- Mfr
- Package
- Product Status
- Series
- Factory Pack QuantityFactory Pack Quantity
- Mounting Type
- Operating Temperature
- Package / Case
- Supplier Device Package
- Tolerance
- Voltage - Zener (Nom) (Vz)
- Power - Max
Attribute column
Manufacturer
Microchip Diodes - Zener - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Diode Element Material | Number of Terminals | Base Product Number | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Impedance (Max) (Zzt) | Ir - Maximum Reverse Leakage Current | Ir - Reverse Current | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Pd - Power Dissipation | Power Dissipation (Max) | Product Status | Reference Voltage-Nom | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Unit Weight | Voltage Temperature Coefficient | Vz - Zener Voltage | Zz - Zener Impedance | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Polarity | Configuration | Impedance | Element Configuration | Diode Type | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Case Connection | Power - Max | Max Reverse Leakage Current | Test Current | Voltage - Zener (Nom) (Vz) | Zener Voltage | Voltage Tol-Max | JEDEC-95 Code | Working Test Current | Voltage Tolerance | Zener Current | Dynamic Impedance-Max | Vf - Forward Voltage | Diameter | Height | Length | Width | Radiation Hardening |
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![]() 1N5355CE3/TR12 Microchip Technology | In Stock | - | - | - | - | Through Hole | T-18-2 | - | - | T-18 | - | - | 1N5355 | 3000 | MICROSEMI CORP | 2.5 Ohms | 0.5 uA | - | 1N5355CE3/TR12 | + 150 C | Microchip Technology | - 65 C | - | Through Hole | - | - | - | Tape & Reel (TR) | - | - | - | - | Active | - | 5 W | - | Active | - | NOT SPECIFIED | 5.78 | Details | Yes | 0.038801 oz | - | 18 V | 2.5 Ohms | -65°C ~ 150°C | Reel | - | ±2% | e3 | Yes | - | Matte Tin (Sn) | - | - | - | - | - | - | - | NOT SPECIFIED | compliant | - | - | - | - | Single | - | - | ZENER DIODE | 500 nA @ 13 V | 1.2 V @ 1 A | - | 5 W | - | 65 mA | 18 V | - | - | - | - | 2 % | 0.5 uA | - | - | - | - | - | - | - | ||
![]() 1N3998A Microchip Technology | 103 |
| - | - | - | Chassis Mount | DO-41-2 | NO | - | DO-213AA (DO-4) | SILICON | 1 | 1N3998 | 1 | MICROSEMI CORP | 1.1 Ohms | 10 uA | 10 uA | 1N3998A | + 175 C | Microchip Technology | - 65 C | - | Through Hole | 1 | 175 °C | -65 °C | Bulk | METAL | O-MUPM-D1 | ROUND | POST/STUD MOUNT | Active | DO-4 | 10 W | 10 W | Active | 6.2 V | NOT SPECIFIED | 1.76 | N | No | 0.010935 oz | 0.045 %/C | 6.2 V | 1.1 Ohms | -65°C ~ 175°C | Tray | - | ±5% | e0 | No | EAR99 | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | - | - | 8541.10.00.50 | - | ZENER | UPPER | SOLDER LUG | NOT SPECIFIED | compliant | 1 | O-MUPM-D1 | Not Qualified | UNIDIRECTIONAL | Single | - | - | ZENER DIODE | 10 µA @ 2 V | 1.5 V @ 2 A | CATHODE | 10 W | - | 405 mA | 6.2 V | - | 5% | DO-203AA | 405 mA | 5 % | 1520 mA | 1.1 Ω | 1.5 V | - | 20.32 mm | - | 11.1 mm | - | ||
![]() 1N5355BE3/TR8 Microchip Technology | In Stock | - | - | - | - | Through Hole | T-18-2 | NO | - | T-18 | SILICON | 2 | 1N5355 | 1000 | MICROSEMI CORP | 2.5 Ohms | 0.5 uA | - | 1N5355BE3/TR8 | + 150 C | Microchip Technology | - 65 C | 1 | Through Hole | 1 | - | - | Tape & Reel (TR) | PLASTIC/EPOXY | O-PALF-W2 | ROUND | LONG FORM | Active | - | 5 W | 5 W | Active | 18 V | NOT SPECIFIED | 5.06 | Details | Yes | 0.038801 oz | - | 18 V | 2.5 Ohms | -65°C ~ 150°C | Reel | - | ±5% | e3 | Yes | EAR99 | PURE MATTE TIN | - | - | 8541.10.00.50 | - | ZENER | AXIAL | WIRE | NOT SPECIFIED | compliant | 2 | O-PALF-W2 | - | UNIDIRECTIONAL | Single | - | - | ZENER DIODE | 500 nA @ 13 V | 1.2 V @ 1 A | ISOLATED | 5 W | - | 65 mA | 18 V | - | 5% | - | 65 mA | 5 % | 0.5 uA | - | - | - | - | - | - | - | ||
![]() 1N4734AP/TR8 Microchip Technology | 16 |
| - | - | - | Through Hole | DO-41-2 | - | - | DO-204AL (DO-41) | - | - | 1N4734 | 1500 | MICROSEMI CORP | 5 Ohms | - | - | 1N4734AP/TR8 | - | Microchip Technology | - | - | Through Hole | - | - | - | Tape & Reel (TR) | - | - | - | - | Active | - | - | - | Active | - | - | 5.83 | N | No | 0.010935 oz | - | - | - | -65°C ~ 150°C | Reel | - | ±5% | - | - | EAR99 | - | - | - | 8541.10.00.50 | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | 10 µA @ 2 V | 1.2 V @ 200 mA | - | 1 W | - | - | 5.6 V | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() 1N5371BE3/TR8 Microchip Technology | In Stock | - | - | Production (Last Updated: 1 month ago) | Through Hole | Through Hole | T-18-2 | - | 2 | T-18 | - | - | 1N5371 | 1000 | - | 40 Ohms | 0.5 uA | - | - | + 150 C | Microchip Technology | - 65 C | - | Through Hole | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | 5 W | - | Active | - | - | - | Details | - | 0.038801 oz | - | 60 V | 40 Ohms | -65°C ~ 150°C | Reel | - | 5 % | - | - | - | - | 150 °C | -65 °C | - | 5 W | - | - | - | - | - | - | - | - | - | Single | 40 Ω | Single | - | 500 nA @ 43 V | 1.2 V @ 1 A | - | 5 W | 500 nA | 20 mA | 60 V | 60 V | - | - | - | 5 % | 0.5 uA | - | - | - | - | - | - | No | ||
![]() 1N5368B/TR12 Microchip Technology | In Stock | - | - | - | - | Through Hole | T-18-2 | - | - | T-18 | - | - | 1N5368 | 3000 | - | 25 Ohms | 0.5 uA | - | - | + 150 C | Microchip Technology | - 65 C | - | Through Hole | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | 5 W | - | Active | - | - | - | N | - | 0.038801 oz | - | 47 V | 25 Ohms | -65°C ~ 150°C | Reel | - | ±5% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | 500 nA @ 33.8 V | 1.2 V @ 1 A | - | 5 W | - | 25 mA | 47 V | - | - | - | - | 5 % | 0.5 uA | - | - | - | - | - | - | - | ||
![]() 1N4760E3/TR13 Microchip Technology | In Stock | - | - | - | - | Through Hole | DO-41-2 | - | - | DO-204AL (DO-41) | - | - | 1N4760 | 5000 | - | 150 Ohms | 5 uA | 5 uA | - | + 150 C | Microchip Technology | - 65 C | - | Axial | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | 1 W | - | Active | - | - | - | Details | - | 0.010935 oz | - | 68 V | 150 Ohms | -65°C ~ 150°C | Reel | - | ±10% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | 5 µA @ 51.7 V | 1.2 V @ 200 mA | - | 1 W | - | 3.7 mA | 68 V | - | - | - | - | 10 % | 13 mA | - | 1.2 V | 2.718 mm | - | 5.207 mm | - | - | ||
![]() 1N4741AP/TR12 Microchip Technology | 16 |
| - | Production (Last Updated: 2 months ago) | Through Hole | Through Hole | DO-41-2 | - | 2 | DO-204AL (DO-41) | - | - | 1N4741 | 4000 | MICROSEMI CORP | 8 Ohms | 5 uA | 5 uA | 1N4741AP/TR12 | + 150 C | Microchip Technology | - 65 C | - | Axial | - | - | - | Tape & Reel (TR);Cut Tape (CT); | - | - | - | - | Active | - | 1 W | - | Active | - | - | 5.83 | N | No | 0.010935 oz | - | 11 V | 8 Ohms | -65°C ~ 150°C | Reel | - | ±5% | - | - | EAR99 | - | 150 °C | -65 °C | 8541.10.00.50 | 1 W | - | - | - | - | unknown | - | - | - | - | Single | 8 Ω | Single | - | 5 µA @ 8.4 V | 1.2 V @ 200 mA | - | 1 W | 5 µA | 23 mA | 11 V | 11 V | - | - | - | 5 % | 83 mA | - | 1.2 V | 2.718 mm | - | 5.207 mm | - | No | ||
![]() 1N4739APE3/TR12 Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | Through Hole | Through Hole | DO-41-2 | - | 2 | DO-204AL (DO-41) | - | - | 1N4739 | 4000 | MICROSEMI CORP | 5 Ohms | 10 uA | 10 uA | 1N4739APE3/TR12 | + 150 C | Microchip Technology | - 65 C | - | Axial | - | - | - | Tape & Reel (TR) | - | - | - | - | Active | - | 1 W | - | Active | - | - | 5.78 | Details | Yes | 0.010935 oz | - | 9.1 V | 5 Ohms | -65°C ~ 150°C | Reel | - | ±5% | - | - | EAR99 | - | 150 °C | -65 °C | 8541.10.00.50 | 1 W | - | - | - | - | compliant | - | - | - | - | Single | 5 Ω | Single | - | 10 µA @ 7 V | 1.2 V @ 200 mA | - | 1 W | 10 µA | 28 mA | 9.1 V | 9.1 V | - | - | - | 5 % | 100 mA | - | 1.2 V | 2.718 mm | - | 5.207 mm | - | No | ||
![]() 1N5998UR-1 Microchip Technology | 16 |
| - | - | - | - | DO-213AA-2 | - | - | - | - | - | 1N5998 | 1 | - | - | - | - | - | - | Microchip Technology | - | - | SMD/SMT | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.001411 oz | - | - | - | - | Bulk | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() 1N5996UR-1 Microchip Technology | 16 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | - | DO-213AA-2 | - | 2 | - | - | - | 1N5996 | 1 | - | - | - | - | - | - | Microchip Technology | - | - | SMD/SMT | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.001411 oz | - | - | - | - | Bulk | * | - | - | - | - | - | 175 °C | -65 °C | - | 500 mW | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | - | - | 2 µA | - | - | 6.8 V | - | - | - | - | - | - | - | - | - | - | - | Yes | ||
![]() 1N5346AE3/TR13 Microchip Technology | In Stock | - | - | - | Through Hole | Through Hole | T-18-2 | NO | - | T-18 | SILICON | 2 | 1N5346 | 1250 | MICROSEMI CORP | 2 Ohms | 7.5 uA | - | 1N5346AE3/TR13 | + 150 C | Microchip Technology | - 65 C | - | Through Hole | 1 | 150 °C | -65 °C | Tape & Reel (TR) | PLASTIC/EPOXY | O-PALF-W2 | ROUND | LONG FORM | Active | - | 5 W | 5 W | Active | 9.1 V | NOT SPECIFIED | 5.17 | Details | Yes | 0.038801 oz | - | 9.1 V | 2 Ohms | -65°C ~ 150°C | Reel | - | ±10% | - | - | EAR99 | - | 150 °C | -65 °C | 8541.10.00.50 | 5 W | ZENER | AXIAL | WIRE | NOT SPECIFIED | compliant | - | O-PALF-W2 | - | UNIDIRECTIONAL | Single | 2 Ω | - | ZENER DIODE | 7.5 µA @ 6.6 V | 1.2 V @ 1 A | ISOLATED | 5 W | - | 150 mA | 9.1 V | 9.1 V | 10% | DO-201AE | 150 mA | 10 % | 7.5 uA | - | - | - | - | - | - | No | ||
![]() 1N4742APE3/TR12 Microchip Technology | 16 |
| - | - | - | Through Hole | DO-41-2 | - | - | DO-204AL (DO-41) | - | - | 1N4742 | 4000 | MICROSEMI CORP | 9 Ohms | 5 uA | 5 uA | 1N4742APE3/TR12 | + 150 C | Microchip Technology | - 65 C | - | Axial | - | - | - | Tape & Reel (TR) | - | - | - | - | Active | - | 1 W | - | Active | - | - | 5.78 | Details | Yes | 0.010935 oz | - | 12 V | 9 Ohms | -65°C ~ 150°C | Reel | - | ±5% | - | - | EAR99 | - | - | - | 8541.10.00.50 | - | - | - | - | - | compliant | - | - | - | - | Single | - | - | - | 5 µA @ 9.1 V | 1.2 V @ 200 mA | - | 1 W | - | 21 mA | 12 V | - | - | - | - | 5 % | 76 mA | - | 1.2 V | 2.718 mm | - | 5.207 mm | - | - | ||
![]() 1N5346AE3/TR12 Microchip Technology | In Stock | - | - | - | - | Through Hole | T-18-2 | - | - | T-18 | - | - | 1N5346 | 3000 | MICROSEMI CORP | 2 Ohms | 7.5 uA | - | 1N5346AE3/TR12 | + 150 C | Microchip Technology | - 65 C | - | Through Hole | - | - | - | Tape & Reel (TR) | - | - | - | - | Active | - | 5 W | - | Active | - | NOT SPECIFIED | 5.78 | Details | Yes | 0.038801 oz | - | 9.1 V | 2 Ohms | -65°C ~ 150°C | Reel | - | ±10% | e3 | Yes | - | Matte Tin (Sn) | - | - | - | - | - | - | - | NOT SPECIFIED | compliant | - | - | - | - | Single | - | - | ZENER DIODE | 7.5 µA @ 6.6 V | 1.2 V @ 1 A | - | 5 W | - | 150 mA | 9.1 V | - | - | - | - | 10 % | 7.5 uA | - | - | - | - | - | - | - | ||
![]() 1N5265BUR-1 Microchip Technology | 16 |
| - | - | - | Surface Mount | DO-213AB-2 | YES | - | DO-213AA | SILICON | 2 | 1N5265 | 1 | MICROSEMI CORP | 185 Ohms | 0.1 uA | - | 1N5265BUR-1 | + 175 C | Microchip Technology | - 65 C | 1 | SMD/SMT | 1 | 175 °C | - | Bulk | GLASS | HERMETIC SEALED, GLASS, MLL34, MELF-2 | ROUND | LONG FORM | Active | DO-213AA | 500 mW | 0.5 W | Active | 62 V | NOT SPECIFIED | 5.08 | N | No | 0.001411 oz | 0.097 %/C | 62 V | 185 Ohms | -65°C ~ 175°C (TJ) | Bulk | - | ±5% | e0 | No | EAR99 | TIN LEAD | - | - | 8541.10.00.50 | - | ZENER | END | WRAP AROUND | NOT SPECIFIED | unknown | 2 | O-LELF-R2 | Not Qualified | UNIDIRECTIONAL | Single | - | - | ZENER DIODE | 100 nA @ 47 V | 1.1 V @ 200 mA | ISOLATED | 500 mW | - | 2 mA | 62 V | - | 5% | DO-213AA | 2 mA | 5 % | 0.1 uA | 185 Ω | 1.1 V | - | - | - | - | - | ||
![]() 1N5277BUR-1 Microchip Technology | In Stock | - | - | - | - | Surface Mount | DO-213AB-2 | - | - | DO-213AA | - | - | 1N5277 | 1 | - | 1700 Ohms | 0.1 uA | - | - | + 175 C | Microchip Technology | - 65 C | - | SMD/SMT | - | - | - | Bulk | - | - | - | - | - | - | 500 mW | - | Active | - | - | - | N | - | 0.001411 oz | 0.11 %/C | 160 V | 1700 Ohms | -65°C ~ 175°C (TJ) | Bulk | - | ±5% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | 100 nA @ 122 V | 1.1 V @ 200 mA | - | 500 mW | - | 0.8 mA | 160 V | - | - | - | - | 5 % | 0.1 uA | - | 1.1 V | - | - | - | - | - | ||
![]() 1N5355CE3/TR13 Microchip Technology | In Stock | - | - | - | - | Through Hole | T-18-2 | - | - | T-18 | - | - | 1N5355 | 1250 | MICROSEMI CORP | 2.5 Ohms | 0.5 uA | - | 1N5355CE3/TR13 | + 150 C | Microchip Technology | - 65 C | - | Through Hole | - | - | - | Tape & Reel (TR) | - | - | - | - | Active | - | 5 W | - | Active | - | NOT SPECIFIED | 5.08 | Details | Yes | 0.038801 oz | - | 18 V | 2.5 Ohms | -65°C ~ 150°C | Reel | - | ±2% | - | - | EAR99 | - | - | - | 8541.10.00.50 | - | - | - | - | NOT SPECIFIED | compliant | - | - | - | - | Single | - | - | ZENER DIODE | 500 nA @ 13 V | 1.2 V @ 1 A | - | 5 W | - | 65 mA | 18 V | - | - | - | - | 2 % | 0.5 uA | - | - | - | - | - | - | - | ||
![]() 1N5357B/TR8 Microchip Technology | In Stock | - | - | - | - | Through Hole | T-18-2 | NO | - | T-18 | SILICON | 2 | 1N5357 | 1000 | MICROSEMI CORP | 3 Ohms | 0.5 uA | - | 1N5357B/TR8 | + 150 C | Microchip Technology | - 65 C | 1 | Through Hole | 1 | - | - | Tape & Reel (TR) | PLASTIC/EPOXY | O-PALF-W2 | ROUND | LONG FORM | Active | - | 5 W | 5 W | Active | 20 V | NOT SPECIFIED | 5.07 | N | No | 0.038801 oz | - | 20 V | 3 Ohms | -65°C ~ 150°C | Reel | - | ±5% | e0 | No | EAR99 | TIN LEAD | - | - | 8541.10.00.50 | - | ZENER | AXIAL | WIRE | NOT SPECIFIED | compliant | 2 | O-PALF-W2 | - | UNIDIRECTIONAL | Single | - | - | ZENER DIODE | 500 nA @ 14.4 V | 1.2 V @ 1 A | ISOLATED | 5 W | - | 65 mA | 20 V | - | 5% | - | 65 mA | 5 % | 0.5 uA | - | - | - | - | - | - | - | ||
![]() 1N5267BUR-1 Microchip Technology | 16 |
| - | - | - | Surface Mount | DO-213AB-2 | - | - | DO-213AA | - | - | 1N5267 | 1 | - | 270 Ohms | 0.1 uA | - | - | + 175 C | Microchip Technology | - 65 C | - | SMD/SMT | - | - | - | Bulk | - | - | - | - | - | - | 500 mW | - | Active | - | - | - | N | - | 0.001411 oz | 0.098 %/C | 75 V | 270 Ohms | -65°C ~ 175°C (TJ) | Bulk | - | ±5% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | 100 nA @ 56 V | 1.1 V @ 200 mA | - | 500 mW | - | 1.7 mA | 75 V | - | - | - | - | 5 % | 0.1 uA | - | 1.1 V | - | - | - | - | - | ||
![]() 1N5247BUR-1 Microchip Technology | 25 |
| - | - | - | Surface Mount | DO-213AB-2 | - | - | DO-213AA | - | - | 1N5247 | 1 | - | 19 Ohms | 0.1 uA | - | - | + 175 C | Microchip Technology | - 65 C | - | SMD/SMT | - | - | - | Bulk | - | - | - | - | - | - | 500 mW | - | Active | - | - | - | N | - | 0.001411 oz | 0.084 %/C | 17 V | 19 Ohms | -65°C ~ 175°C (TJ) | Bulk | - | ±5% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | 100 nA @ 13 V | 1.1 V @ 200 mA | - | 500 mW | - | 7.4 mA | 17 V | - | - | - | - | 5 % | 0.1 uA | - | 1.1 V | - | - | - | - | - |