- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Contact Shape | Supplier Device Package | Weight | Number of Terminals | 1st Contact Gender | 2nd Contact Gender | Base Product Number | Cable Types | Clock Frequency-Max | Contact Finish Mating | Contact Length-Mating | Contact Materials | Current - Saturation (Isat) | Frequency-Max | Frequency-Self-Resonant | Ihs Manufacturer | Inductance Frequency-Test | Insulation Materials | Lead Free Status / RoHS Status | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Material-Core | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Overall Impedance | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Voltage Rated | Voltage-Off State | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Number of Rows | Power (Watts) | Additional Feature | HTS Code | Capacitance | Fastening Type | Subcategory | Power Rating | Contact Type | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Insulation Height | Style | Number of Positions Loaded | Reach Compliance Code | Frequency | Pitch - Mating | Insulation Color | Pin Count | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Row Spacing - Mating | Contact Length - Post | Shrouding | Contact Finish - Post | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Overall Contact Length | Power Supplies | Temperature Grade | Inductance | Max Supply Voltage | Min Supply Voltage | DC Resistance (DCR) | RAM Size | Lead Style | Manufacturer Size Code | Q @ Freq | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | 1st Connector | 2nd Connector | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Battery Chemistry | Number of Logic Blocks (LABs) | Speed Grade | Voltage - Gate Trigger (Vgt) (Max) | Current - Non Rep. Surge 50, 60Hz (Itsm) | Current - Gate Trigger (Igt) (Max) | Current - Hold (Ih) (Max) | Current - On State (It (RMS)) (Max) | Number of Registers | Combinatorial Delay of a CLB-Max | Battery Cell Size | Number of CLBs | Number of Logic Cells | Current - On State (It (AV)) (Max) | SCR Type | Voltage - On State (Vtm) (Max) | Current - Off State (Max) | Number of Equivalent Gates | Features | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | Radiation Hardening | Ratings |
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 M1A3P1000L-FG484I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 484 | - | - | - | - | 350 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | M1A3P1000L-FG484I | - | - | - | 3 | - | 85 °C | -40 °C | - | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.27 | Non-Compliant | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | e0 | - | - | - | - | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | - | CMOS | - | BOTTOM | BALL | - | 225 | - | 1 mm | - | - | - | compliant | - | - | - | - | - | S-PBGA-B484 | 300 | Not Qualified | - | - | - | - | - | - | - | - | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24576 | 24576 | - | - | - | - | 1000000 | - | - | - | 23 mm | 23 mm | - | - | - | - | - | - | ||
M7AFS600-1PQG208I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 208 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | M7AFS600-1PQG208I | - | - | - | 3 | - | 85 °C | -40 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | - | 40 | 5.8 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | e3 | - | - | - | - | - | - | - | - | - | - | MATTE TIN | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | - | - | CMOS | - | QUAD | GULL WING | - | 245 | - | 0.5 mm | - | - | - | compliant | - | - | - | - | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 600000 | - | - | - | 28 mm | 28 mm | - | - | - | - | - | - | ||
M1AFS600-2PQ208I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 208 | - | - | - | 208 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | M1AFS600-2PQ208I | - | - | - | 3 | 95 | 85 °C | -40 °C | - | - | PLASTIC/EPOXY | QFF | QFF, | - | RECTANGULAR | FLATPACK | Obsolete | - | - | 30 | 5.88 | Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | e0 | - | - | - | - | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | - | - | CMOS | - | QUAD | FLAT | - | 225 | - | 0.5 mm | - | - | - | compliant | - | - | - | - | - | R-PQFP-F208 | - | Not Qualified | - | - | - | - | 1.5 V | - | - | - | - | - | INDUSTRIAL | - | 1.575 V | 1.425 V | - | 13.5 kB | - | - | - | - | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 600000 | 1.47059 GHz | - | - | - | - | 2 | - | - | - | - | - | 13824 | - | - | 13824 | - | - | - | - | - | 600000 | - | 3.4 mm | - | 28 mm | 28 mm | - | - | - | - | No | - | ||
M1A3P400-1FG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 484 | - | - | - | - | 350 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | M1A3P400-1FG484 | - | - | - | 3 | - | 85 °C | - | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | 30 | 5.25 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | e0 | - | - | - | - | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | - | - | CMOS | - | BOTTOM | BALL | - | 225 | - | 1 mm | - | - | - | compliant | - | - | - | - | - | S-PBGA-B484 | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | - | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | - | - | - | - | - | ||
M1AFS250-1PQ208I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 208 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | M1AFS250-1PQ208I | - | - | - | 3 | - | 85 °C | -40 °C | - | - | PLASTIC/EPOXY | QFF | QFF, | - | RECTANGULAR | FLATPACK | Obsolete | - | - | 30 | 5.88 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | 50 V | - | - | - | - | 0.5 % | e0 | - | - | - | - | - | 100 ppm/°C | - | - | 920 kΩ | - | Tin/Lead (Sn/Pb) | 155 °C | -55 °C | Thin Film | - | - | - | - | - | 8542.39.00.01 | - | - | - | 100 mW | - | - | CMOS | - | QUAD | FLAT | - | 225 | - | 0.5 mm | - | - | - | compliant | - | - | - | - | - | R-PQFP-F208 | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 6144 | - | - | - | - | - | 250000 | - | 550 µm | - | 30.6 mm | 28 mm | - | - | - | - | - | - | ||
M1AFS600-PQ208I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 208 | - | - | - | 208 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | M1AFS600-PQ208I | - | - | - | 3 | 95 | 85 °C | -40 °C | - | - | PLASTIC/EPOXY | QFF | QFP-208 | - | RECTANGULAR | FLATPACK | Obsolete | - | - | 30 | 5.88 | Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | e0 | - | - | - | - | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | - | - | CMOS | - | QUAD | FLAT | - | 225 | - | 0.5 mm | - | - | - | compliant | 1.0989 GHz | - | - | - | - | R-PQFP-F208 | - | Not Qualified | - | - | - | - | 1.5 V | - | - | - | - | - | INDUSTRIAL | - | 1.575 V | 1.425 V | - | 13.5 kB | - | - | - | - | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 600000 | 1.0989 GHz | - | - | - | - | - | - | - | - | - | - | 13824 | - | - | 13824 | - | - | - | - | - | 600000 | - | 3.4 mm | - | 28 mm | 28 mm | - | - | - | - | No | - | ||
A3P250-FG144T Microchip | 2449 |
| - | - | - | Through Hole | Axial | YES | - | - | 144-FPBGA (13x13) | - | 144 | - | - | A3P250 | - | 350 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | -- | -- | Microsemi Corporation | A3P250-FG144T | - | - | Microchip Technology | 3 | 97 | 125 °C | -40 °C | - | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 20 | 5.23 | - | No | - | 1.575 V | 1.425 V | 1.5 V | Automotive grade | 50V | - | - | -55°C ~ 125°C | Bulk | Military, MIL-PRF-39003/1, CSR13 | 0.135 Dia x 0.286 L (3.43mm x 7.26mm) | ±10% | e0 | Active | -- | - | - | - | - | - | Hermetically Sealed | - | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | - | - | - | - | - | 8542.39.00.01 | 1µF | - | Field Programmable Gate Arrays | - | - | - | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | - | 235 | - | 1 mm | - | - | - | compliant | - | - | - | - | - | S-PBGA-B144 | 97 | Not Qualified | - | - | - | - | - | -- | B (0.1%) | -- | - | 1.5/3.3 V | AUTOMOTIVE | - | - | - | - | - | - | A | - | 97 | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 36864 | 250000 | - | - | AEC-Q100 | - | - | STD | - | - | - | - | - | - | - | - | 6144 | 6144 | - | - | - | - | 250000 | Military | - | -- | 13 mm | 13 mm | - | - | - | - | - | - | ||
A3P125-2PQ208 Microchip | In Stock | - | - | - | - | Through Hole | 208-BFQFP | YES | - | Circular | 208-PQFP (28x28) | - | 208 | - | - | TST24 | - | 350 MHz | Tin | - | - | - | - | - | MICROSEMI CORP | - | Polyamide (PA), Nylon | - | - | Microsemi Corporation | A3P125-2PQ208 | - | - | ITT Cannon, LLC | 3 | 133 | 85 °C | - | - | Bulk | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | Active | 30 | 5.26 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | 250V | -40°C ~ 105°C | - | Trident Rectangular | - | - | e0 | - | - | - | Solder | - | - | Receptacle | - | - | 24 | Tin/Lead (Sn/Pb) | - | - | - | - | Automotive, Industrial | 4 | - | - | 8542.39.00.01 | - | Latch Holder | - | - | Male Pin | 13A | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | - | 225 | - | 0.5 mm | 0.531 (13.50mm) | Board to Cable/Wire | All | compliant | - | 0.200 (5.08mm) | Black | - | - | S-PQFP-G208 | - | Not Qualified | 0.200 (5.08mm) | 0.224 (5.70mm) | Unshrouded | - | - | - | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | 3072 CLBS, 125000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 36864 | 125000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3072 | - | - | - | - | - | 125000 | Mounting Flange | - | - | 28 mm | 28 mm | - | - | - | UL94 V-0 | - | - | ||
A42MX24-2PQ160 Microchip | In Stock | - | - | Obsolete (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 160-BQFP | YES | 160 | - | 160-PQFP (28x28) | 5.566797 g | 160 | - | - | A42MX24 | - | 105 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A42MX24-2PQ160 | - | - | Microchip Technology | 3 | 125 | 70 °C | - | - | Tray | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | QFP | Obsolete | 30 | 5.25 | Compliant | No | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | 0°C ~ 70°C (TA) | - | MX | - | - | e0 | - | - | - | - | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | - | - | - | - | - | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | - | 225 | - | 0.65 mm | - | - | - | compliant | - | - | - | 160 | - | S-PQFP-G160 | - | Not Qualified | - | - | - | - | 5 V | - | - | - | - | - | COMMERCIAL | - | 5.25 V | 3 V | - | - | - | - | - | - | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | - | - | - | 36000 | - | - | - | - | 912 | 2 | - | - | - | - | - | 1410 | 1.8 ns | - | 1890 | - | - | - | - | - | 36000 | - | 3.4 mm | - | 28 mm | 28 mm | - | - | - | - | No | - | ||
5962-9958501QYC/GROUPADATA Microchip | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Murata Electronics | - | - | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M1AGLE3000V2-FGG896I Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount, MLCC | 1206 (3216 Metric) | YES | 896 | - | - | - | 896 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | M1AGLE3000V2-FGG896I | - | - | KYOCERA AVX | 3 | 620 | 85 °C | -40 °C | - | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | Active | 30 | 8.63 | Compliant | Yes | 8542390000/8542390000/8542390000/8542390000/8542390000 | 1.575 V | 1.425 V | 1.5 V | - | 16V | - | - | -30°C ~ 85°C | - | - | 0.126 L x 0.063 W (3.20mm x 1.60mm) | -20%, +80% | e1 | - | - | - | - | - | Y5V (F) | - | - | - | - | TIN SILVER COPPER | 85 °C | -40 °C | - | - | General Purpose | - | - | - | 8542.39.00.01 | 0.68 µF | - | - | - | - | - | CMOS | - | BOTTOM | BALL | - | 245 | - | 1 mm | - | - | - | compliant | - | - | - | - | - | S-PBGA-B896 | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | INDUSTRIAL | - | - | - | - | 63 kB | - | - | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | - | - | - | 3e+06 | - | - | - | - | - | - | - | - | - | - | - | 75264 | - | - | 75264 | - | - | - | - | - | 3000000 | - | - | - | 29 mm | 29 mm | 0.037 (0.94mm) | - | - | - | No | - | ||
A54SX32A-1FG256M Microchip | In Stock | - | - | - | - | Through Hole | Radial, Vertical Cylinder | YES | - | - | Radial | - | 256 | - | - | A54SX32 | - | 278 MHz | - | - | - | 3.4A | - | - | MICROSEMI CORP | 15.75 kHz | - | - | - | Microsemi Corporation | A54SX32A-1FG256M | - | - | Central Technologies | 3 | 203 | 125 °C | -55 °C | - | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.24 | - | No | - | 2.75 V | 2.25 V | 2.5 V | - | - | - | - | -55°C ~ 125°C | - | CTVF-0 | 1.098 Dia (27.90mm) | ±10% | e0 | - | - | - | - | 3A001.A.2.C | - | - | Wirewound | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | - | - | - | - | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | - | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | Unshielded | 225 | - | 1 mm | - | - | - | unknown | - | - | - | - | - | S-PBGA-B256 | 203 | Not Qualified | - | - | - | - | - | - | - | - | - | 2.5,2.5/5 V | MILITARY | 300 µH | - | - | 160mOhm Max | - | - | - | - | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 48000 | - | 2880 | - | - | - | - | - | - | - | - | - | - | 1.1 ns | - | 2880 | 2880 | - | - | - | - | 48000 | - | - | 1.000 (25.40mm) | 17 mm | 17 mm | - | - | - | - | - | - | ||
AGL600V2-FGG256T Microchip | In Stock | - | - | - | Surface Mount | Surface Mount, MLCC | 0805 (2012 Metric) | - | 256 | - | - | - | - | - | - | VJ0805 | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | AGL600V2-FGG256T | - | - | Vishay Vitramon | 3 | 110592 | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | Active | - | Active | 30 | 5.76 | Compliant | Yes | - | - | - | - | - | 100V | - | - | -55°C ~ 125°C | - | VJ HIFREQ | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.25pF | e1 | - | - | - | - | - | C0G, NP0 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | - | RF, Microwave, High Frequency | - | - | - | 8542.39.00.01 | 3.3 pF | - | - | - | - | - | - | - | - | - | - | 250 | - | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13.5 kB | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 13824 | - | - | - | 600000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | High Q, Low Loss | - | - | - | - | 0.057 (1.45mm) | - | - | - | - | - | ||
A54SX16P-1TQ144 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 144 | - | - | 068421 | - | 280 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A54SX16P-1TQ144 | - | - | Molex | 3 | - | 70 °C | - | - | Bulk | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | - | Active | 30 | 5.85 | - | No | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | * | - | - | e0 | - | - | - | - | - | - | - | - | - | - | TIN LEAD | - | - | - | - | - | - | - | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | - | - | - | - | - | - | CMOS | - | QUAD | GULL WING | - | 225 | - | 0.5 mm | - | - | - | compliant | - | - | - | - | - | S-PQFP-G144 | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | - | 1452 CLBS, 16000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.8 ns | - | 1452 | - | - | - | - | - | 16000 | - | - | - | 20 mm | 20 mm | - | - | - | - | - | - | ||
A54SX16A-1FG256 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 256 | - | - | - | - | 263 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A54SX16A-1FG256 | - | - | Murata Electronics | 3 | - | 70 °C | - | - | Strip | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | Active | 30 | 5.32 | - | No | - | 2.75 V | 2.25 V | 2.5 V | - | 1.55 V | - | - | - | - | 348 | 0.19 Dia x 0.07 H (4.8mm x 2.2mm) | - | - | - | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | - | - | - | - | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | - | CMOS | - | BOTTOM | BALL | - | 225 | - | 1 mm | - | - | - | compliant | - | - | - | - | Requires Holder | S-PBGA-B256 | 180 | Not Qualified | - | - | - | - | - | - | - | - | - | 2.5,3.3/5 V | COMMERCIAL | - | - | - | - | - | - | - | - | 180 | 1452 CLBS, 24000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | Silver Oxide | - | - | - | - | - | - | - | - | 1.2 ns | Coin, 4.8mm | 1452 | 1452 | - | - | - | - | 24000 | - | - | - | 17 mm | 17 mm | - | - | - | - | - | - | ||
A40MX04-3PL68I Microchip | In Stock | - | - | - | - | Surface Mount | 0603 (1608 Metric) | YES | - | - | 0603 | - | 68 | - | - | RN731J | - | 109 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A40MX04-3PL68I | - | - | KOA Speer Electronics, Inc. | 3 | 57 | 85 °C | -40 °C | - | Tape & Reel (TR) | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.24 | - | No | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | -55°C ~ 155°C | - | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.05% | e0 | - | - | 2 | - | - | ±25ppm/°C | - | - | 14.5 kOhms | - | Tin/Lead (Sn/Pb) | - | - | Thin Film | - | - | - | 0.063W, 1/16W | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | - | - | - | - | - | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | - | 225 | - | 1.27 mm | - | - | - | compliant | - | - | - | 68 | - | S-PQCC-J68 | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 6000 | - | - | - | - | - | - | - | - | - | - | - | - | 1.7 ns | - | 547 | - | - | - | - | - | 6000 | Moisture Resistant | - | 0.022 (0.55mm) | 24.2316 mm | 24.2316 mm | - | - | - | - | - | - | ||
A42MX09-TQ176M Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 176 | Male | Male | Q-0D0520 | RG-316 | 117 MHz | - | - | - | - | 4 GHz | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A42MX09-TQ176M | - | - | Amphenol Custom Cable | 3 | - | 125 °C | -55 °C | 50 Ohms | Bag | PLASTIC/EPOXY | LFQFP | LFQFP, QFP176,1.0SQ,20 | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | Active | 30 | 5.23 | - | No | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | - | - | e0 | - | - | - | - | 3A001.A.2.C | - | - | - | - | - | TIN LEAD | - | - | - | Copper | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | - | CMOS | - | QUAD | GULL WING | - | 225 | - | 0.5 mm | - | BNC to TNC | - | compliant | - | - | - | 176 | - | S-PQFP-G176 | 104 | Not Qualified | - | - | - | - | - | - | - | - | - | 3.3,3.3/5,5 V | MILITARY | - | - | - | - | - | - | - | - | 104 | 684 CLBS, 14000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | BNC Plug, Right Angle | TNC Plug | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5 ns | - | 684 | 684 | - | - | - | - | 14000 | Shielded | - | - | 39.4 (1.0m) 3.3 | 24 mm | - | - | - | - | - | - | ||
A3P250L-1PQ208 Microchip | In Stock | - | - | - | - | - | 1206 (3216 Metric) | YES | - | - | 1206 | - | 208 | - | - | RN732B | - | 350 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A3P250L-1PQ208 | - | - | KOA Speer Electronics, Inc. | 3 | - | 70 °C | - | - | Tape & Reel (TR) | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | Obsolete | 30 | 5.27 | - | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | -55°C ~ 155°C | - | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.25% | e0 | - | - | 2 | - | - | ±50ppm/°C | - | - | 5.05 kOhms | - | Tin/Lead (Sn/Pb) | - | - | Thin Film | - | - | - | 0.125W, 1/8W | - | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | - | CMOS | - | QUAD | GULL WING | - | 225 | - | 0.5 mm | - | - | - | compliant | - | - | - | - | - | S-PQFP-G208 | 151 | Not Qualified | - | - | - | - | - | - | - | - | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | 151 | 6144 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 6144 | 6144 | - | - | - | - | 250000 | Moisture Resistant | - | 0.028 (0.70mm) | 28 mm | 28 mm | - | - | - | - | - | - | ||
A54SX16-CQ208M Microchip | In Stock | - | - | - | - | Chassis, Stud Mount | TO-209AE, TO-118-4, Stud | YES | - | - | TO-209AE (TO-118) | - | 208 | - | - | ST333 | - | 205 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A54SX16-CQ208M | - | - | Vishay General Semiconductor - Diodes Division | - | - | 125 °C | -55 °C | - | Bulk | CERAMIC, METAL-SEALED COFIRED | QFF | CERAMIC, QFP-208 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Obsolete | - | Active | 20 | 5.26 | - | No | - | 3.63 V | 2.97 V | 3.3 V | - | - | 800 V | - | -40°C ~ 125°C | - | - | - | - | e0 | - | - | - | - | 3A001.A.2.C | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | - | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | - | CMOS | - | QUAD | FLAT | - | 225 | - | 0.5 mm | - | - | - | compliant | - | - | - | - | - | S-CQFP-F208 | 172 | Not Qualified | - | - | - | - | - | - | - | - | - | 3.3,5 V | MILITARY | - | - | - | - | - | - | - | - | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 3 V | 11000A, 11520A | 200 mA | 600 mA | 518 A | - | 1 ns | - | 1452 | 1452 | 330 A | Standard Recovery | 1.96 V | 50 mA | 16000 | - | - | - | 29.21 mm | 29.21 mm | - | - | - | - | - | - | ||
A1460A-PQ208I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 208 | - | - | D38999/26TB | - | 100 MHz | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | - | Microsemi Corporation | A1460A-PQ208I | - | - | Corsair | 3 | - | 85 °C | -40 °C | - | Bag | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-208 | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | Active | 30 | 5.85 | - | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | * | - | - | e0 | - | - | - | - | - | - | - | - | - | - | TIN LEAD | - | - | - | - | - | - | - | MAX 167 I/OS | 8542.39.00.01 | - | - | - | - | - | - | CMOS | - | QUAD | GULL WING | - | 225 | - | 0.5 mm | - | - | - | compliant | - | - | - | - | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | - | - | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3 ns | - | 848 | - | - | - | - | - | 6000 | - | - | - | 28 mm | 28 mm | - | - | - | - | - | - |