- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Rohs Code
- Programmable Logic Type
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
Attribute column
Manufacturer
Microchip Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Category | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | Interface Standards | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | PCIe | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tool Is For Evaluation Of | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Power Rating | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Contents | Speed Grade | Number of Transceivers | Resistance Tolerance | Primary Attributes | Ethernet | Number of Registers | Combinatorial Delay of a CLB-Max | USB | Number of CLBs | Number of Logic Cells | Number of Cores | GPIO | Number of Equivalent Gates | Flash Size | Product | Kit Contents | Product Category | Product Length | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2GL150TS-FC1152 Microchip | 2079 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | - | 1152 | M2GL150 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | M2GL150TS-FC1152 | - | - | 1.26 V | - | - | Microchip Technology | 1.14 V | - | - | - | - | 574 | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | Active | 20 | 5.27 | Non-Compliant | No | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | - | 5120000 | - | - | - | STD | - | - | - | - | - | - | - | - | 146124 | - | - | - | - | - | - | - | - | - | 35 mm | 35 mm | - | ||
M2S150-1FCSG536 Microchip | 2858 |
| - | - | - | - | 536-LFBGA, CSPBGA | YES | - | 536-CSPBGA (16x16) | - | 536 | M2S150 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | - | M2S150-1FCSG536 | 166 MHz | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 293 | 146124 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | - | - | Active | 40 | 5.77 | - | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 250 | - | compliant | - | S-PBGA-B536 | 293 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 293 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | - | - | - | 146124 | 1 Core | - | - | 512KB | - | - | - | - | - | - | - | - | ||
M2GL025TS-VF400 Microchip | 2378 |
| - | - | - | Surface Mount | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2GL025 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | M2GL025TS-VF400 | - | - | - | + 85 C | - | Microchip Technology | - | 0 C | - | - | SMD/SMT | 207 | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | - | Active | 20 | 5.27 | - | No | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | - | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | 207 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | - | 1130496 | - | - | - | - | 4 Transceiver | - | - | - | - | - | - | - | 27696 | - | - | - | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
AGLN060V5-ZCSG81I Microchip | In Stock | - | - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | 81 | AGLN060 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | AGLN060V5-ZCSG81I | - | - | - | - | - | Microchip Technology | - | - | - | - | - | 60 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81 | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | - | - | Obsolete | NOT SPECIFIED | 5.81 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO nano | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | - | - | 18432 | 60000 | - | - | - | - | - | - | - | - | - | - | 1536 | - | - | - | 60000 | - | - | - | - | - | - | 5 mm | 5 mm | - | ||
AGL1000V2-CSG281 Microchip | In Stock | - | - | - | - | Surface Mount | 281-TFBGA, CSBGA | YES | - | 281-CSP (10x10) | - | 281 | AGL1000 | - | - | 108 MHz | - | - | - | MICROSEMI CORP | - | - | - | - | AGL1000V2-CSG281 | - | - | 1.575 V | - | - | Microchip Technology | 1.14 V | - | - | 3 | - | 215 | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | - | Active | NOT SPECIFIED | 0.86 | - | Yes | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | 1.2, 1.5 V | - | 0 to 70 °C | - | IGLOO | - | 3A001.A.7.A | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | 281 | S-PBGA-B281 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | - | - | 147456 | 1000000 | - | - | STD | - | - | - | - | - | - | - | 24576 | - | - | - | 1000000 | - | - | - | - | - | - | 10 mm | 10 mm | - | ||
A3PE3000L-FG484I Microchip | 523 | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | Microchip Technology / Atmel | - | 250 MHz | - | 60 | - | MICROSEMI CORP | - | - | - | - | A3PE3000L-FG484I | - | 350 MHz | - | + 100 C | - | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | - | Active | 30 | 5.3 | N | No | FPGA ProASICu00ae3EL Family 3M Gates 781.25MHz 130nm Technology 1.2V 484-Pin FBGA Tray | - | 1.575 V | 1.14 V | 1.2 V | - | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000L | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | - | - | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | S-PBGA-B484 | 341 | Not Qualified | 1.425 V to 1.575 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | - | 63 kB | - | - | - | - | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | - | 516096 | 3000000 | 781.25 MHz | - | STD | - | - | - | - | 75264 | - | - | 75264 | 75264 | - | - | 3000000 | - | - | - | FPGA - Field Programmable Gate Array | - | 1.73 mm | 23 mm | 23 mm | No | ||
AGL1000V2-FG484I Microchip | In Stock | - | - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | AGL1000 | - | - | 108 MHz | - | - | - | MICROSEMI CORP | - | - | - | - | AGL1000V2-FG484I | - | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 300 | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | - | Active | 30 | 5.26 | - | No | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 85°C (TA) | - | IGLOO | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | - | - | 147456 | 1000000 | - | - | STD | - | - | - | - | - | - | - | 24576 | - | - | - | 1000000 | - | - | - | - | - | - | 23 mm | 23 mm | - | ||
A3PE3000L-FG896M Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | - | - | 250 MHz | - | - | - | MICROSEMI CORP | - | - | - | - | A3PE3000L-FG896M | - | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 620 | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | - | Active | 30 | 5.29 | Compliant | No | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | -55°C ~ 125°C (TJ) | - | ProASIC3L | e0 | 3A001.A.2.C | - | - | - | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | - | 8542.39.00.01 | - | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | - | 63 kB | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 516096 | 3e+06 | - | - | - | - | - | - | - | 75264 | - | - | 75264 | 75264 | - | - | 3000000 | - | - | - | - | - | - | 31 mm | 31 mm | No | ||
A3PE600-FGG256I Microchip | In Stock | - | - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | 256 | A3PE600 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | - | - | A3PE600-FGG256I | - | - | - | - | - | Microchip Technology | - | - | - | 3 | - | 165 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | - | Active | 40 | 1.6 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | ProASIC3E | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B256 | 165 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | - | - | STD | - | - | - | - | - | - | - | 13824 | 13824 | - | - | 600000 | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
AGLP060V2-CS201 Microchip | 6 |
| - | - | - | Surface Mount | 201-VFBGA, CSBGA | YES | - | 201-CSP (8x8) | - | 201 | AGLP060 | - | - | 160 MHz | - | - | - | MICROSEMI CORP | - | - | - | - | AGLP060V2-CS201 | - | - | 1.575 V | - | - | Microchip Technology | 1.14 V | - | - | - | - | 157 | - | 70 °C | - | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | - | Active | NOT SPECIFIED | 5.26 | - | No | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | 1.2, 1.5 V | - | 0 to 70 °C | - | IGLOO PLUS | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | 201 | S-PBGA-B201 | 157 | Not Qualified | - | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | 157 | 1584 CLBS, 60000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 1584 | - | - | 18432 | 60000 | - | - | STD | - | - | - | - | - | - | - | 1584 | 1584 | - | - | 60000 | - | - | - | - | - | - | 8 mm | 8 mm | - | ||
A1010B-1PL68I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 68 | - | - | - | 47.7 MHz | - | - | - | MICROSEMI CORP | - | - | - | - | A1010B-1PL68I | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | - | - | - | 5.84 | - | No | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | QUAD | J BEND | - | 1.27 mm | unknown | 68 | S-PQCC-J68 | 57 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | 57 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 547 | 295 | - | - | 2000 | - | - | - | - | - | - | 24.2316 mm | 24.2316 mm | - | ||
A3PN125-Z1VQG100 Microchip | In Stock | - | - | - | - | Surface Mount | 100-TQFP | YES | - | 100-VQFP (14x14) | - | 100 | A3PN125 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | A3PN125-Z1VQG100 | - | - | - | - | - | Microchip Technology | - | - | - | - | - | 71 | - | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | - | - | Obsolete | 40 | 5.83 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -20°C ~ 85°C (TJ) | - | ProASIC3 nano | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | S-PQFP-G100 | 71 | Not Qualified | - | 1.5,1.5/3.3 V | OTHER | - | - | - | - | - | - | - | - | - | - | 71 | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 36864 | 125000 | - | - | - | - | - | - | - | - | - | - | 3072 | 3072 | - | - | 125000 | - | - | - | - | - | - | 14 mm | 14 mm | - | ||
A3PE1500-2FGG676I Microchip | 2305 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | Microchip Technology / Atmel | - | - | - | 40 | - | MICROSEMI CORP | - | - | - | - | A3PE1500-2FGG676I | - | 310 MHz | 1.575 V | + 100 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 444 | 16000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | - | SQUARE | GRID ARRAY | Active | - | - | Active | 40 | 5.3 | Compliant | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | Programmable Logic ICs | - | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B676 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | 33.8 kB | - | - | - | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | - | 276480 | 1.5e+06 | 310 MHz | - | 2 | - | - | - | - | 38400 | - | - | 38400 | - | - | - | 1500000 | - | - | - | FPGA - Field Programmable Gate Array | - | 1.73 mm | 27 mm | 27 mm | No | ||
A54SX32A-1FGG144I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 144 | - | - | - | 278 MHz | - | - | - | MICROSEMI CORP | - | - | - | - | A54SX32A-1FGG144I | - | - | - | - | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | - | - | 40 | 5.32 | - | Yes | - | - | 2.75 V | 2.25 V | 2.5 V | - | - | - | - | - | - | - | e1 | - | - | - | - | TIN SILVER COPPER | - | - | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B144 | 111 | Not Qualified | - | 2.5,2.5/5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | 111 | 2880 CLBS, 48000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.1 ns | - | 2880 | 2880 | - | - | 48000 | - | - | - | - | - | - | 13 mm | 13 mm | - | ||
AGLN020V2-UCG81I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 81 | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | AGLN020V2-UCG81I | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | - | - | - | NOT SPECIFIED | 8.05 | - | Yes | - | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | - | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | 520 CLBS, 20000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 520 | - | - | - | 20000 | - | - | - | - | - | - | 4 mm | 4 mm | - | ||
M2GL100T-1FC1152I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 1152 | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | M2GL100T-1FC1152I | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | PLASTIC | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | 5.88 | - | No | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | BOTTOM | BALL | - | 1 mm | unknown | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | 574 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 99512 | - | - | - | - | - | - | - | - | - | - | - | - | ||
M2GL025S-1FG484I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | - | - | - | 484 | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | M2GL025S-1FG484I | - | - | - | - | - | - | - | - | - | - | - | 267 | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | - | - | - | 5.3 | Non-Compliant | No | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | - | - | - | - | BOTTOM | BALL | - | 1 mm | unknown | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | 138 kB | - | - | - | - | - | - | 267 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 27696 | - | - | - | - | - | - | - | - | - | - | - | - | ||
MPF300-SPLASH-KIT Microchip | 768 | - | - | - | - | - | - | - | - | - | - | - | MPF300 | Microchip Technology | Programmable Logic Tools | - | - | 1 | MPF300 | - | FMC LPC/JTAG/SPI/UART/USB | - | - | Microchip | - | - | - | - | - | DDR4 | Knowles Syfer | - | - | - | - | - | - | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | - | - | PCIex4 | Active | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | MPF300T-1FCG484E | - | - | - | - | - | * | - | - | - | Evaluation Kit | - | - | - | - | - | - | Development Tools | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Programmable Logic IC Development Tools | FPGA | - | - | - | Board(s) | - | - | - | - | Yes | - | - | 1 USB2.0 | - | - | - | No | - | - | Evaluation Kits | PolarFire Splash Kit Brd MPF300TS-1FCG484EES, Adapter, 1Year S/W License, USB Cable, Quickstart Card | Programmable Logic IC Development Tools | - | - | - | - | - | ||
CORE429-SA Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | CORE429 | Microchip Technology | - | - | - | 1 | Core429 | - | - | - | - | Microchip | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | - | - | - | Actel | - | - | - | - | Fusion® | - | - | - | FPGA | - | - | - | - | - | - | Embedded Solutions | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Development Software | - | - | - | - | Board(s) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Development Software | - | - | - | - | - | ||
CORE1553-SA Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Core1553 | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 25.0000 ppm/°C | FPGA | 41.2 kOhm | - | - | - | - | - | - | 0.1 W | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s) | - | - | 0.1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 7.06 | - | - | - | - |