- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Max Junction Temperature (Tj) | Number of Logic Cells | Ambient Temperature Range High | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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![]() AGL600V5-FGG256 Microchip Technology | 30 |
| - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V5-FGG256 | 892.86 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | - | 177 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | IGLOOe | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | AGL600V5 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | OTHER | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | STD | - | - | - | 13824 | - | - | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | ||
![]() A40MX04-PLG84I Microchip Technology | 234 |
| - | - | - | Surface Mount | PLCC-84 | YES | - | 84-PLCC (29.31x29.31) | - | 84 | A40MX04 | 80 MHz | 16 | MICROSEMI CORP | A40MX04-PLG84I | 139 MHz | 5.5 V | + 85 C | - | Microchip Technology | 3 V | - 40 C | Yes | 3 | SMD/SMT | - | 69 I/O | - | 547 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Active | Active | NOT SPECIFIED | 5.28 | Details | Yes | - | - | 5.5 V | 3 V | 3.3 V | - | Actel | 3.3, 5 V | 0.239083 oz | -40 to 85 °C | Tube | A40MX04 | e3 | - | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | compliant | - | S-PQCC-J84 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 6000 | - | - | STD | - | - | 2.7 ns | 547 | - | - | - | 6000 | 3.68 mm | 29.31 mm | 29.31 mm | - | ||
![]() AGLP125V2-CSG281 Microchip Technology | 50 |
| - | - | - | Surface Mount | CSP-281 | YES | - | 281-CSP (10x10) | - | 281 | AGLP125 | 160 MHz | 184 | MICROSEMI CORP | AGLP125V2-CSG281 | 892.86 MHz | - | + 70 C | - | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | - | 212 I/O | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA281,19X19,20 | BGA281,19X19,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 5.25 | Details | Yes | - | - | 1.575 V | 1.14 V | 1.5 V | - | IGLOO PLUS | - | - | 0°C ~ 85°C (TJ) | Tray | AGLP125V2 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | S-PBGA-B281 | 212 | Not Qualified | 1.2 V to 1.5 V | 1.2/1.5 V | COMMERCIAL | - | - | - | - | - | - | 212 | 3120 CLBS, 125000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 3120 | 36864 | 125000 | - | - | STD | - | - | - | 3120 | - | 3120 | - | 125000 | 0.71 mm | 10 mm | 10 mm | - | ||
![]() A3P1000-FG144 Microchip Technology | In Stock | - | - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-FG144 | 231 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | - | 97 I/O | - | 11000 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.47 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | STD | - | - | - | 24576 | - | - | - | 1000000 | - | 13 mm | 13 mm | - | ||
![]() A3PE600-FGG484I Microchip Technology | 2594 |
| - | - | - | Surface Mount | FBGA-484 | YES | - | 484-FPBGA (23x23) | - | 484 | A3PE600 | 350 MHz | 60 | MICROSEMI CORP | A3PE600-FGG484I | 350 MHz | 1.575 V | + 85 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | - | 270 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE600 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | 270 | Not Qualified | 1.425 V to 1.575 V | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | STD | - | - | - | 13824 | - | 13824 | - | 600000 | 1.73 mm | 23 mm | 23 mm | - | ||
![]() A3PN125-1VQG100I Microchip Technology | 46 |
| - | - | - | Surface Mount | VQFP | YES | - | 100-VQFP (14x14) | - | 100 | A3PN125 | - | 90 | MICROSEMI CORP | A3PN125-1VQG100I | 350 MHz | - | + 85 C | - | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | - | 71 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.26 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 nano | - | - | -40°C ~ 100°C (TJ) | Tray | A3PN125 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | S-PQFP-G100 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | 2 mA | - | - | - | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 125000 | - | - | 1 | - | - | - | 3072 | - | - | - | 125000 | 1 mm | 14 mm | 14 mm | - | ||
![]() A3P1000-1FG144M Microchip Technology | 2989 |
| - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FG144M | 350 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | 3 | SMD/SMT | - | 97 I/O | - | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.22 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | - | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e0 | 3A001.A.2.C | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | not_compliant | - | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | - | - | - | 8 mA | - | - | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | - | - | - | 24576 | - | 24576 | - | 1000000 | - | 13 mm | 13 mm | - | ||
![]() EX64-TQG64 Microchip Technology | 14 |
| - | - | - | Surface Mount | TQFP-64 | YES | - | 64-TQFP (10x10) | - | 64 | EX64 | 250 MHz | 160 | MICROSEMI CORP | EX64-TQG64 | 250 MHz | - | + 70 C | - | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | - | 41 I/O | - | 128 LE | 70 °C | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.3 | Details | Yes | - | - | 2.7 V | 2.3 V | 2.5 V | - | Actel | - | 0.012720 oz | 0°C ~ 70°C (TA) | Tray | EX64 | e3 | - | Matte Tin (Sn) | - | - | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | S-PQFP-G64 | - | - | 2.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 3000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 128 | - | 3000 | - | - | - | - | - | 1 ns | - | - | - | - | 3000 | 1.4 mm | 10 mm | 10 mm | - | ||
![]() AGL600V2-FGG256 Microchip Technology | 2591 |
| - | - | - | Surface Mount | FBGA-256 | YES | - | 256-FPBGA (17x17) | - | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FGG256 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | - | 177 I/O | - | 6500 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 1.46 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | 110592 bit | IGLOOe | 1.2, 1.5 V | - | 0 to 70 °C | Tray | AGL600V2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | 1.2 V to 1.5 V | - | OTHER | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | STD | - | - | - | 13824 | - | - | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | ||
![]() A3P125-FG144 Microchip Technology | 46 |
| - | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | A3P125 | 350 MHz | 160 | MICROSEMI CORP | A3P125-FG144 | 231 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | - | 97 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.22 | N | No | - | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P125 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 125000 | - | - | STD | - | - | - | 3072 | - | - | - | 125000 | 1.05 mm | 13 mm | 13 mm | - | ||
![]() A42MX16-PLG84M Microchip Technology | 700 | - | - | - | - | Surface Mount | PLCC-84 | YES | - | 84-PLCC (29.31x29.31) | - | 84 | A42MX16 | 94 MHz | 16 | MICROSEMI CORP | A42MX16-PLG84M | 172 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | 3 | SMD/SMT | - | 72 I/O | - | 608 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-84 | - | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.28 | Details | Yes | - | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | - | Actel | - | 0.239083 oz | -55°C ~ 125°C (TC) | Tube | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | - | S-PQCC-J84 | - | Not Qualified | 3.3 V, 5 V | - | MILITARY | - | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | - | - | - | - | 2.8 ns | 1232 | - | - | - | 24000 | 3.68 mm | 29.31 mm | 29.31 mm | - | ||
![]() A3PE3000-FGG484 Microchip Technology | 2898 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | - | 484 | A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | A3PE3000-FGG484 | 350 MHz | - | + 85 C | FLASH | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | - | 341 I/O | - | 35000 LE | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.58 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | 516096 bit | ProASIC3 | - | 0.861390 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 341 | Not Qualified | 1.425 V to 1.575 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 128 B | 25 mA | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 35000 | 516096 | 3000000 | 231 MHz | - | STD | - | 75264 | - | 75264 | 85 °C | 75264 | 70 °C | 3000000 | 1.73 mm | 23 mm | 23 mm | No | ||
![]() A3P250-VQ100 Microchip Technology | 5000 |
| - | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | VQFP-100 | YES | 100 | 100-VQFP (14x14) | - | 100 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-VQ100 | 231 MHz | 1.575 V | + 85 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | - | 68 I/O | - | 3000 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.22 | N | No | FPGA - Field Programmable Gate Array ProASIC3 | - | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.017813 oz | 0 to 70 °C | Tray | A3P250 | e0 | - | TIN LEAD | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 231 MHz | S-PQFP-G100 | - | Not Qualified | 1.5 V | - | COMMERCIAL | 1.575 V | 1.425 V | - | - | 4.5 kB | - | - | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 36864 | 250000 | 231 MHz | - | STD | - | 6144 | - | 6144 | - | - | - | 250000 | 1 mm | 14 mm | 14 mm | No | ||
![]() A40MX02-VQG80 Microchip Technology | 9 |
| - | - | - | Surface Mount | VQFP | YES | - | 80-VQFP (14x14) | - | 80 | A40MX02 | 80 MHz | 90 | MICROSEMI CORP | A40MX02-VQG80 | 139 MHz | - | + 70 C | - | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | - | 57 I/O | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | TQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80 | - | SQUARE | FLATPACK, THIN PROFILE | Active | Active | 40 | 5.29 | Details | Yes | - | - | 5.25 V | 3 V | 3.3 V | - | Actel | - | - | 0°C ~ 70°C (TA) | Tray | A40MX02 | e3 | - | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.65 mm | compliant | - | S-PQFP-G80 | - | Not Qualified | 3.3 V, 5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 295 CLBS, 3000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 3000 | - | - | - | - | - | 2.7 ns | 295 | - | - | - | 3000 | 1 mm | 14 mm | 14 mm | - | ||
![]() A40MX02-PLG44 Microchip Technology | 5 |
| - | - | - | Surface Mount | PLCC-44 | YES | - | 44-PLCC (16.59x16.59) | - | 44 | A40MX02 | 80 MHz | 27 | MICROSEMI CORP | A40MX02-PLG44 | 139 MHz | 5.25 V | + 70 C | - | Microchip Technology | 3 V | 0 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 34 I/O | 295 LAB | 295 LE | 70 °C | - | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Active | Active | 40 | 1.52 | Details | Yes | - | - | 5.25 V | 3 V | 3.3 V | - | Actel | 3.3, 5 V | 0.084185 oz | 0 to 70 °C | Tube | A40MX02 | e3 | - | Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | - | S-PQCC-J44 | - | Not Qualified | 3.3 V, 5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 3000 | - | - | STD | - | - | 2.7 ns | 295 | - | - | - | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | - | ||
![]() A3P600-1FG256I Microchip Technology | 31 |
| - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-1FG256I | 272 MHz | 1.575 V | + 85 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | - | 177 I/O | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | - | SQUARE | GRID ARRAY | Active | Active | 30 | 1.49 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P600 | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | 1 | - | - | - | 13824 | - | - | - | 600000 | 1.2 mm | 17 mm | 17 mm | - | ||
![]() A3P1000-2FG256 Microchip Technology | 30 |
| - | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-2FG256 | 310 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | - | 177 I/O | - | 11000 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | 2 | - | - | - | 24576 | - | - | - | 1000000 | - | 17 mm | 17 mm | - | ||
![]() APA600-PQG208 Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | - | 208 | APA600 | 180 MHz | 24 | MICROSEMI CORP | APA600-PQG208 | 180 MHz | 2.7 V | + 70 C | - | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | - | 158 I/O | - | 7000 LE | 70 °C | - | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 5.3 | Details | Yes | - | - | 2.7 V | 2.3 V | 2.5 V | - | Actel | 2.5000 V | 2.264236 oz | 0 to 70 °C | Tray | APA600 | e3 | - | Matte Tin (Sn) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 245 | 0.5 mm | compliant | 180 MHz | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | - | - | 15.8 kB | - | 158 | 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 129024 | 600000 | 180 MHz | - | STD | - | 21504 | - | - | - | 21504 | - | 600000 | 3.4 mm | 28 mm | 28 mm | No | ||
![]() APA450-FGG484 Microchip Technology | 2124 |
| - | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | APA450 | 180 MHz | 60 | MICROSEMI CORP | APA450-FGG484 | 180 MHz | - | + 70 C | - | Microchip Technology | - | 0 C | Yes | 3 | SMD/SMT | - | 344 I/O | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | - | Actel | - | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | 180 MHz | S-PBGA-B484 | 344 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | - | - | 13.5 kB | - | 344 | 450000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 450000 | 180 MHz | - | STD | - | 12288 | - | - | - | 12288 | - | 450000 | 1.73 mm | 23 mm | 23 mm | No | ||
![]() A54SX08A-TQG144I Microchip Technology | 2155 |
| - | - | - | Surface Mount | TQFP-144 | - | - | 144-TQFP (20x20) | - | - | A54SX08 | - | 60 | - | - | 238 MHz | 2.75 V | + 85 C | - | Microchip Technology | 2.25 V | - 40 C | Yes | - | SMD/SMT | - | 113 I/O | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | 2.75 V | 2.25 V | - | - | Actel | 2.5000 V | 0.046530 oz | -40 to 85 °C | Tray | A54SX08A | - | - | - | - | - | - | - | - | 2.25V ~ 5.25V | - | - | - | - | - | - | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 12000 | - | 768 | STD | - | - | - | - | - | - | - | - | 1.4 mm | 20 mm | 20 mm | - |