- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Weight | Number of Terminals | Approvals | Base Product Number | Brand | Cable Types | Clock Frequency-Max | Enclosure | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Jacket Material | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Termination | ECCN Code | Connector Type | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Protections | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | RPM | Bearing Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Overall Length | Mode of Operation | Product Category | Strain Relief | Contacts | Phase | IP Rating | Height | Length | Width | Radiation Hardening |
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![]() M1A3PE3000-2FGG484I Microchip | 934 |
| - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | - | 484 | - | M1A3PE3000 | Microchip Technology / Atmel | - | 350 MHz | - | 60 | MICROSEMI CORP | - | Altech | 738-428 | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | - | SMD/SMT | 341 | 35000 LE | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Details | Yes | 1.575 V | 1.14 V | 1.5 V | - | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | ProASIC3E | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | - | 250 | 1 mm | compliant | - | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - Field Programmable Gate Array | - | - | 516096 | 3000000 | - | - | 2 | - | - | - | 75264 | 75264 | 3000000 | - | - | FPGA - Field Programmable Gate Array | - | - | - | - | 1.73 mm | 23 mm | 23 mm | - | ||
![]() A54SX32A-2TQG144 Microchip | 2175 |
| - | - | - | Surface Mount | 144-LQFP | YES | - | 144-TQFP (20x20) | - | - | 144 | - | A54SX32 | - | - | 313 MHz | - | - | MICROSEMI CORP | - | Turck | U-90298 | - | 2.75 V | - | Microchip Technology | 2.25 V | - | - | 3 | - | - | 113 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.25 | - | Yes | 2.75 V | 2.25 V | 2.5 V | - | - | 2.5000 V | - | 0 to 70 °C | - | SX-A | e3 | - | - | - | - | Matte Tin (Sn) | - | - | - | - | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | - | 260 | 0.5 mm | compliant | - | S-PQFP-G144 | 113 | Not Qualified | - | 2.5,3.3/5 V | COMMERCIAL | - | - | - | - | - | - | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 48000 | - | 2880 | 2 | - | - | 0.9 ns | 2880 | 2880 | 48000 | - | - | - | - | - | - | - | - | 20 mm | 20 mm | - | ||
![]() A54SX16A-2PQG208I Microchip | 2949 |
| - | - | - | Surface Mount | 208-BFQFP | YES | - | 208-PQFP (28x28) | - | - | 208 | - | A54SX16 | - | - | 294 MHz | - | - | MICROSEMI CORP | - | Cutler Hammer, Div of Eaton Corp | DD367NWKW-00V3 | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 175 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ | QFP208,1.2SQ | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.25 | - | Yes | 2.75 V | 2.25 V | 2.5 V | - | - | 2.5000 V | - | -40 to 85 °C | - | SX-A | - | - | - | - | - | - | - | - | - | - | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | - | 245 | 0.5 mm | compliant | - | S-PQFP-G208 | 175 | Not Qualified | - | 2.5,3.3/5 V | INDUSTRIAL | - | - | - | - | - | - | 175 | 1452 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 24000 | - | 1452 | 2 | - | - | 1 ns | 1452 | 1452 | 24000 | - | - | - | - | - | - | - | - | 28 mm | 28 mm | - | ||
![]() A3P600L-1FGG144I Microchip | 2911 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | - | 400.011771 mg | 144 | - | A3P600 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | Arrow Hart - Cooper Wiring Devices | 738B-BOX | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 97 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | - | 260 | 1 mm | compliant | - | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | - | - | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 110592 | 600000 | 892.86 MHz | - | 1 | - | 13824 | - | 13824 | 13824 | 600000 | - | - | - | - | - | - | - | 1.05 mm | 13 mm | 13 mm | No | ||
![]() AX500-1FG676 Microchip | 2922 |
| - | - | - | Foot Mount,Rigid | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | CSA, UL | AX500 | - | - | - | Totally Enclosed Fan Cooled | - | - | - | Lincoln Electric | LM60036 | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | - | - | - | 336 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | - | 0 to 70 °C | - | Axcelerator | - | - | - | - | General Purpose | - | - | - | Cast Iron | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1,200 RPM | Ball | 73728 | 500000 | - | 8064 | 1 | - | - | - | - | - | - | 24.92 | - | - | - | - | 3 | - | - | - | - | - | ||
![]() M1AFS1500-1FG676 Microchip | In Stock | - | - | - | - | Surface Mount | 676-BGA | YES | - | 676-FBGA (27x27) | - | - | 676 | UL | M1AFS1500 | - | Cat 5e | - | - | - | MICROSEMI CORP | TPE | Turck | U-97917 | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | 252 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | 0 to 70 °C | - | Fusion® | e0 | - | - | RJ45 | - | Tin/Lead (Sn/Pb) | - | - | - | Teal | - | 8542.39.00.01 | - | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | No | 225 | 1 mm | compliant | - | S-PBGA-B676 | - | Not Qualified | - | - | OTHER | - | - | - | - | - | - | - | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 276480 | 1500000 | - | - | 1 | - | - | - | 38400 | - | 1500000 | - | - | - | No | - | - | - | - | 16 Feet | 25 mm | - | ||
![]() A42MX09-PQG160I Microchip | In Stock | - | - | - | - | Surface Mount | 160-BQFP | YES | - | 160-PQFP (28x28) | Aluminum | - | 160 | - | A42MX09 | - | - | 117 MHz | - | - | MICROSEMI CORP | - | Grace Technologies | P-D4P1#2P11#2R2-K3RX | - | 5.5 V | - | Microchip Technology | 3 V | - | - | 3 | - | - | 101 | - | None | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Active | Active | 40 | 5.27 | - | Yes | 3.6 V | 3 V | 3.3 V | - | - | 3.3, 5 V | - | -40 to 85 °C | - | MX | e3 | - | - | - | - | Matte Tin (Sn) | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | - | 245 | 0.65 mm | compliant | - | S-PQFP-G160 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | 684 CLBS, 14000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 14000 | - | - | STD | - | - | 2.5 ns | 684 | - | 14000 | - | - | - | - | - | - | IP65 | - | 28 mm | 28 mm | - | ||
![]() AX500-FGG676 Microchip | 896 |
| - | - | - | Surface Mount | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | - | AX500 | - | - | - | - | - | - | - | Turck | U-90539 | - | - | - | Microchip Technology | - | - | - | - | - | - | 336 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | - | 0 to 70 °C | - | Axcelerator | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 500000 | - | 8064 | STD | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() AGL030V5-CSG81I Microchip | 26 |
| - | - | - | Surface Mount | 81-WFBGA, CSBGA | YES | - | 81-CSP (5x5) | - | - | 81 | CE, CSA, IEC, UL | AGL030 | - | - | 108 MHz | - | - | MICROSEMI CORP | - | Cutler Hammer, Div of Eaton Co | LGC360038G | - | - | - | Microchip Technology | - | - | - | 3 | - | - | 66 | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.23 | No | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | -40 to 85 °C | - | IGLOO | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | - | NOT SPECIFIED | 0.5 mm | compliant | 600 A | S-PBGA-B81 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | Ground Fault | - | - | 768 CLBS, 30000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | - | - | - | - | 30000 | - | - | STD | - | - | - | 768 | - | 30000 | - | - | - | - | - | - | - | - | 5 mm | 5 mm | - | ||
![]() AGLP030V5-CSG289 Microchip | In Stock | - | - | - | - | Surface Mount | 289-TFBGA, CSBGA | YES | - | 289-CSP (14x14) | - | - | 289 | - | AGLP030 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | Johnson Controls | VH7281ES+3801E | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | 120 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA289,17X17,32 | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.26 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | 0 to 70 °C | - | IGLOO PLUS | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | - | NOT SPECIFIED | 0.8 mm | compliant | - | S-PBGA-B289 | 120 | Not Qualified | - | 1.5 V | COMMERCIAL | - | - | - | - | - | - | 120 | 792 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | - | - | - | - | 30000 | - | - | STD | - | - | - | 792 | 792 | 30000 | - | - | - | - | - | - | - | - | 14 mm | 14 mm | - | ||
![]() AX500-1FGG676I Microchip | In Stock | - | - | - | - | Surface Mount | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | - | AX500 | - | - | - | - | - | - | - | Fagor Automation | - | - | - | - | Microchip Technology | - | - | - | - | - | - | 336 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | - | -40 to 85 °C | - | Axcelerator | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 73728 | 500000 | - | 8064 | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() AGLE3000V2-FG484I Microchip | In Stock | - | - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | Aluminum | - | 484 | - | AGLE3000 | - | - | 250 MHz | - | - | MICROSEMI CORP | - | Grace Technologies | P-H7-F3R0 | - | 1.575 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 341 | - | (1) 120V Receptacle | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 85°C (TA) | - | IGLOOe | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | - | 230 | 1 mm | unknown | - | S-PBGA-B484 | 341 | Not Qualified | - | 1.2/1.5 V | INDUSTRIAL | - | - | - | - | - | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | - | - | - | 516096 | 3000000 | - | - | STD | - | - | - | 75264 | 75264 | 3000000 | - | - | - | - | - | - | IP65 | - | 23 mm | 23 mm | - | ||
![]() A3P1000L-FGG144 Microchip | 2988 |
| - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | - | 144 | - | A3P1000 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | Stego | 02524.0-07 | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 97 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.38 | - | Yes | 1.575 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | 0 to 70 °C | - | ProASIC3L | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | - | 260 | 1 mm | compliant | - | S-PBGA-B144 | 97 | Not Qualified | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 147456 | 1000000 | - | - | STD | - | - | - | 24576 | 24576 | 1000000 | - | - | - | - | - | - | - | - | 13 mm | 13 mm | - | ||
![]() AX250-2FG484I Microchip | In Stock | - | - | - | - | Socket | 484-BGA | - | - | 484-FPBGA (23x23) | - | - | - | CE, CSA, UL | AX250 | - | - | - | - | - | - | - | Macromatic | TD-83128-42 | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | - | - | - | 248 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Yes | - | - | - | - | 10 | - | 1.5000 V | - | -40 to 85 °C | - | Axcelerator | - | 8 Pin | - | - | - | - | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 55296 | 250000 | - | 4224 | 2 | - | - | - | - | - | - | - | Repeat Cycle | - | - | DPDT | - | - | - | - | - | - | ||
![]() AGL1000V5-FG144I Microchip | 2924 |
| - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | - | 144 | UL | AGL1000 | - | Cat 5e | 108 MHz | - | - | MICROSEMI CORP | TPE | Turck | UX07347 | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | 97 | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.55 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | -40 to 85 °C | - | IGLOO | e0 | - | - | RJ45 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | Blue | - | 8542.39.00.01 | - | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | No | 230 | 1 mm | unknown | - | S-PBGA-B144 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | - | - | - | 147456 | 1000000 | - | - | STD | - | - | - | 24576 | - | 1000000 | - | - | - | No | - | - | - | - | 13 Feet | 13 mm | - | ||
![]() A40MX04-1PQG100 Microchip | 2025 |
| - | - | - | Surface Mount | 100-BQFP | YES | - | 100-PQFP (20x14) | - | - | 100 | - | A40MX04 | - | - | 48 MHz | - | - | MICROSEMI CORP | - | Sick | A40MX04-1PQG100 | - | 5.25 V | - | Microchip Technology | 3 V | - | - | 3 | - | - | 69 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-100 | - | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.29 | - | Yes | 3.6 V | 3 V | 3.3 V | - | - | 3.3, 5 V | - | 0 to 70 °C | - | MX | e3 | - | - | - | - | Matte Tin (Sn) | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | - | 245 | 0.65 mm | compliant | - | R-PQFP-G100 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | 547 CLBS, 6000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 6000 | - | - | 1 | - | - | 2.3 ns | 547 | - | 6000 | - | - | - | - | - | - | - | - | 20 mm | 14 mm | - | ||
![]() M1AGL250V5-VQG100 Microchip | 26 |
| - | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 100-TQFP | YES | 100 | 100-VQFP (14x14) | - | - | 100 | - | M1AGL250 | - | - | 108 MHz | - | - | MICROSEMI CORP | - | Microsemi Corporation | M1AGL250V5-VQG100 | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | 68 | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.28 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | 1.5000 V | - | 0 to 70 °C | - | IGLOO | e3 | - | - | - | - | Matte Tin (Sn) | 70 °C | 0 °C | - | - | - | 8542.39.00.01 | - | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | - | 260 | 0.5 mm | compliant | - | S-PQFP-G100 | - | Not Qualified | 1.5 V | - | OTHER | 1.575 V | 1.425 V | - | 4.5 kB | - | - | - | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | - | - | - | 36864 | 250000 | - | - | STD | - | - | - | 6144 | - | 250000 | - | - | - | - | - | - | - | 1 mm | 14 mm | 14 mm | - | ||
![]() A3P1000L-FG144I Microchip | 2397 |
| - | - | - | Surface Mount | 144-LBGA | YES | - | 144-FPBGA (13x13) | - | - | 144 | CE, CSA, IEC, UL | A3P1000 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | Cutler Hammer, Div of Eaton Co | LGC363039B20ZGG | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | - | 97 | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | No | No | 1.575 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | e0 | - | 3A001.A.7.A | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | - | 225 | 1 mm | compliant | 630 A | S-PBGA-B144 | 97 | Not Qualified | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | Ground Fault | - | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 147456 | 1000000 | - | - | STD | - | - | - | 24576 | 24576 | 1000000 | - | - | - | - | - | - | - | - | 13 mm | 13 mm | - | ||
![]() A40MX02-PQG100 Microchip | 2651 |
| - | - | - | Surface Mount | 100-BQFP | YES | - | 100-PQFP (20x14) | - | - | 100 | CE, CSA, UL | A40MX02 | - | - | 80 MHz | - | - | MICROSEMI CORP | - | Cutler Hammer, Div of Eaton Corp | PDG53K0800E5WN | - | 5.25 V | - | Microchip Technology | 3 V | - | - | 3 | Panel | - | 57 | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Active | Active | 40 | 1.55 | - | Yes | 3.6 V | 3 V | 3.3 V | - | - | 3.3, 5 V | - | 0 to 70 °C | - | MX | e3 | - | - | - | - | Matte Tin (Sn) | - | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | - | 245 | 0.65 mm | compliant | 800 A | R-PQFP-G100 | - | Not Qualified | - | - | COMMERCIAL | - | - | - | - | - | - | - | 295 CLBS, 3000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 3000 | - | - | STD | - | - | 2.7 ns | 295 | - | 3000 | - | - | - | - | - | - | - | - | 20 mm | 14 mm | - | ||
![]() AX250-2FGG256I Microchip | 2332 |
| - | - | - | Surface Mount | 256-LBGA | - | - | 256-FPBGA (17x17) | - | - | - | - | AX250 | - | - | - | - | - | - | - | Honeywell-Microswitch | AML25GBF2AA01GR | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | - | - | - | 138 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | 1.5000 V | - | -40 to 85 °C | - | Axcelerator | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 55296 | 250000 | - | 4224 | 2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |