- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Approvals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Protections | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Terminal Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A54SX72A-1PQ208 Microchip | In Stock | - | - | - | - | Surface Mount | 208-BFQFP | YES | - | 208-PQFP (28x28) | - | 208 | - | A54SX72A | - | 250 MHz | - | MICROSEMI CORP | Microsemi Corporation | A54SX72A-1PQ208 | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 171 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | Obsolete | 30 | 5.25 | - | No | - | 2.75 V | 2.25 V | 2.5 V | - | - | - | 0°C ~ 70°C (TA) | - | SX-A | e0 | Tin/Lead (Sn/Pb) | - | - | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 225 | 0.5 mm | unknown | - | - | - | S-PQFP-G208 | 171 | Not Qualified | - | 2.5,3.3/5 V | COMMERCIAL | - | - | - | - | - | - | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 108000 | - | 6036 | - | - | - | 1.3 ns | 6036 | 6036 | 108000 | - | - | 28 mm | 28 mm | - | ||
EX256-FTQ100 Microchip | 90 | - | - | - | - | Surface Mount | 100-LQFP | - | - | 100-TQFP (14x14) | - | - | - | EX256 | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | 81 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 70°C (TA) | - | EX | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 | - | - | 12000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
A42MX16-2PQ160I Microchip | In Stock | - | - | - | - | Surface Mount | 160-BQFP | YES | - | 160-PQFP (28x28) | - | 160 | - | A42MX16 | - | 117 MHz | - | MICROSEMI CORP | Microsemi Corporation | A42MX16-2PQ160I | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 125 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | QFP | Obsolete | 30 | 5.24 | - | No | - | 3.6 V | 3 V | 3.3 V | - | - | - | -40°C ~ 85°C (TA) | - | MX | e0 | Tin/Lead (Sn/Pb) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 225 | 0.65 mm | compliant | - | - | 160 | S-PQFP-G160 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | 1232 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 24000 | - | - | - | - | - | 2.1 ns | 1232 | - | 24000 | - | - | 28 mm | 28 mm | - | ||
M2GL090T-1FGG676I Microchip | 2244 | - | - | Production (Last Updated: 2 months ago) | - | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | - | 676 | - | M2GL090 | - | - | - | MICROSEMI CORP | Microsemi Corporation | M2GL090T-1FGG676I | - | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | - | 3 | - | SMD/SMT | 425 | - | 86184 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.27 | Compliant | Yes | - | 1.2 V | 1.2 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | IGLOO2 | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | - | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | 323.3 kB | - | - | 425 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 86316 | - | 2648064 | - | - | - | 1 | 4 Transceiver | - | - | - | 86316 | - | - | - | 27 mm | 27 mm | - | ||
A3PN030-Z2QNG48I Microchip | In Stock | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | - | - | 48-QFN (6x6) | - | - | - | A3PN030 | - | - | - | - | - | - | - | - | - | Kamaya Inc. | - | - | - | - | - | - | 34 | - | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | * | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 30000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
M1A3P1000L-1FGG256I Microchip | 2433 |
| - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | 256 | - | M1A3P1000 | - | 350 MHz | - | MICROSEMI CORP | Microsemi Corporation | M1A3P1000L-1FGG256I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 177 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.26 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | - | S-PBGA-B256 | 177 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 147456 | 1000000 | - | - | 1 | - | - | - | 24576 | 24576 | 1000000 | - | - | 17 mm | 17 mm | - | ||
M2GL005S-1FG484I Microchip | 9 |
| - | Production (Last Updated: 2 months ago) | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | CSA, IEC, UL | M2GL005 | - | - | - | MICROSEMI CORP | ABB | XT4SU3060AFF000XXX | - | - | - | Microchip Technology | - | - | - | 3 | Panel | - | 209 | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.3 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | 60 A | - | - | S-PBGA-B484 | 209 | Not Qualified | - | 1.2 V | - | - | - | - | 87.9 kB | Branch Circuit | - | 209 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | Bolt-On | 6060 | - | 719872 | - | - | - | - | - | - | - | - | 6060 | - | - | - | 23 mm | 23 mm | - | ||
AX500-1PQ208 Microchip | In Stock | - | - | - | - | Surface Mount | 208-BFQFP | - | - | 208-PQFP (28x28) | - | - | - | AX500 | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | 115 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 70°C (TA) | - | Axcelerator | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 500000 | - | 8064 | - | - | - | - | - | - | - | - | - | - | - | - | ||
A3P030-VQG100 Microchip | 4840 | - | - | - | - | Surface Mount | 100-TQFP | YES | - | 100-VQFP (14x14) | - | 100 | - | A3P030 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P030-VQG100 | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | SMD/SMT | 77 | - | 330 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | - | Active | 40 | 1.32 | Details | Yes | FPGA - Field Programmable Gate Array ProASIC3 | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.017637 oz | 0 to 70 °C | Tray | ProASIC3 | e3 | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | - | S-PQFP-G100 | - | Not Qualified | 1.5 V | - | COMMERCIAL | - | - | 2 mA | - | - | - | - | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - Field Programmable Gate Array | - | 30000 | - | - | STD | - | - | - | 768 | - | 30000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | - | ||
A54SX16-2TQG176 Microchip | In Stock | - | - | - | - | Surface Mount | 176-LQFP | YES | - | 176-TQFP (24x24) | - | 176 | - | A54SX16 | - | 320 MHz | - | MICROSEMI CORP | Microsemi Corporation | A54SX16-2TQG176 | - | 3.63, 5.25 V | - | Microchip Technology | 2.97, 4.75 V | - | - | 3 | - | - | 147 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | LFQFP | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | - | Active | 40 | 5.24 | - | Yes | - | 3.6 V | 3 V | 3.3 V | - | 3.3, 5 V | - | 0 to 70 °C | - | SX | e3 | Matte Tin (Sn) | - | - | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | - | S-PQFP-G176 | 147 | Not Qualified | - | 3.3,5 V | COMMERCIAL | - | - | - | - | - | - | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 24000 | - | 1452 | 2 | - | - | 0.7 ns | 1452 | 1452 | 16000 | - | - | 24 mm | 24 mm | - | ||
APA750-FGG896 Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | - | APA750 | - | 180 MHz | - | MICROSEMI CORP | Microsemi Corporation | APA750-FGG896 | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 562 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.26 | Compliant | Yes | - | 2.7 V | 2.3 V | 2.5 V | - | 2.5000 V | - | 0 to 70 °C | - | ProASICPLUS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | - | 180 MHz | 896 | S-PBGA-B896 | 562 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | - | 18 kB | - | - | 562 | 750000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 147456 | 750000 | 180 MHz | - | STD | - | 32768 | - | - | 32768 | 750000 | - | 1.73 mm | 31 mm | 31 mm | No | ||
A3P1000L-1FGG256I Microchip | 2217 |
| - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | 256 | - | A3P1000 | - | 350 MHz | - | MICROSEMI CORP | Microsemi Corporation | A3P1000L-1FGG256I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 177 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | Active | 40 | 5.26 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | - | S-PBGA-B256 | 177 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 147456 | 1000000 | - | - | 1 | - | - | - | 24576 | 24576 | 1000000 | - | - | 17 mm | 17 mm | - | ||
AX500-FG676 Microchip | 627 |
| - | - | - | Surface Mount | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | AX500 | - | - | - | - | - | - | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | - | - | - | 336 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | - | 0 to 70 °C | - | Axcelerator | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 500000 | - | 8064 | STD | - | - | - | - | - | - | - | - | - | - | - | ||
EX128-PTQG100 Microchip | 2572 |
| - | - | - | Surface Mount | 100-LQFP | YES | - | 100-TQFP (14x14) | - | 100 | - | EX128 | - | 357 MHz | - | MICROSEMI CORP | Microsemi Corporation | EX128-PTQG100 | - | 2.7 V | - | Microchip Technology | 2.3 V | - | - | 3 | - | - | 70 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | - | Active | 40 | 2.06 | - | Yes | - | 2.7 V | 2.3 V | 2.5 V | - | 2.5000 V | - | 0 to 70 °C | - | EX | e3 | Matte Tin (Sn) | - | - | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | - | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | - | S-PQFP-G100 | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | 6000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 256 | - | - | 6000 | - | - | P | - | - | 0.7 ns | - | - | 6000 | - | - | 14 mm | 14 mm | - | ||
A3P600L-1FG484I Microchip | 2801 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | - | A3P600 | - | 350 MHz | - | MICROSEMI CORP | Microsemi Corporation | A3P600L-1FG484I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 235 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.24 | Compliant | No | - | 1.575 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | e0 | TIN LEAD | 85 °C | -40 °C | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | - | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | - | - | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 110592 | 600000 | 892.86 MHz | - | 1 | - | 13824 | - | 13824 | 13824 | 600000 | - | 1.73 mm | 23 mm | 23 mm | No | ||
A54SX16P-TQG176I Microchip | In Stock | - | - | - | - | Surface Mount | 176-LQFP | - | - | 176-TQFP (24x24) | - | - | - | A54SX16 | - | - | - | - | - | - | - | 3.63, 5.5 V | - | Microchip Technology | 2.97, 4.5 V | - | - | - | - | - | 147 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 3.3, 5 V | - | -40 to 85 °C | - | SX | - | - | - | - | - | - | - | - | 3V ~ 3.6V, 4.75V ~ 5.25V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24000 | - | 1452 | STD | - | - | - | - | - | - | - | - | - | - | - | ||
AGL600V2-CSG281 Microchip | 2755 |
| - | - | - | Surface Mount | 281-TFBGA, CSBGA | YES | - | 281-CSP (10x10) | - | 281 | - | AGL600 | - | 108 MHz | - | MICROSEMI CORP | Microsemi Corporation | AGL600V2-CSG281 | - | 1.575 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 215 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | NOT SPECIFIED | 5.32 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | - | 1.2, 1.5 V | - | 0 to 70 °C | - | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | - | 281 | S-PBGA-B281 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 13824 | - | 110592 | 600000 | - | - | STD | - | - | - | 13824 | - | 600000 | - | - | 10 mm | 10 mm | - | ||
M1AGL1000V2-FG144I Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | - | 144 | - | M1AGL1000 | - | 108 MHz | - | MICROSEMI CORP | Microsemi Corporation | M1AGL1000V2-FG144I | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 97 | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 30 | 1.79 | Non-Compliant | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 85°C (TA) | - | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | - | 8542.39.00.01 | - | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | 18 kB | - | - | - | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 24576 | - | 147456 | 1000000 | - | - | - | - | - | - | 24576 | - | 1000000 | - | - | 13 mm | 13 mm | - | ||
A54SX32-TQG144 Microchip | In Stock | - | - | - | - | Surface Mount | 144-LQFP | YES | - | 144-TQFP (20x20) | - | 144 | - | A54SX32 | - | 240 MHz | - | MICROSEMI CORP | Microsemi Corporation | A54SX32-TQG144 | - | 3.63, 5.25 V | - | Microchip Technology | 2.97, 4.75 V | - | - | 3 | - | - | 113 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | - | Active | 40 | 5.24 | - | Yes | - | 3.6 V | 3 V | 3.3 V | - | 3.3, 5 V | - | 0 to 70 °C | - | SX | e3 | Matte Tin (Sn) | - | - | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | - | S-PQFP-G144 | 113 | Not Qualified | - | 3.3,5 V | COMMERCIAL | - | - | - | - | - | - | 113 | 2880 CLBS, 32000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 48000 | - | 2880 | STD | - | - | 0.9 ns | 2880 | 2880 | 32000 | - | - | 20 mm | 20 mm | - | ||
A54SX16P-2VQG100I Microchip | In Stock | - | - | - | - | Surface Mount | 100-TQFP | YES | - | 100-VQFP (14x14) | - | 100 | - | A54SX16 | - | 320 MHz | - | MICROSEMI CORP | Microsemi Corporation | A54SX16P-2VQG100I | - | 3.63, 5.5 V | - | Microchip Technology | 2.97, 4.5 V | - | - | 3 | - | - | 81 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | - | Active | 40 | 5.24 | - | Yes | - | 3.6 V | 3 V | 3.3 V | - | 3.3, 5 V | - | -40 to 85 °C | - | SX | e3 | Matte Tin (Sn) | - | - | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | - | - | - | S-PQFP-G100 | 81 | Not Qualified | - | 3.3,3.3/5 V | INDUSTRIAL | - | - | - | - | - | - | 81 | 1452 CLBS, 16000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 24000 | - | 1452 | 2 | - | - | 0.7 ns | 1452 | 1452 | 16000 | - | - | 14 mm | 14 mm | - |