- Mfr
- Package
- Product Status
- Series
- Factory Pack QuantityFactory Pack Quantity
- Mounting Type
- Operating Temperature
- Package / Case
- Supplier Device Package
- Tolerance
- Voltage - Zener (Nom) (Vz)
- Power - Max
Attribute column
Manufacturer
Microchip Diodes - Zener - Single
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Diode Element Material | Number of Terminals | Base Product Number | Factory Pack QuantityFactory Pack Quantity | If - Forward Current | Ihs Manufacturer | Impedance (Max) (Zzt) | Ir - Maximum Reverse Leakage Current | Ir - Reverse Current | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of Elements | Operating Temperature-Max | Package | Package Body Material | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Pd - Power Dissipation | Power Dissipation (Max) | Product Status | Reference Voltage-Nom | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Unit Weight | Voltage Temperature Coefficient | Vz - Zener Voltage | Zz - Zener Impedance | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Pbfree Code | ECCN Code | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Additional Feature | HTS Code | Subcategory | Power Rating | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Pin Count | Termination Style | JESD-30 Code | Qualification Status | Polarity | Configuration | Impedance | Element Configuration | Diode Type | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Case Connection | Power - Max | Max Reverse Leakage Current | Test Current | Voltage - Zener (Nom) (Vz) | Zener Voltage | Voltage Tol-Max | JEDEC-95 Code | Working Test Current | Voltage Tolerance | Zener Current | Vf - Forward Voltage | Diameter | Height | Length | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 1N7053UR-1 Microchip Technology | In Stock | - | - | - | - | Surface Mount | DO-213-2 | - | - | DO-213AB (MELF, LL41) | - | - | 1N7053 | 1 | - | - | 35 Ohms | - | - | - | - | - | Microchip Technology | - | - | SMD/SMT | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.006808 oz | - | - | - | - | Bulk | - | ±10% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 250 mW | - | - | 4.8 V | - | - | - | - | - | - | - | - | - | - | - | ||
CDLL3045 Microchip Technology | 7 |
| - | - | - | Surface Mount | DO-213AB-2 | - | - | DO-213AB | - | - | CDLL3045 | 1 | - | - | 450 Ohms | - | - | - | - | - | Microchip Technology | - | - | SMD/SMT | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.004021 oz | - | - | - | -55°C ~ 175°C | Bulk | - | ±20% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SMD/SMT | - | - | - | - | - | - | - | 500 nA @ 83.6 V | 1.2 V @ 200 mA | - | 1 W | - | - | 110 V | - | - | - | - | - | - | - | 2.66 mm | - | 5.2 mm | - | ||
CDLL5948C Microchip Technology | 7 |
| - | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | DO-213AB-2 | - | - | DO-213AB | - | - | CDLL5948 | 1 | - | - | 200 Ohms | - | - | - | - | - | Microchip Technology | - | - | SMD/SMT | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.001764 oz | - | - | - | -65°C ~ 175°C | Bulk | - | 2 % | - | - | - | - | - | 175 °C | -65 °C | - | - | - | - | - | 1.25 W | - | - | - | - | - | - | SMD/SMT | - | - | - | - | 200 Ω | Single | - | 1 µA @ 69.2 V | 1.2 V @ 200 mA | - | 1.25 W | 1 µA | - | 91 V | 91 V | - | - | - | - | - | - | 2.67 mm | - | 5.21 mm | Yes | ||
1N5738D Microchip Technology | In Stock | - | - | - | - | Through Hole | DO-35-2 | - | - | DO-35 | - | - | 1N5738 | 1 | - | - | 25 Ohms | - | - | - | - | - | Microchip Technology | - | - | Through Hole | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.005291 oz | - | - | - | -65°C ~ 175°C | Bulk | - | ±1% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100 nA @ 8 V | 900 mV @ 10 mA | - | 500 mW | - | - | 12 V | - | - | - | - | - | - | - | - | - | - | - | ||
1N6029B Microchip Technology | 40 |
| - | Production (Last Updated: 2 months ago) | - | Through Hole | DO-35-2 | - | - | DO-35 | - | - | 1N6029 | 1 | - | - | 1400 Ohms | - | - | - | - | - | Microchip Technology | - | - | Through Hole | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.005291 oz | - | - | - | -65°C ~ 175°C | Bulk | - | ±5% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100 nA @ 122 V | 1.1 V @ 200 mA | - | 500 mW | - | - | 160 V | - | - | - | - | - | - | - | - | - | - | - | ||
1N5943APE3/TR12 Microchip Technology | In Stock | - | - | - | - | Through Hole | DO-41-2 | - | - | DO-204AL (DO-41) | - | - | 1N5943 | 4000 | - | MICROSEMI CORP | 86 Ohms | - | - | - | 1N5943APE3/TR12 | - | Microchip Technology | - | 1 | Through Hole | - | - | Tape & Reel (TR) | - | - | - | - | Active | - | - | - | Active | - | NOT SPECIFIED | 5.78 | Details | Yes | 0.010935 oz | - | - | - | -65°C ~ 150°C | Reel | - | ±10% | e3 | Yes | - | - | Matte Tin (Sn) | - | - | - | - | - | - | - | - | - | - | - | NOT SPECIFIED | compliant | - | - | - | - | - | - | - | - | ZENER DIODE | 1 µA @ 42.6 V | 1.2 V @ 200 mA | - | 1.5 W | - | - | 56 V | - | - | - | - | - | - | - | - | - | - | - | ||
1N5991B Microchip Technology | 7 |
| - | - | - | Through Hole | DO-35-2 | - | - | DO-35 | - | - | 1N5991 | 1 | - | - | 88 Ohms | - | - | - | - | + 175 C | Microchip Technology | - 65 C | - | Through Hole | - | - | Bulk | - | - | - | - | - | - | 0.5 W | - | Active | - | - | - | N | - | 0.005291 oz | - 0.01 %/C | 4.3 V | 88 Ohms | -65°C ~ 175°C | Bulk | - | ±5% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | 5 µA @ 1 V | 1.1 V @ 200 mA | - | 500 mW | - | 5 mA | 4.3 V | - | - | - | - | 5 % | 116 mA | - | - | - | - | - | ||
1N5737D Microchip Technology | 7 |
| - | - | - | Through Hole | DO-35-2 | - | - | DO-35 | - | - | 1N5737 | 1 | - | - | 20 Ohms | - | - | - | - | - | Microchip Technology | - | - | Through Hole | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.005291 oz | - | - | - | -65°C ~ 175°C | Bulk | - | ±1% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100 nA @ 8 V | 900 mV @ 10 mA | - | 500 mW | - | - | 11 V | - | - | - | - | - | - | - | - | - | - | - | ||
1N5999D Microchip Technology | 40 |
| - | Production (Last Updated: 2 months ago) | Through Hole | Through Hole | DO-35-2 | - | 2 | DO-35 | - | - | 1N5999 | 1 | - | - | 10 Ohms | - | - | - | - | - | Microchip Technology | - | - | Through Hole | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.005291 oz | - | - | - | -65°C ~ 175°C | Bulk | - | ±1% | - | - | - | - | - | 175 °C | -65 °C | - | - | - | - | - | 500 mW | - | - | - | - | - | - | - | - | - | - | - | 10 Ω | Single | - | 100 nA @ 7 V | 1.1 V @ 200 mA | - | 500 mW | 100 nA | - | 9.1 V | 9.1 V | - | - | - | - | - | - | - | - | - | Yes | ||
1N6006C Microchip Technology | 40 |
| - | - | - | Through Hole | DO-35-2 | - | - | DO-35 | - | - | 1N6006 | 1 | - | - | 42 Ohms | - | - | - | - | - | Microchip Technology | - | - | Through Hole | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.005291 oz | - | - | - | -65°C ~ 175°C | Bulk | - | ±2% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100 nA @ 14 V | 1.1 V @ 200 mA | - | 500 mW | - | - | 18 V | - | - | - | - | - | - | - | - | - | - | - | ||
1N6010UR-1 Microchip Technology | 7 |
| - | - | - | - | DO-213AA-2 | YES | - | - | SILICON | 2 | 1N6010 | 1 | - | MICROSEMI CORP | - | - | - | - | 1N6010UR-1 | - | Microchip Technology | - | 1 | SMD/SMT | 1 | - | Bulk | GLASS | HERMETIC SEALED, GLASS, SOD-80, MELF-2 | ROUND | LONG FORM | Active | DO-213AA | - | 0.5 W | Active | 27 V | NOT SPECIFIED | 5.03 | N | No | 0.001411 oz | - | - | - | - | Bulk | * | - | e0 | No | EAR99 | - | TIN LEAD | - | - | - | - | 8541.10.00.50 | - | - | - | ZENER | END | WRAP AROUND | NOT SPECIFIED | unknown | 2 | - | O-LELF-R2 | Not Qualified | UNIDIRECTIONAL | SINGLE | - | - | ZENER DIODE | - | - | ISOLATED | - | - | - | - | - | 20% | DO-213AA | 5 mA | - | - | - | - | - | - | - | ||
1N6010UR Microchip Technology | 7 |
| - | - | - | - | DO-213AA-2 | YES | - | - | SILICON | 2 | 1N6010 | 1 | - | MICROSEMI CORP | - | - | - | - | 1N6010UR | - | Microchip Technology | - | 1 | SMD/SMT | 1 | - | Bulk | GLASS | HERMETIC SEALED, GLASS, MLL34, MELF-2 | ROUND | LONG FORM | Active | DO-213AA | - | 0.5 W | Active | 27 V | NOT SPECIFIED | 5.03 | N | No | 0.001411 oz | - | - | - | - | Bulk | * | - | e0 | No | EAR99 | - | TIN LEAD | - | - | - | METALLURGICALLY BONDED | 8541.10.00.50 | - | - | - | ZENER | END | WRAP AROUND | NOT SPECIFIED | unknown | 2 | - | O-LELF-R2 | Not Qualified | UNIDIRECTIONAL | SINGLE | - | - | ZENER DIODE | - | - | ISOLATED | - | - | - | - | - | 20% | DO-213AA | 5 mA | - | - | - | - | - | - | - | ||
1N5752D Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | Through Hole | Through Hole | DO-35-2 | - | 2 | DO-35 | - | - | 1N5752 | 1 | - | - | 170 Ohms | - | - | - | - | - | Microchip Technology | - | - | Through Hole | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.005291 oz | - | - | - | -65°C ~ 175°C | Bulk | - | ±1% | - | - | - | - | - | 175 °C | -65 °C | - | - | - | - | - | 500 mW | - | - | - | - | - | - | - | - | - | - | - | 170 Ω | Single | - | 100 nA @ 33 V | 900 mV @ 10 mA | - | 500 mW | 100 nA | - | 47 V | 47 V | - | - | - | - | - | - | - | - | - | Yes | ||
1N708A Microchip Technology | In Stock | - | - | - | - | Through Hole | DO-35-2 | NO | - | DO-35 | SILICON | 2 | 1N708 | 1 | - | MICROSEMI CORP | 3.6 Ohms | - | - | - | 1N708A | - | Microchip Technology | - | - | Through Hole | 1 | - | Bulk | UNSPECIFIED | O-XALF-W2 | ROUND | LONG FORM | Active | DO-35 | - | 0.25 W | Active | 5.6 V | NOT SPECIFIED | 5.62 | N | No | 0.005291 oz | - | - | - | - | Bulk | - | ±5% | e0 | No | EAR99 | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8541.10.00.50 | - | - | - | ZENER | AXIAL | WIRE | NOT SPECIFIED | not_compliant | 2 | - | O-XALF-W2 | Not Qualified | UNIDIRECTIONAL | SINGLE | - | - | ZENER DIODE | - | - | ISOLATED | 250 mW | - | - | 5.6 V | - | 5% | DO-35 | 25 mA | - | - | - | - | - | - | - | ||
CDLL981A Microchip Technology | In Stock | - | - | - | - | Surface Mount | DO-213AA-2 | - | - | DO-213AB | - | - | CDLL981 | 1 | - | - | 230 Ohms | - | - | - | - | - | Microchip Technology | - | - | SMD/SMT | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.001411 oz | - | - | - | -65°C ~ 175°C | Bulk | - | ±10% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SMD/SMT | - | - | - | - | - | - | - | 500 nA @ 52 V | 1.1 V @ 200 mA | - | 500 mW | - | - | 68 V | - | - | - | - | - | - | - | 1.7 mm | - | 3.7 mm | - | ||
CDLL3033A Microchip Technology | 40 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | DO-213AB-2 | - | - | DO-213AB | - | - | CDLL3033 | 1 | - | - | 50 Ohms | - | - | - | - | - | Microchip Technology | - | - | SMD/SMT | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | N | - | 0.004021 oz | - | - | - | -55°C ~ 175°C | Bulk | - | ±10% | - | - | - | - | - | 175 °C | -55 °C | - | - | - | - | - | 1 W | - | - | - | - | - | - | SMD/SMT | - | - | - | - | 50 Ω | Single | - | 500 nA @ 27.4 V | 1.2 V @ 200 mA | - | 1 W | 500 nA | - | 36 V | 36 V | - | - | - | - | - | - | 2.66 mm | - | 5.2 mm | No | ||
1N5922BPE3/TR8 Microchip Technology | In Stock | - | - | - | - | Through Hole | DO-41-2 | - | - | DO-204AL (DO-41) | - | - | 1N5922 | 1500 | - | - | 3 Ohms | - | - | - | - | - | Microchip Technology | - | - | Through Hole | - | - | Tape & Reel (TR) | - | - | - | - | - | - | - | - | Active | - | - | - | Details | - | 0.010935 oz | - | - | - | -65°C ~ 150°C | Reel | - | ±5% | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5 µA @ 6 V | 1.2 V @ 200 mA | - | 1.5 W | - | - | 7.5 V | - | - | - | - | - | - | - | - | - | - | - | ||
1N4753A/TR Microchip Technology | In Stock | - | - | - | - | - | DO-41-2 | - | - | - | - | - | - | 569 | 200 mA | - | - | 0.1 uA | 0.1 uA | - | - | + 175 C | - | - 65 C | - | Through Hole | - | - | - | - | - | - | - | - | - | 1 W | - | - | - | - | - | N | - | 0.010935 oz | - | 36 V | 50 Ohms | - | Reel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | - | - | - | - | - | 7 mA | - | - | - | - | - | 5 % | 0.1 uA | 1.2 V | 2.718 mm | - | 5.207 mm | - | ||
1N4739A/TR Microchip Technology | In Stock | - | - | - | - | - | DO-41-2 | - | - | - | - | - | - | 569 | 200 mA | - | - | 3 uA | 3 uA | - | - | + 175 C | - | - 65 C | - | Through Hole | - | - | - | - | - | - | - | - | - | 1 W | - | - | - | - | - | N | - | 0.010935 oz | - | 9.1 V | 5 Ohms | - | Reel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Single | - | - | - | - | - | - | - | - | 28 mA | - | - | - | - | - | 5 % | 3 uA | 1.2 V | 2.718 mm | - | 5.207 mm | - | ||
CDLL5247A Microchip | 7 |
| - | - | - | Surface Mount | DO-213AB, MELF | YES | - | DO-213AB | SILICON | 2 | CDLL5247 | - | - | MICROSEMI CORP | 19 Ohms | - | - | Microsemi Corporation | CDLL5247A | - | Microchip Technology | - | - | SMD/SMT | 1 | 175 °C | Bulk | GLASS | HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2 | ROUND | LONG FORM | Active | DO-213AA | - | 0.5 W | Active | 17 V | NOT SPECIFIED | 5.3 | Compliant | No | - | - | - | - | -65°C ~ 175°C | - | - | 5 % | e0 | No | EAR99 | 1 Ω | TIN LEAD | 125 °C | -55 °C | Thick Film | METALLURGICALLY BONDED | 8541.10.00.50 | Voltage Reference Diodes | 500 W | - | ZENER | END | WRAP AROUND | NOT SPECIFIED | unknown | 2 | - | O-LELF-R2 | Not Qualified | UNIDIRECTIONAL | SINGLE | - | - | ZENER DIODE | 100 nA @ 13 V | 1.1 V @ 200 mA | ISOLATED | 10 mW | - | - | 17 V | - | 10% | DO-213AA | 7.4 mA | - | - | - | - | 26 mm | 60 mm | No |