- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Weight | Number of Terminals | Angle | Approvals | Base Product Number | Cable Style | Cable Types | Case Size | Case Style | Clock Frequency-Max | Connections | Grip Type | Ihs Manufacturer | Jacket Material | Manufacturer | Manufacturer Part Number | Maximum Cable Diameter (mm) | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Cable Diameter (mm) | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shaft Type | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Series | JESD-609 Code | Termination | Connector Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Output Voltage | Output Type | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Protections | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Input Voltage | Strain Relief | Bearings | IP Rating | Mating Connector | Height | Length | Width | Radiation Hardening |
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![]() APA075-FG144I Microchip | 2748 |
| - | - | - | Surface Mount | 144-LBGA | - | - | 144-FPBGA (13x13) | - | - | - | - | - | - | APA075 | - | - | - | - | - | - | - | - | - | Hammond Power Solutions | SG3 | - | - | - | Microchip Technology | - | - | - | - | - | - | 100 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 2.5000 V | -40 to 85 °C | ProASICPLUS | - | - | - | - | - | - | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 27648 | 75000 | - | - | STD | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M1AFS1500-2FGG676I Microchip | 777 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | Polyamide | - | 400.011771 mg | 676 | Straight | - | M1AFS1500 | Round | - | - | - | - | - | Bushing Grip with Strain Relief | MICROSEMI CORP | - | Altech | 5316301 | 8 mm | - | - | Microchip Technology | 8 mm | - | - | 3 | - | - | 252 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | - | 40 | 5.3 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | Fusion® | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | Non-Metallic | - | - | 8542.39.00.01 | - | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | - | 250 | 1 mm | compliant | - | - | - | - | S-PBGA-B676 | - | Not Qualified | - | - | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1.5e+06 | 1.47059 GHz | - | 2 | - | 38400 | - | 38400 | - | 1500000 | - | - | - | IP68 | - | 1.73 mm | 27 mm | 27 mm | No | ||
![]() AX500-FG676I Microchip | 2777 |
| - | - | - | Surface Mount | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | - | - | - | AX500 | - | - | - | - | - | - | - | - | - | Miscellaneous | - | - | 1.575 V | - | Microchip Technology | - | 1.425 V | - | - | - | - | 336 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | -40 to 85 °C | Axcelerator | - | - | - | - | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 500000 | - | 8064 | STD | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() AX250-2FG256I Microchip | 2961 |
| - | - | - | Surface Mount | 256-LBGA | - | - | 256-FPBGA (17x17) | - | Stainless Steel | - | - | - | - | AX250 | - | - | - | - | - | - | - | - | - | Grace Technologies | P-D4R2-M5R3 | - | 1.575 V | - | Microchip Technology | - | 1.425 V | - | - | - | - | 138 | - | (1) 120V Receptacle | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | -40 to 85 °C | Axcelerator | - | - | - | - | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 55296 | 250000 | - | 4224 | 2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() A40MX02-FVQG80 Microchip | 26 |
| - | - | - | Surface Mount | 80-TQFP | YES | - | 80-VQFP (14x14) | - | Aluminum | - | 80 | - | - | A40MX02 | - | - | - | - | 48 MHz | - | - | MICROSEMI CORP | - | Grace Technologies | P-D4R3-K3R3 | - | 5.25 V | - | Microchip Technology | - | 3 V | - | 3 | - | - | 57 | - | (1) 120V Receptacle | 70 °C | - | Tray | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Active | Active | - | 40 | 5.26 | - | Yes | - | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | 0 to 70 °C | MX | e3 | - | - | Matte Tin (Sn) | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | - | 260 | 0.65 mm | compliant | - | - | - | - | S-PQFP-G80 | - | Not Qualified | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | 295 CLBS, 3000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 3000 | - | - | F | - | - | 3.7 ns | 295 | - | 3000 | - | - | - | IP65 | - | - | 14 mm | 14 mm | - | ||
![]() AFS1500-2FGG676I Microchip | 919 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | - | 676 | 676-FBGA (27x27) | - | - | 400.011771 mg | - | - | - | AFS1500 | - | - | 2.5 | Lower Mount | - | 1/4 NPT | - | - | - | NOSHOK | 25-400-60-psi/kPa | - | - | - | Microchip Technology | - | - | - | - | - | - | 252 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | 0-60 psi | - | - | Compliant | - | - | - | - | - | 1.5000 V | -40 to 85 °C | Fusion® | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | 33.8 kB | - | - | - | - | - | - | - | 276480 | 1.5e+06 | 1.47059 GHz | - | 2 | - | 38400 | - | - | - | - | - | - | - | - | - | 1.73 mm | 27 mm | 27 mm | No | ||
![]() AGL600V2-CSG281I Microchip | 2564 | - | - | - | - | Surface Mount | 281-TFBGA, CSBGA | YES | - | 281-CSP (10x10) | - | - | - | 281 | - | - | AGL600 | - | - | - | - | 108 MHz | - | - | MICROSEMI CORP | - | Microsemi Corporation | AGL600V2-CSG281I | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 215 | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | - | NOT SPECIFIED | 1.61 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | - | NOT SPECIFIED | 0.5 mm | compliant | - | - | - | 281 | S-PBGA-B281 | - | Not Qualified | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | STD | - | - | - | 13824 | - | 600000 | - | - | - | - | - | - | 10 mm | 10 mm | - | ||
![]() A3P1000L-FG256I Microchip | 2961 |
| - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | - | - | 256 | - | - | A3P1000 | - | - | - | - | 350 MHz | - | - | MICROSEMI CORP | - | Greenlee | A3P1000L-FG256I | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 177 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | - | 30 | 1.57 | - | No | - | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | - | 225 | 1 mm | compliant | - | - | - | - | S-PBGA-B256 | 177 | Not Qualified | - | - | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | STD | - | - | - | 24576 | 24576 | 1000000 | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
![]() AFS1500-2FGG676 Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | - | 676 | 676-FBGA (27x27) | - | Aluminum | 400.011771 mg | - | - | - | AFS1500 | - | - | - | - | - | - | - | - | - | Grace Technologies | P-E5-M4RU0 | - | 1.575 V | - | Microchip Technology | - | 1.425 V | - | - | - | - | 252 | - | (1) Indian Receptacle | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | Compliant | - | - | - | - | - | 1.5000 V | 0 to 70 °C | Fusion® | - | - | - | - | 70 °C | 0 °C | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | 33.8 kB | - | - | - | - | - | - | - | 276480 | 1.5e+06 | 1.47059 GHz | - | 2 | - | 38400 | - | - | - | - | - | - | - | - | - | 1.73 mm | 27 mm | 27 mm | No | ||
![]() APA075-TQG144I Microchip | 2594 | - | - | - | - | Surface Mount | 144-LQFP | YES | - | 144-TQFP (20x20) | - | - | - | 144 | - | CE, CSA, UL | APA075 | - | - | - | - | 180 MHz | - | - | MICROSEMI CORP | - | Cutler Hammer, Div of Eaton Corp | PDG52P1200P2WM | - | 2.7 V | - | Microchip Technology | - | 2.3 V | - | 3 | Panel | - | 107 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | - | 40 | 5.3 | - | Yes | - | 2.7 V | 2.3 V | 2.5 V | 2.5000 V | -40 to 85 °C | ProASICPLUS | e3 | - | - | Matte Tin (Sn) | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | - | 260 | 0.5 mm | compliant | 1,200 A | - | - | - | S-PQFP-G144 | 107 | Not Qualified | - | - | - | 2.5,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | 107 | 75000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 27648 | 75000 | - | - | STD | - | - | - | - | 3072 | 75000 | - | - | - | - | - | - | 20 mm | 20 mm | - | ||
![]() AFS1500-FG676 Microchip | 2492 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | - | 676 | 676-FBGA (27x27) | - | - | 400.011771 mg | - | - | CE, CSA, IEC, UL | AFS1500 | - | - | - | - | - | - | - | - | - | Cutler Hammer, Div of Eaton Co | LGC325039B22G | - | 1.575 V | - | Microchip Technology | - | 1.425 V | - | - | - | - | 252 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | No | - | - | - | - | - | 1.5000 V | 0 to 70 °C | Fusion® | - | - | - | - | 70 °C | 0 °C | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | 250 A | 1.0989 GHz | - | - | - | - | - | - | - | 1.5 V | - | - | 1.575 V | 1.425 V | 33.8 kB | Ground Fault | - | - | - | - | - | - | 276480 | 1.5e+06 | 1.0989 GHz | - | STD | - | 38400 | - | - | - | - | - | - | - | - | - | 1.73 mm | 27 mm | 27 mm | No | ||
![]() A54SX16P-VQG100 Microchip | In Stock | - | - | - | - | Surface Mount | 100-TQFP | YES | - | 100-VQFP (14x14) | - | - | - | 100 | - | - | A54SX16 | - | - | - | - | 240 MHz | - | - | MICROSEMI CORP | - | Meder Electric | DIP12-1A75-11D | - | 3.63, 5.25 V | - | Microchip Technology | - | 2.97, 4.75 V | - | 3 | - | - | 81 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | - | 40 | 5.24 | - | Yes | - | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | 0 to 70 °C | SX | e3 | - | - | Matte Tin (Sn) | - | - | - | - | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | - | 260 | 0.5 mm | compliant | - | - | - | - | S-PQFP-G100 | 81 | Not Qualified | - | - | - | 3.3,3.3/5 V | COMMERCIAL | - | - | - | - | - | 81 | 1452 CLBS, 16000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 24000 | - | 1452 | STD | - | - | 0.9 ns | 1452 | 1452 | 16000 | - | - | - | - | - | - | 14 mm | 14 mm | - | ||
![]() A40MX02-FPQG100 Microchip | 26 |
| - | - | - | Surface Mount | 100-BQFP | YES | - | 100-PQFP (20x14) | - | - | - | 100 | - | - | A40MX02 | - | - | - | - | 48 MHz | - | - | MICROSEMI CORP | - | Danaher Controls | HS3502408310D | - | - | - | Microchip Technology | - | - | - | 3 | - | Hollowshaft | 57 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Active | Active | - | 40 | 5.26 | - | Yes | Hollow | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | -40 to 70 Degrees C | MX | e3 | 10 ft Cable | - | Matte Tin (Sn) | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | - | 245 | 0.65 mm | compliant | - | - | - | - | R-PQFP-G100 | - | Not Qualified | 5~26 VDC | Single Ended | - | - | COMMERCIAL | - | - | - | - | - | - | 295 CLBS, 3000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 3000 | - | - | F | - | - | 3.7 ns | 295 | - | 3000 | 5~26 VDC | - | Yes | IP67 | Not Included | - | 20 mm | 14 mm | - | ||
![]() AGLE600V5-FGG256 Microchip | In Stock | - | - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | - | - | 256 | - | - | AGLE600 | - | - | - | - | 250 MHz | - | - | MICROSEMI CORP | - | ABB | AGLE600V5-FGG256 | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 165 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | - | 40 | 5.3 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOOe | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | - | 250 | 1 mm | compliant | - | - | - | - | S-PBGA-B256 | 165 | Not Qualified | - | - | - | 1.5 V | COMMERCIAL | - | - | - | - | - | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | STD | - | - | - | 13824 | 13824 | 600000 | - | - | - | - | - | - | 17 mm | 17 mm | - | ||
![]() A54SX32A-FG256I Microchip | 2142 |
| - | - | - | Surface Mount | 256-BGA | - | - | 256-FPBGA (17x17) | - | - | - | - | - | UL | A54SX32 | - | Cat 5e | - | - | - | - | - | - | TPE | Turck | UX04355 | - | 2.75 V | - | Microchip Technology | - | 2.25 V | - | - | - | - | 203 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 2.5000 V | -40 to 85 °C | SX-A | - | - | RJ45 | - | - | - | - | Teal | - | - | - | - | 2.25V ~ 5.25V | - | - | Yes | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 48000 | - | 2880 | STD | - | - | - | - | - | - | - | No | - | - | - | - | 190 Feet | - | - | ||
![]() M2GL150-1FCG1152I Microchip | 2081 | - | - | - | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | - | - | - | 1152 | - | - | M2GL150 | - | - | 2.5 | Lower Mount | - | 1/4 NPT | - | MICROSEMI CORP | - | NOSHOK | 25-410-30/60-psi/bar | - | 1.26 V | + 100 C | Microchip Technology | - | 1.14 V | - 40 C | 4 | - | SMD/SMT | 574 | 146124 LE | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | -30 Hg-60 psi | - | 5.3 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | IGLOO2 | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | 1.14V ~ 2.625V | BOTTOM | BALL | - | 260 | 1 mm | compliant | - | - | 30 | - | S-PBGA-B1152 | 574 | Not Qualified | - | - | - | 1.2 V | - | - | - | - | - | 667 Mb/s | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | - | - | - | 1 | 16 Transceiver | - | - | - | 146124 | - | - | - | - | - | - | - | 35 mm | 35 mm | - | ||
![]() APA750-FG896I Microchip | In Stock | - | - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | - | 896 | 896-FBGA (31x31) | - | - | 400.011771 mg | - | - | - | APA750 | - | - | 2.5 | Lower Mount | - | 1/4 NPT | - | - | - | NOSHOK | 25-410-30-vac/bar | - | 2.7 V | - | Microchip Technology | - | 2.3 V | - | - | - | - | 562 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | -30 Hg-0 psi | - | - | Compliant | - | - | - | - | - | 2.5000 V | -40 to 85 °C | ProASICPLUS | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | - | 2.3V ~ 2.7V | - | - | - | - | - | - | - | 180 MHz | - | 896 | - | - | - | - | - | 2.5 V | - | - | 2.7 V | 2.3 V | 18 kB | - | - | - | - | - | - | - | 147456 | 750000 | 180 MHz | - | STD | - | 32768 | - | - | - | - | - | - | - | - | - | 1.73 mm | 31 mm | 31 mm | No | ||
![]() AGLN060V2-CSG81I Microchip | 26 |
| - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | - | - | 81 | - | - | AGLN060 | - | - | - | - | - | - | - | MICROSEMI CORP | - | Clarostat-Honeywell | CR25-100 | - | 1.575 V | - | Microchip Technology | - | 1.14 V | - | 3 | - | - | 60 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | - | NOT SPECIFIED | 2.07 | - | Yes | - | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO nano | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 8542.39.00.01 | - | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | - | NOT SPECIFIED | 0.5 mm | compliant | - | - | - | - | S-PBGA-B81 | - | Not Qualified | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | - | - | STD | - | - | - | 1536 | - | 60000 | - | - | - | - | - | - | 5 mm | 5 mm | - | ||
![]() AX500-2FGG676 Microchip | 2106 |
| - | - | - | Surface Mount | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | - | - | - | AX500 | - | - | - | - | - | - | - | - | - | Murrelektronik | 25342 | - | - | - | Microchip Technology | - | - | - | - | - | - | 336 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | 0 to 70 °C | Axcelerator | - | - | - | - | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 500000 | - | 8064 | 2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M1AFS1500-1FGG676 Microchip | 2928 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | - | - | 400.011771 mg | 676 | - | - | M1AFS1500 | - | - | - | - | - | - | - | MICROSEMI CORP | - | ILME | M1AFS1500-1FGG676 | - | 1.575 V | - | Microchip Technology | - | 1.425 V | - | 3 | - | - | 252 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | - | SQUARE | GRID ARRAY | Active | Active | - | 40 | 5.3 | Compliant | Yes | - | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | Fusion® | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | - | - | 8542.39.00.01 | - | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | - | 250 | 1 mm | compliant | - | - | - | - | S-PBGA-B676 | - | Not Qualified | - | - | 1.5 V | - | OTHER | 1.575 V | 1.425 V | 33.8 kB | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 276480 | 1.5e+06 | 1.28205 GHz | - | 1 | - | 38400 | - | 38400 | - | 1500000 | - | - | - | - | - | 1.73 mm | 27 mm | 27 mm | No |