | - | - | 29.21 mm | 29.21 mm | - | ||
M2S090TS-1FGG484I Microchip | 2082 | - | - | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2S090 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S090TS-1FGG484I | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | 267 | 86316 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | - | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1 | - | FPGA - 90K Logic Modules | - | - | - | 86316 | 1 Core | - | 512KB | - | - | 23 mm | 23 mm | - | ||
M2GL090-1FGG676 Microchip | 2891 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 676-BGA | YES | - | 676-FBGA (27x27) | - | 676 | M2GL090 | - | - | - | - | MICROSEMI CORP | - | - | M2GL090-1FGG676 | - | - | + 85 C | Microchip Technology | - | 0 C | - | 3 | SMD/SMT | 425 | 86184 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | 85 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | 323.3 kB | - | - | - | - | - | - | - | - | 425 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | - | 2648064 | - | - | - | - | - | - | - | - | - | - | 86316 | - | - | - | - | - | 27 mm | 27 mm | - | ||
M2S150T-FCVG484 Microchip | 2498 |
| - | - | - | - | 484-BFBGA | YES | - | 484-FBGA (19x19) | - | 484 | M2S150 | - | - | - | - | MICROSEMI CORP | - | - | M2S150T-FCVG484 | - | - | - | Microchip Technology | - | - | - | 4 | - | 273 | - | 85 °C | - | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.77 | - | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B484 | 273 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 273 | - | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | - | 146124 | - | - | 512KB | - | - | 19 mm | 19 mm | - | ||
M2GL025-VFG256 Microchip | 45 | - | - | - | - | Surface Mount | 256-LFBGA | YES | - | 256-FPBGA (14x14) | - | 256 | M2GL025 | Microchip Technology / Atmel | - | - | 119 | MICROSEMI CORP | - | - | M2GL025-VFG256 | - | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | 138 | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | 14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.26 | Details | Yes | IC FPGA 138 I/O 256FBGA | - | - | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | - | 0°C ~ 85°C (TJ) | Tray | IGLOO2 | - | - | - | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | S-PBGA-B256 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | 667 Mb/s | - | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | FPGA - Field Programmable Gate Array | 1130496 | - | - | - | - | STD | 2 Transceiver | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | - | 14 mm | 14 mm | - | ||
A1460A-1PQG160I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 160 | - | - | 125 MHz | - | - | MICROSEMI CORP | - | - | A1460A-1PQG160I | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Obsolete | - | 40 | 5.81 | - | Yes | - | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e3 | - | MATTE TIN | - | - | MAX 131 I/OS | 8542.39.00.01 | - | - | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | S-PQFP-G160 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 2.6 ns | 848 | - | - | 6000 | - | - | - | 28 mm | 28 mm | - | ||
A1020B-1PL84M Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 84 | - | - | - | - | - | MICROSEMI CORP | - | - | A1020B-1PL84M | - | - | - | - | - | - | - | 3 | - | - | - | 125 °C | -55 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | - | 30 | 5.8 | - | No | - | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | e0 | 3A001.A.2.C | TIN LEAD | - | - | - | 8542.39.00.01 | - | - | QUAD | J BEND | 225 | 1.27 mm | compliant | - | S-PQCC-J84 | - | Not Qualified | - | - | MILITARY | - | - | - | - | - | - | - | - | - | - | - | - | - | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 547 | - | - | 2000 | - | - | - | 29.3116 mm | 29.3116 mm | - | ||
M1AGLE3000V5-FG896 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 896 | - | 400.011771 mg | 896 | - | - | - | - | - | MICROSEMI CORP | - | - | M1AGLE3000V5-FG896 | - | - | - | - | - | - | - | 3 | - | 620 | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | FBGA-896 | - | SQUARE | GRID ARRAY | Obsolete | - | 20 | 5.88 | Compliant | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 225 | 1 mm | unknown | - | S-PBGA-B896 | - | Not Qualified | 1.5 V | - | COMMERCIAL | 1.575 V | 1.425 V | - | 63 kB | - | - | - | - | - | - | - | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | - | - | 3e+06 | 892.86 MHz | - | - | - | - | - | 75264 | - | 75264 | - | - | 3000000 | - | - | 1.73 mm | 29 mm | 29 mm | No | ||
M2GL090TS-1FG484I Microchip | 2535 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | FBGA-484 | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL090 | Microchip Technology / Atmel | - | - | 60 | MICROSEMI CORP | - | - | M2GL090TS-1FG484I | - | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86316 | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | N | No | - | - | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | 0.627572 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090TS | - | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | 323.3 kB | - | - | - | - | - | - | 667 Mb/s | - | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | FPGA - Field Programmable Gate Array | 2648064 | - | - | - | - | - | 4 Transceiver | - | - | - | - | 86316 | - | - | - | FPGA - Field Programmable Gate Array | - | 23 mm | 23 mm | - | ||
M2S010TS-1VF400I Microchip | 6 |
| - | - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2S010 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S010TS-1VF400I | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | SMD/SMT | 195 | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | - | No | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | - | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1 | - | FPGA - 10K Logic Modules | - | - | - | - | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - |