- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
Attribute column
Manufacturer
Microchip Embedded - FPGAs (Field Programmable Gate Array)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rated | Operating Temperature | Series | Size / Dimension | Tolerance | JESD-609 Code | Number of Terminations | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | Additional Feature | HTS Code | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Lead Style | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Features | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Radiation Hardening | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 AGL030V5-QNG132 Microchip | In Stock | - | - | - | - | - | 0402 (1005 Metric) | - | - | 0402 | - | - | - | - | - | - | - | - | TE Connectivity Passive Product | - | - | - | - | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | -55°C ~ 155°C | CPF, Neohm | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.1% | - | 2 | ±25ppm/°C | 127 Ohms | - | - | - | Thin Film | - | 0.063W, 1/16W | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.014 (0.35mm) | - | - | - | - | - | ||
A1440A-2TQ176C Microchip | In Stock | - | - | - | - | Surface Mount, MLCC | 1206 (3216 Metric) | - | - | - | - | - | - | - | - | - | - | - | KYOCERA AVX | - | - | - | - | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | 100V | -55°C ~ 125°C | - | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | - | - | C0G, NP0 | - | - | - | - | - | General Purpose | - | - | - | 390 pF | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.037 (0.94mm) | - | - | ||
MPF050T-FCSG325T2 Microchip | In Stock | - | - | - | - | Surface Mount | 325-TFBGA | - | - | 325-BGA (11x11) | - | - | - | - | - | - | - | + 125 C | Microchip Technology | - 40 C | - | SMD/SMT | 164 | 48000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | 1.08 V | 970 mV | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.97V ~ 1.08V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 12.5 Gb/s | - | - | - | - | 48000 | 3774874 | - | - | - | - | - | 4 Transceiver | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MPF050T-1FCVG484I Microchip | 2077 |
| - | - | - | Surface Mount | 484-BFBGA | - | - | 484-FBGA (19x19) | - | - | - | - | - | - | - | + 100 C | Microchip Technology | - 40 C | - | SMD/SMT | 176 | 48000 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | 1.03 V/1.08 V | 970 mV/1.02 V | - | - | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.97V ~ 1.08V | - | - | - | - | - | - | - | - | - | 1 V, 1.05 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3774874 | - | - | - | 48000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
RT4G150-CQG352M Microchip | In Stock | - | - | - | - | Surface Mount | 352-BFCQFP Exposed Pad | - | - | 352-QFP (48x48) | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | -55°C ~ 125°C (TJ) | RTG4™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.14V ~ 1.26V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 151824 | 5325 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
AX2000-1FGG1152 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | 1152 | - | 400.011771 mg | 1152 | - | 763 MHz | MICROSEMI CORP | Microsemi Corporation | AX2000-1FGG1152 | - | - | - | 3 | - | 684 | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | - | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e1 | - | - | - | TIN SILVER COPPER | 70 °C | 0 °C | - | - | - | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | - | BOTTOM | BALL | 245 | 1 mm | compliant | 763 MHz | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | - | - | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 36 kB | - | 850 ps | 850 ps | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | - | 2e+06 | 763 MHz | - | 21504 | 1 | - | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | - | 1.73 mm | - | 35 mm | 35 mm | - | No | - | ||
A42MX36-1PQG240I Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 240 | - | - | 240 | - | 83 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX36-1PQG240I | - | - | - | 3 | - | 202 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | FQFP | FQFP, QFP240,1.3SQ,20 | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | 40 | 5.81 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | e3 | - | - | - | MATTE TIN | 85 °C | -40 °C | - | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | S-PQFP-G240 | 202 | Not Qualified | 5 V | - | - | 3.3,3.3/5,5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | - | - | - | - | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | - | 54000 | 151 MHz | - | 1184 | 1 | - | 1822 | 2.3 ns | 2438 | 2438 | 54000 | - | 3.4 mm | - | 32 mm | 32 mm | - | No | - | ||
M1A3P600L-1PQ208I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P600L-1PQ208I | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | 30 | 5.25 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | - | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | S-PQFP-G208 | 154 | Not Qualified | - | - | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | 600000 | - | - | - | 28 mm | 28 mm | - | - | - | ||
M1A3P1000L-PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P1000L-PQG208 | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | 40 | 5.27 | - | Yes | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | e3 | - | - | - | MATTE TIN | - | - | - | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | S-PQFP-G208 | 154 | Not Qualified | - | - | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 24576 | 24576 | 1000000 | - | - | - | 28 mm | 28 mm | - | - | - | ||
M1AGL600V2-FG484 Microchip | In Stock | - | - | Obsolete (Last Updated: 2 months ago) | Surface Mount | - | - | YES | - | - | 400.011771 mg | 484 | - | 108 MHz | MICROSEMI CORP | Microsemi Corporation | M1AGL600V2-FG484 | - | - | - | 3 | - | 235 | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | - | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.86 | Non-Compliant | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | - | - | OTHER | 1.575 V | 1.14 V | 13.5 kB | - | - | - | - | - | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | - | 600000 | - | - | - | - | - | - | - | 13824 | - | 600000 | - | 1.73 mm | - | 23 mm | 23 mm | - | - | - | ||
M1A3P400-2FGG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P400-2FGG484 | - | - | - | 3 | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 40 | 5.25 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | - | Not Qualified | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 9216 | - | 400000 | - | - | - | 23 mm | 23 mm | - | - | - | ||
M1A3P600L-FG256I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 256 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P600L-FG256I | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.25 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | - | - | - | 8542.39.00.01 | - | Field Programmable Gate Arrays | CMOS | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | 177 | Not Qualified | - | - | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | 600000 | - | - | - | 17 mm | 17 mm | - | - | - | ||
M1AFS250-1PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M1AFS250-1PQG208 | - | - | - | 3 | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | QFF | QFF, | - | RECTANGULAR | FLATPACK | Obsolete | - | 40 | 5.82 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e3 | - | - | - | MATTE TIN | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | QUAD | FLAT | 245 | 0.5 mm | compliant | - | R-PQFP-F208 | - | Not Qualified | - | - | - | - | OTHER | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 6144 | - | 250000 | - | - | - | 30.6 mm | 28 mm | - | - | - | ||
M7AFS600-2PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M7AFS600-2PQG208 | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | 40 | 5.8 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e3 | - | - | - | MATTE TIN | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 600000 | - | - | - | 28 mm | 28 mm | - | - | - | ||
M1AFS250-PQ208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M1AFS250-PQ208 | - | - | - | 3 | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | QFF | QFP-208 | - | RECTANGULAR | FLATPACK | Obsolete | - | 30 | 5.88 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | QUAD | FLAT | 225 | 0.5 mm | compliant | - | R-PQFP-F208 | - | Not Qualified | - | - | - | - | OTHER | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 6144 | - | 250000 | - | - | - | 30.6 mm | 28 mm | - | - | - | ||
M1A3P400-PQ208 Microchip | In Stock | - | - | - | - | Surface Mount | 208-BFQFP | YES | - | 208-PQFP (28x28) | - | 208 | M1A3P400 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P400-PQ208 | - | Microchip Technology | - | 3 | - | 151 | - | 85 °C | - | Tray | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | - | No | 1.575 V | 1.425 V | 1.5 V | - | 0°C ~ 85°C (TJ) | ProASIC3 | - | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 55296 | 400000 | - | - | - | - | - | - | - | 9216 | - | 400000 | - | - | - | 28 mm | 28 mm | - | - | - | ||
M1A3P400-2FG484 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 484 | - | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P400-2FG484 | - | - | - | 3 | - | - | - | 85 °C | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.25 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B484 | - | Not Qualified | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | 9216 | - | 400000 | - | - | - | 23 mm | 23 mm | - | - | - | ||
M1AFS600-2PQ208 Microchip | In Stock | - | - | - | Surface Mount | - | - | YES | 208 | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M1AFS600-2PQ208 | - | - | - | 3 | - | 95 | - | 85 °C | - | - | PLASTIC/EPOXY | QFF | QFF, | - | RECTANGULAR | FLATPACK | Obsolete | - | 30 | 5.88 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | QUAD | FLAT | 225 | 0.5 mm | compliant | - | R-PQFP-F208 | - | Not Qualified | 1.5 V | - | - | - | OTHER | 1.575 V | 1.425 V | 13.5 kB | - | - | - | - | - | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 600000 | 1.47059 GHz | - | - | 2 | - | 13824 | - | 13824 | - | 600000 | - | 3.4 mm | - | 28 mm | 28 mm | - | No | - | ||
M7AFS600-PQG208 Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | 208 | - | - | MICROSEMI CORP | Microsemi Corporation | M7AFS600-PQG208 | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | - | 40 | 5.8 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | e3 | - | - | - | MATTE TIN | - | - | - | - | - | - | 8542.39.00.01 | - | - | CMOS | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | COMMERCIAL | - | - | - | - | - | - | - | - | 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 600000 | - | - | - | 28 mm | 28 mm | - | - | - | ||
M2GL010-1TQ144I Microchip | In Stock | - | - | - | - | Surface Mount | 144-LQFP | YES | - | 144-TQFP (20x20) | - | 144 | - | - | MICROSEMI CORP | Microsemi Corporation | M2GL010-1TQ144I | - | Microchip Technology | - | 3 | - | 84 | - | - | - | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 20 | 5.57 | - | No | 1.26 V | 1.14 V | 1.2 V | - | -40°C ~ 100°C (TJ) | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | 1.14V ~ 2.625V | QUAD | GULL WING | 240 | 0.5 mm | compliant | - | S-PQFP-G144 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 20 mm | 20 mm | - | - | - |