- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device Logic Gates | Device Logic Units | Device System Gates | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer Part Number | Maximum Number of User I/Os | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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 A3P600-PQG208 Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | - | 208 | 208-PQFP (28x28) | - | - | - | - | A3P600 | - | - | - | - | - | - | 24 | - | - | - | - | - | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | - | - | SMD/SMT | 154 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | 8542310000, 8542390000/8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000/8542390000 | - | - | 1.575 V | 1.425 V | - | 110592 bit | ProASIC3 | 1.5000 V | 0.183425 oz | - | 0 to 70 °C | Tray | A3P600 | - | - | - | 70 °C | 0 °C | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | 231 MHz | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | 13.5 kB | 5 mA | 13.5 kB | - | - | - | - | - | 6500 | 110592 | 600000 | 231 MHz | - | - | STD | - | 13824 | - | - | - | - | 3.4 mm | 28 mm | 28 mm | No | Lead Free | ||
A3P1000-PQG208I Microchip Technology | In Stock | - | - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | - | - | A3P1000 | 350 MHz | - | - | - | 144 kbit | 144 kbit | 24 | - | MICROSEMI CORP | - | A3P1000-PQG208I | - | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 154 I/O | - | - | 11000 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | - | Active | - | Active | - | - | 40 | 1.32 | Details | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | 147456 bit | ProASIC3 | 1.5000 V | 1.399983 oz | - | -40 to 85 °C | Tray | A3P1000 | e3 | 3A001.A.7.A | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | 75 mA | - | - | - | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | STD | - | - | - | 24576 | - | 1000000 | 3.4 mm | 28 mm | 28 mm | - | - | ||
A3P1000-FGG256M Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA-256 | - | - | 256-FBGA (17x17) | - | - | - | - | A3P1000 | - | - | - | - | 144 kbit | 144 kbit | 90 | - | - | - | - | - | 350 MHz | - | + 85 C | Microchip Technology | - | 0 C | - | - | - | SMD/SMT | 177 I/O | - | - | 11000 LE | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | 1.5 V | 1.5 V | - | 1 kbit | ProASIC3 | - | - | - | -55°C ~ 125°C (TJ) | Tray | A3P1000 | - | - | - | - | - | - | - | - | 1.14V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | 8 mA | - | 700 Mb/s | - | - | - | - | - | 147456 | 1000000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
APA300-FG256 Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA | - | - | 256-FPBGA (17x17) | - | - | - | - | APA300 | - | - | - | - | - | - | 90 | - | - | - | - | - | 180 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | - | SMD/SMT | 186 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | 2.7 V | 2.3 V | - | - | Actel | - | 0.014110 oz | - | 0°C ~ 70°C (TA) | Tray | APA300 | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 300000 | - | - | - | STD | - | - | - | - | - | - | 1.2 mm | 17 mm | 17 mm | - | - | ||
A42MX16-PLG84 Microchip Technology | In Stock | - | - | - | - | Surface Mount | PLCC-84 | YES | - | 84-PLCC (29.31x29.31) | - | 84 | 72 | 928 | A42MX16 | 94 MHz | - | - | 24000 | - | - | 16 | 42MX | MICROSEMI CORP | 608 | A42MX16-PLG84 | - | - | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 72 I/O | - | 608 | 608 LE | 24000 | 5.25(V) | 3(V) | 3.3/5(V) | 0C to 70C | 70C | 0C | COMMERCIALC | 70 °C | - | Tube | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | PLCC | Active | 0.45UM | Active | Yes | No | 40 | 1.52 | Details | Yes | - | - | - | 5.25 V | 3 V | 3.3 V | - | Actel | - | 0.239083 oz | - | 0°C ~ 70°C (TA) | Tube | A42MX16 | e3 | - | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | 103/172(MHz) | 84 | S-PQCC-J84 | - | Not Qualified | 3.3 V, 5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | - | - | STD | - | - | 2.8 ns | 1232 | - | 24000 | 3.68 mm | 29.31 mm | 29.31 mm | - | - | ||
A40MX04-PLG68I Microchip Technology | In Stock | - | - | - | - | Surface Mount | PLCC-68 | YES | - | 68-PLCC (24.23x24.23) | - | 68 | 57 | 273 | A40MX04 | 80 MHz | - | - | 6000 | - | - | 19 | 40MX | MICROSEMI CORP | 547 | A40MX04-PLG68I | - | 139 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 57 I/O | 547 LAB | 547 | 547 LE | 6000 | 5.5(V) | 3(V) | 3.3/5(V) | -40C to 85C | 85C | -40C | INDUSTRIALC | 85 °C | -40 °C | Tube | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | PLCC | Active | 0.45UM | Active | Yes | No | NOT SPECIFIED | 5.28 | Details | Yes | - | - | - | 5.5 V | 3 V | 3.3 V | - | Actel | - | 0.171777 oz | - | -40°C ~ 85°C (TA) | Tube | A40MX04 | - | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | compliant | 83/139(MHz) | 68 | S-PQCC-J68 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 6000 | - | - | - | STD | - | - | 2.7 ns | 547 | - | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | - | - | ||
A3P060-FGG144I Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | A3P060 | 350 MHz | - | - | - | - | - | 1 | - | MICROSEMI CORP | - | A3P060-FGG144I | - | 231 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 96 I/O | - | - | 660 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 40 | 5.22 | Details | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | 18432 bit | ProASIC3 | - | - | - | -40°C ~ 100°C (TJ) | Tray | A3P060 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | 15 mA | - | - | - | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 18432 | 60000 | - | - | - | STD | - | - | - | 1536 | - | 60000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
A3PE3000L-FGG484 Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | - | - | A3PE3000 | 250 MHz | - | - | - | - | - | 60 | - | MICROSEMI CORP | - | A3PE3000L-FGG484 | - | 781.25 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | - | SMD/SMT | 341 I/O | - | - | - | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.3 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | 1.26 V | 1.14 V | 1.2 V | - | ProASIC3 | 1.2000 V | 0.014110 oz | - | 0 to 70 °C | Tray | A3PE3000L | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | - | 25 mA | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 781.25 MHz | - | - | STD | - | 75264 | - | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | - | ||
A3P1000-FGG144M Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | A3P1000 | 350 MHz | - | - | - | - | - | 160 | - | MICROSEMI CORP | - | A3P1000-FGG144M | - | 350 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | 3 | - | SMD/SMT | 97 I/O | - | - | 11000 LE | - | - | - | - | - | - | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 40 | 1.34 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | - | - | - | 8 mA | - | - | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | - | - | - | - | 24576 | 24576 | 1000000 | - | 13 mm | 13 mm | - | - | ||
A3PE3000L-FGG484M Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | - | - | A3PE3000 | 250 MHz | - | - | - | - | - | 60 | - | MICROSEMI CORP | - | A3PE3000L-FGG484M | - | 350 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | 3 | - | SMD/SMT | 341 I/O | - | - | - | - | - | - | - | - | - | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.29 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | 1.575 V | 1.14 V | 1.2 V | - | ProASIC3 | - | 0.014110 oz | - | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e1 | 3A001.A.2.C | TIN SILVER COPPER | 125 °C | -55 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | - | 25 mA | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 350 MHz | - | - | - | - | 75264 | - | 75264 | 75264 | 3000000 | - | 23 mm | 23 mm | No | - | ||
A3P060-FG144 Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA-144 | YES | - | 144-FPBGA (13x13) | - | 144 | - | - | A3P060 | 350 MHz | - | - | - | - | - | 160 | - | MICROSEMI CORP | - | A3P060-FG144 | - | 350 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | 96 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | - | Active | - | Active | - | - | 30 | 1.52 | N | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | - | 0°C ~ 85°C (TJ) | Tray | A3P060 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 18432 | 60000 | - | - | - | STD | - | - | - | 1536 | - | 60000 | 1.05 mm | 13 mm | 13 mm | - | - | ||
AGL600V5-FGG256I Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | 177 | 13824 | AGL600 | 108 MHz | - | - | 600000 | - | - | 90 | IGLOO | MICROSEMI CORP | - | AGL600V5-FGG256I | - | 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 177 I/O | - | - | 7000 LE | 600000 | 1.575(V) | 1.425(V) | 1.5(V) | -40C to 85C | 85C | -40C | Industrial | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | FBGA | Active | 130NM | Active | Yes | No | 40 | 5.25 | Details | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | IGLOOe | - | 0.014110 oz | - | -40°C ~ 85°C (TA) | Tray | AGL600V5 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | 256 | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | - | STD | - | - | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | - | ||
APA150-FG144 Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | - | 144 | 144-FPBGA (13x13) | 400.011771 mg | - | - | - | APA150 | - | - | - | - | - | - | 160 | - | - | - | - | - | 180 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | - | - | SMD/SMT | 100 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | 2.7 V | 2.3 V | - | - | Actel | - | 0.014110 oz | - | 0°C ~ 70°C (TA) | Tray | APA150 | - | - | - | 70 °C | 0 °C | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | 180 MHz | - | - | - | - | 2.5 V | - | - | 2.7 V | 2.3 V | - | - | 4.5 kB | - | - | - | - | - | - | 36864 | 150000 | 180 MHz | - | - | STD | - | 6144 | - | - | - | - | 1.05 mm | 13 mm | 13 mm | No | - | ||
APA150-PQG208 Microchip Technology | In Stock | - | - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | - | - | APA150 | 180 MHz | - | - | - | - | - | 24 | - | MICROSEMI CORP | - | APA150-PQG208 | - | 180 MHz | - | + 70 C | Microchip Technology | - | 0 C | Yes | 3 | - | SMD/SMT | 158 I/O | - | - | 2000 LE | - | - | - | - | - | - | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | - | Active | - | Active | - | - | 40 | 1.58 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | 2.7 V | 2.3 V | 2.5 V | 36864 bit | ProASICPLUS | - | - | - | 0°C ~ 70°C (TA) | Tray | APA150 | e3 | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | - | - | - | 5 mA | - | - | 158 | 150000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 150000 | - | - | - | - | - | - | - | - | 6144 | 150000 | 3.4 mm | 28 mm | 28 mm | - | - | ||
A54SX08A-TQG100 Microchip Technology | In Stock | - | - | - | - | Surface Mount | TQFP-100 | - | - | 100-TQFP (14x14) | - | - | - | - | A54SX08 | - | 8000 | 768 | 12000 | - | - | 90 | - | - | - | - | 81 | 238 MHz | 2.75 V | + 70 C | Microchip Technology | 2.25 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 81 I/O | 768 LAB | - | 512 LE | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | Details | - | - | - | TQFP | 5.25 V | 2.25 V | - | - | Actel | 2.5000 V | 0.023175 oz | Commercial grade | 0 to 70 °C | Tray | A54SX08A | - | - | - | - | - | - | - | - | 2.25V ~ 5.25V | - | - | - | - | - | - | 100 | - | - | - | 2.25 V to 5.25 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 12000 | - | 768 | Commercial | STD | - | 512 | - | - | - | - | 1.4 mm | 14 mm | 14 mm | - | - | ||
APA300-PQG208 Microchip Technology | In Stock | - | - | - | - | Surface Mount | PQFP-208 | - | - | 208-PQFP (28x28) | - | - | 158 | 8192 | APA300 | - | - | - | 300000 | - | - | 24 | PROASICPLUS | - | - | - | - | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 158 I/O | - | - | - | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | 0C to 70C | 70C | 0C | Commercial | - | - | Tray | - | - | - | - | - | - | PQFP | - | 0.22UM | Active | Yes | No | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | 2.7 V | 2.3 V | - | 73728 bit | ProASICPLUS | 2.5000 V | - | - | 0 to 70 °C | Tray | APA300 | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | 180(MHz) | 208 | - | - | - | 2.5 V | - | - | - | - | - | 5 mA | - | - | - | - | - | - | - | 73728 | 300000 | - | - | - | STD | - | - | - | - | - | - | 3.4 mm | 28 mm | 28 mm | - | - | ||
APA300-FG144M Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA | - | - | 144-FPBGA (13x13) | - | - | - | - | APA300 | - | - | - | - | - | - | 160 | - | - | - | - | - | 180 MHz | - | + 125 C | Microchip Technology | - | - 55 C | Yes | - | - | SMD/SMT | 100 I/O | - | - | - | - | - | - | - | - | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | N | - | - | This product may require additional documentation to export from the United States. | - | 2.7 V | 2.3 V | - | - | Actel | - | 0.014110 oz | - | -55°C ~ 125°C (TC) | Tray | APA300 | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 300000 | - | - | - | - | - | - | - | - | - | - | 1.05 mm | 13 mm | 13 mm | - | - | ||
A3P600-FGG256I Microchip Technology | In Stock | - | - | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA-256 | YES | 256 | 256-FPBGA (17x17) | - | 256 | - | - | A3P600 | 350 MHz | - | - | - | - | - | 90 | - | MICROSEMI CORP | - | A3P600-FGG256I | - | 231 MHz | - | + 85 C | Microchip Technology | - | - 40 C | Yes | 3 | - | SMD/SMT | 177 I/O | - | - | 6500 LE | - | - | - | - | - | - | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 1.31 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | 1.575 V | 1.425 V | 1.5 V | 110592 bit | ProASIC3 | 1.5000 V | - | - | -40 to 85 °C | Tray | A3P600 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 45 mA | 13.5 kB | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | 110592 | 600000 | 231 MHz | - | - | STD | - | 13824 | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||
A3P600-FGG256 Microchip Technology | In Stock | - | - | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | - | - | A3P600 | 350 MHz | - | - | - | - | - | 90 | - | MICROSEMI CORP | - | A3P600-FGG256 | - | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | 177 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | - | Active | - | Active | - | - | 40 | 5.23 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | - | 0 to 70 °C | Tray | A3P600 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | COMMERCIAL | 1.575 V | 1.425 V | - | - | 13.5 kB | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | 231 MHz | - | - | STD | - | 13824 | - | 13824 | - | 600000 | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||
M1A3P1000-PQG208 Microchip Technology | In Stock | - | - | - | - | Surface Mount | PQFP-208 | YES | - | 208-PQFP (28x28) | - | 208 | - | - | M1A3P1000 | 350 MHz | - | - | - | - | - | 24 | - | MICROSEMI CORP | - | M1A3P1000-PQG208 | - | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | 154 I/O | - | - | - | - | - | - | - | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | - | Active | - | Active | - | - | 40 | 5.24 | Details | Yes | - | This product may require additional documentation to export from the United States. | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | - | - | 0 to 70 °C | Tray | M1A3P1000 | e3 | - | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | - | S-PQFP-G208 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | STD | - | - | - | 24576 | - | 1000000 | - | 28 mm | 28 mm | - | - |